公开(公告)号：US20170291278A1

公开(公告)日：2017-10-12

申请号：US15413845

申请日：2017-01-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwangsung LEE ,  Ki-Roo Shin ,  Kwangchun Kim ,  Yeonjun Lim ,  Junghun Cho ,  Sangkyeong Han

IPC: B24B49/12 ,  G01B11/24 ,  G01B11/22 ,  B24B37/04 ,  B24B53/017

CPC classification number: B24B49/12 ,  B24B37/04 ,  B24B53/017 ,  G01B11/22 ,  G01B11/24

Abstract: Example embodiments of the inventive concepts provide a polishing pad-measuring apparatus and a chemical mechanical polishing facility using the same. The polishing pad-measuring apparatus includes a foreign material-removing part for removing a foreign material disposed in grooves extending from one surface of a polishing pad toward another surface, opposite to the one surface, of the polishing pad, and a distance measuring part for measuring depths of the grooves from which the foreign material is removed.