公开(公告)号：US20210341396A1

公开(公告)日：2021-11-04

申请号：US17116708

申请日：2020-12-09

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Sungha KIM ,  Hyounggon KIM ,  Doohyun CHO ,  Kwangsung LEE ,  Jongsu KIM ,  Taejoong KIM ,  Jeongsu HA

IPC: G01N21/95 ,  G01B11/06

Abstract: A thickness estimating apparatus includes a transfer robot, a light source, a camera, a memory and a controller. The memory stores a thickness predicting model generated based on a data set including a thickness of at least one of a test wafer corresponding to the wafer or a test element layer formed on the test wafer, and the thickness predicting model being trained to minimize a loss function of the data set. The controller applies pixel data, which is acquired from at least one pixel selected from a plurality of pixels included in a captured image, to the thickness predicting model, to predict a thickness of at least one of the wafer or an element layer formed on the wafer in a position corresponding to a position of the selected pixel.

公开(公告)号：US20230166299A1

公开(公告)日：2023-06-01

申请号：US17870340

申请日：2022-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongsu KIM ,  Johnho KUK ,  Sunil PARK ,  Kwangsung LEE ,  Yoichiro IWA ,  Sewon JEON ,  Youngho JUNG

IPC: B08B3/02 ,  B24B37/005

CPC classification number: B08B3/02 ,  B24B37/0053

Abstract: A wafer polishing apparatus includes a base support; a polishing pad on the base support; a polishing head on an upper portion of the base support and configured to rotate; a polishing head support on the upper portion of the base support and connected to the polishing head, a retainer ring attached to a lower portion of the polishing head; an illumination device configured to provide light to at least a part of an inner surface of the retainer ring; and a camera device configured to capture an image of at least a part of the inner surface of the retainer ring while the polishing head rotates. The polishing head support may be configured to rotate on the base support such that the polishing head is on at least one of a treatment region or a maintenance region of the base support.

公开(公告)号：US20170291278A1

公开(公告)日：2017-10-12

申请号：US15413845

申请日：2017-01-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwangsung LEE ,  Ki-Roo Shin ,  Kwangchun Kim ,  Yeonjun Lim ,  Junghun Cho ,  Sangkyeong Han

IPC: B24B49/12 ,  G01B11/24 ,  G01B11/22 ,  B24B37/04 ,  B24B53/017

CPC classification number: B24B49/12 ,  B24B37/04 ,  B24B53/017 ,  G01B11/22 ,  G01B11/24

Abstract: Example embodiments of the inventive concepts provide a polishing pad-measuring apparatus and a chemical mechanical polishing facility using the same. The polishing pad-measuring apparatus includes a foreign material-removing part for removing a foreign material disposed in grooves extending from one surface of a polishing pad toward another surface, opposite to the one surface, of the polishing pad, and a distance measuring part for measuring depths of the grooves from which the foreign material is removed.