Abstract:
An electronic device is provided. The electronic device includes a battery, a power management integrated circuit (PMIC), that is electrically connected to the battery, adjusts at least part of power received from the battery, and outputs a controlled power, a processor electrically connected to the PMIC, at least one power sensor that is one of electrically connected between the battery and the PMIC and constitutes a part of the PMIC, and a control circuit electrically connected to the at least one power sensor. The control circuit acquires at least one of a current value and a power value input into the PMIC from the battery, determines whether at least one of the acquired current value and power value is greater than or equal to a threshold, and generates a first signal for controlling at least one of the PMIC and the processor, at least partially based on the determination.
Abstract:
A semiconductor device is provided. The semiconductor device includes a first hard macro; a second hard macro spaced apart from the first hard macro in a first direction by a first distance; a head cell disposed in a standard cell area between the first hard macro and the second hard macro, the head cell being configured to perform power gating of a power supply voltage provided to one from among the first hard macro and the second hard macro; a plurality of first ending cells disposed in the standard cell area adjacent to the first hard macro; and a plurality of second ending cells disposed in the standard cell area adjacent to the second hard macro, the head cell not overlapping the plurality of first ending cells and the plurality of second ending cells.
Abstract:
An electronic device is provided. The electronic device includes a battery, a power management integrated circuit (PMIC), that is electrically connected to the battery, adjusts at least part of power received from the battery, and outputs a controlled power, a processor electrically connected to the PMIC, at least one power sensor that is one of electrically connected between the battery and the PMIC and constitutes a part of the PMIC, and a control circuit electrically connected to the at least one power sensor. The control circuit acquires at least one of a current value and a power value input into the PMIC from the battery, determines whether at least one of the acquired current value and power value is greater than or equal to a threshold, and generates a first signal for controlling at least one of the PMIC and the processor, at least partially based on the determination.
Abstract:
Provided are semiconductor circuits. A semiconductor circuit includes: a first circuit configured to propagate a value of a first node to a second node based on a voltage level of a clock signal; a second circuit configured to propagate a value of the second node to a third node based on the voltage level of the clock signal; and a third circuit configured to determine a value of the third node based on a voltage level of the second node and the voltage level of the clock signal, wherein the first circuit comprises a first transistor gated to a voltage level of the first node, a second transistor connected in series with the first transistor and gated to the voltage level of the third node, and a third transistor connected in parallel with the first and second transistors and gated to a voltage level of the clock signal to provide the value of the first node to the second node.
Abstract:
A method and apparatus for determining a control temperature to control a function of an electronic device by using an atmospheric temperature when controlling a temperature of the electronic device, and for controlling the function of the electronic device according to a control step of the determined control temperature are provided. A method of operating an electronic device includes measuring an atmospheric temperature, determining at least one control temperature corresponding to the measured atmospheric temperature, measuring an internal temperature of the electronic device, and controlling a function in accordance with the measured internal temperature of the electronic device and the determined at least one control temperature.
Abstract:
An integrated circuit includes a semiconductor substrate, first through third power rails, and first through fourth clock gate lines. The first power rail through third power rails are formed above the semiconductor substrate, and extend in a first direction and arranged sequentially in a second direction perpendicular to the first direction. The first through fourth clock gate lines are formed above the semiconductor substrate, and extend in the second direction to pass through a first region between the first power rail and the second power rail and a second region between the second power rail and the third power rail. The first clock gate line and the second clock gate line are arranged to be adjacent to each other in the first direction, and the third clock gate line and the fourth clock gate line are arranged to be adjacent to each other in the first direction.
Abstract:
A semiconductor device is provided. The semiconductor device includes a first hard macro; a second hard macro spaced apart from the first hard macro in a first direction by a first distance; a head cell disposed in a standard cell area between the first hard macro and the second hard macro, the head cell being configured to perform power gating of a power supply voltage provided to one from among the first hard macro and the second hard macro; a plurality of first ending cells disposed in the standard cell area adjacent to the first hard macro; and a plurality of second ending cells disposed in the standard cell area adjacent to the second hard macro, the head cell not overlapping the plurality of first ending cells and the plurality of second ending cells.
Abstract:
A sequential circuit includes a first gate circuit, a second gate circuit and an output circuit. The first circuit generates a first signal based on an input signal, an input clock signal and a second signal. The second circuit generates an internal clock signal by performing a NOR operation on the first signal and an inversion clock signal which is inverted from the input clock signal, and generates the second signal based on the internal clock signal and the input signal. The output circuit generates an output signal based on the second signal. Operation speed of the sequential circuit and the integrated circuit including the same may be increased by increasing the negative setup time reflecting a transition of the input signal after a transition of the input clock signal, through mutual controls between the first circuit and the second circuit.
Abstract:
Provided are a semiconductor device and a method for operating a semiconductor device. The semiconductor device includes a clock generating unit receiving a reference clock and generating first and second clocks that are different from each other from the reference clock; a first latch configured to receive input data based on the first clock and to output the input data as first output data; and a second latch configured to receive the first output data based on the second clock and to output the first output data as second output data, wherein a first edge of the first clock does not overlap a first edge of the second clock, and at least a part of a second edge of the first clock overlaps a second edge of the second clock.
Abstract:
An integrated circuit includes a semiconductor substrate, first through third power rails, first through third selection gate lines, and a row connection wiring. The first through third power rails on the semiconductor substrate extend in a first direction and arranged sequentially in a second direction perpendicular to the first direction. The first through third selection gate lines on the semiconductor substrate extend in the second direction over a first region between the first power rail and the second power rail and a second region between the second power rail and the third power rail, and are arranged sequentially in the first direction. The row connection wiring on the semiconductor substrate extends in the first direction to connect the first selection gate line and the third selection gate line.