公开(公告)号：US20240035159A1

公开(公告)日：2024-02-01

申请号：US18223606

申请日：2023-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungrim KIM ,  Youngeun KIM ,  Youngjun KIM ,  Jihoon KIM ,  Taekjung KIM ,  Dongju CHANG

IPC: C23C16/455 ,  C23C16/448

CPC classification number: C23C16/45561 ,  C23C16/448 ,  C23C16/45589

Abstract: A precursor supply system includes a storage tank storing the precursor in a solid state; a transfer pipe connected to the storage tank to transfer the precursor in a solid state; a phase converter connected to the transfer pipe and sublimating the transported solid-state precursor into vapor; a supply pipe connected to the phase converter and transporting a precursor in a vaporous state; and a process chamber disposed adjacently to the phase converter and connected to the supply pipe.

公开(公告)号：US20180273816A1

公开(公告)日：2018-09-27

申请号：US15933630

申请日：2018-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minchul LEE ,  Namil KOO ,  Kyungrim KIM ,  Sun-Woo PARK ,  Yongin PARK ,  Min-Woo LEE ,  Wonhee CHOE ,  Hun Rae KIM ,  Dong-Sel KIM ,  Zeeyoung LEE

IPC: C09J183/10 ,  C09J133/06 ,  C08J3/24 ,  C08F20/18 ,  H01L21/02 ,  C08K3/36

CPC classification number: C09J183/10 ,  C08F20/18 ,  C08F220/18 ,  C08F2500/01 ,  C08J3/246 ,  C08K3/36 ,  C09J133/06 ,  C09J133/08 ,  H01L21/02118 ,  C08F2220/1825 ,  C08F2220/1858 ,  C08F2220/1875 ,  C08F220/20 ,  C08L83/06

Abstract: Provided are a composition for adhesion, a stacked structure including the same, and an electronic device including the same. The composition for adhesion may include an acrylic resin and a silane compound. The acrylic resin may have a weight average molecular weight of about 100,000 g/mol to about 200,000 g/mol, and may include a polymerization unit derived from a monomer represented by Formula A1 and a polymerization unit derived from a monomer represented by Formula A2. The silane compound may have a weight average molecular weight of about 300 g/mol to about 2,000 g/mol, and a polymerization unit derived from a monomer represented by Formula B.

公开(公告)号：US20240124972A1

公开(公告)日：2024-04-18

申请号：US18133909

申请日：2023-04-12

Applicant: SAMSUNG ELECTRONICS Co., LTD.

Inventor： Kyungrim KIM ,  Dowon KIM ,  Sunja KIM ,  Youngeun KIM

IPC: C23C16/448 ,  C23C16/455 ,  C23C16/52

CPC classification number: C23C16/4481 ,  C23C16/45527 ,  C23C16/45544 ,  C23C16/45553 ,  C23C16/52

Abstract: A canister supplying a precursor to a processing chamber includes a body, a first valve introducing a carrier gas into the body, a second valve discharging a sublimated gas of a solid precursor into a processing chamber, a precursor accommodating tray accommodating the solid precursor, and at least one piezoelectric transducer at least one of vibrating the precursor accommodating tray or measuring a resonance frequency.