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    Flip chip bonding method
    1.
    发明授权
    Flip chip bonding method 有权

    公开(公告)号：US10910339B2

    公开(公告)日：2021-02-02

    申请号：US16533450

    申请日：2019-08-06

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hwail Jin ,  Yongwon Choi ,  Myung-Sung Kang ,  Yeongseok Kim ,  Wonkeun Kim

    IPC: H01L23/00 ,  H01L21/78

    Abstract: A flip chip bonding method includes obtaining a die including a first substrate and an adhesive layer on the first substrate; bonding the die to a second substrate different from the first substrate; and curing the adhesive layer. The curing the adhesive layer includes heating the second substrate to melt the adhesive layer, and providing the adhesive layer and the second substrate with air having pressure greater than atmospheric pressure.

    Semiconductor device having stacked semiconductor chips and method for fabricating the same
    2.
    发明授权
    Semiconductor device having stacked semiconductor chips and method for fabricating the same 有权

    公开(公告)号：US10354985B2

    公开(公告)日：2019-07-16

    申请号：US15438184

    申请日：2017-02-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Won-Gi Chang ,  Dongwon Lee ,  Myung-Sung Kang ,  Hyein Yoo

    IPC: H01L21/56 ,  H01L25/00 ,  H01L21/78 ,  H01L23/00 ,  H01L25/065

    Abstract: A method for manufacturing a semiconductor device includes stacking, on a package substrate, first semiconductor chips. Each of the first semiconductor chips includes a first adhesive film. The method includes stacking, respectively on the first semiconductor chips, second semiconductor chips. Each of the second semiconductor chips includes a second adhesive film. The method includes compressing the first and second adhesive films to form an adhesive structure. The adhesive structure includes an extension disposed on sidewalls of the first and second semiconductor chips. The method includes removing the extension. The method includes forming a first molding layer substantially covering the first and second semiconductor chips. The method includes performing a cutting process on the package substrate between the first and second semiconductor chips to form a plurality of semiconductor packages each including at least one of the first semiconductor chips and at least one of the second semiconductor chips.

    Bi-directional camera module and flip chip bonder including the same
    4.
    发明授权
    Bi-directional camera module and flip chip bonder including the same 有权
    双向相机模块和倒装芯片连接器包括相同

    公开(公告)号：US08958011B2

    公开(公告)日：2015-02-17

    申请号：US13828618

    申请日：2013-03-14

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sang-Sick Park ,  Myung-Sung Kang ,  Ji-Seok Hong

    IPC: H04N5/225 ,  H04N5/232 ,  G03B13/00 ,  H04N9/04 ,  H01J7/24 ,  H01J40/14 ,  H01L31/0232 ,  H01L31/0203 ,  H01L21/00 ,  H01L31/00 ,  H01L27/146

    CPC classification number: H04N5/2251 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H04N5/2257 ,  Y10T29/53178 ,  H01L2924/00

    Abstract: Bi-directional camera modules and flip chip bonders including the same are provided. The module includes a circuit board on which an upper sensor and a lower sensor are mounted, an upper lens and a lower lens disposed on the upper sensor and under the lower sensor, respectively, and a housing fixing the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively. The housing surrounds the circuit board. The housing has a plurality of inlets and an outlet through which air flows, and the housing has an air passage connected from the inlets to the outlet via a space between lower lens and the lower sensor.

    Abstract translation: 提供了包括其的双向相机模块和倒装芯片接合器。 模块包括分别安装有上传感器和下传感器的电路板，分别设置在上传感器和下传感器下的上透镜和下透镜，以及固定上透镜和下透镜间隔开的壳体 分别是上传感器和下传感器。 外壳围绕电路板。 壳体具有多个入口和空气流过的出口，并且壳体具有通过下透镜和下传感器之间的空间从入口连接到出口的空气通道。

    SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD FOR FABRICATING THE SAME
    5.
    发明申请
    SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD FOR FABRICATING THE SAME 审中-公开

    公开(公告)号：US20190273075A1

    公开(公告)日：2019-09-05

    申请号：US16417934

    申请日：2019-05-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Won-Gi Chang ,  Dongwon Lee ,  Myung-Sung Kang ,  Hyein Yoo

    IPC: H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56

    Abstract: A method for manufacturing a semiconductor device includes stacking, on a package substrate, first semiconductor chips. Each of the first semiconductor chips includes a first adhesive film. The method includes stacking, respectively on the first semiconductor chips, second semiconductor chips. Each of the second semiconductor chips includes a second adhesive film. The method includes compressing the first and second adhesive films to form an adhesive structure. The adhesive structure includes an extension disposed on sidewalls of the first and second semiconductor chips. The method includes removing the extension. The method includes forming a first molding layer substantially covering the first and second semiconductor chips. The method includes performing a cutting process on the package substrate between the first and second semiconductor chips to form a plurality of semiconductor packages each including at least one of the first semiconductor chips and at least one of the second semiconductor chips.

    Semiconductor device having stacked semiconductor chips and method for fabricating the same
    7.
    发明授权
    Semiconductor device having stacked semiconductor chips and method for fabricating the same 有权

    公开(公告)号：US10923465B2

    公开(公告)日：2021-02-16

    申请号：US16417934

    申请日：2019-05-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Won-Gi Chang ,  Dongwon Lee ,  Myung-Sung Kang ,  Hyein Yoo

    IPC: H01L25/00 ,  H01L21/683 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L21/78 ,  H01L25/065

    Abstract: A method for manufacturing a semiconductor device includes stacking, on a package substrate, first semiconductor chips. Each of the first semiconductor chips includes a first adhesive film. The method includes stacking, respectively on the first semiconductor chips, second semiconductor chips. Each of the second semiconductor chips includes a second adhesive film. The method includes compressing the first and second adhesive films to form an adhesive structure. The adhesive structure includes an extension disposed on sidewalls of the first and second semiconductor chips. The method includes removing the extension. The method includes forming a first molding layer substantially covering the first and second semiconductor chips. The method includes performing a cutting process on the package substrate between the first and second semiconductor chips to form a plurality of semiconductor packages each including at least one of the first semiconductor chips and at least one of the second semiconductor chips.

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