公开(公告)号：US20230166299A1

公开(公告)日：2023-06-01

申请号：US17870340

申请日：2022-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongsu KIM ,  Johnho KUK ,  Sunil PARK ,  Kwangsung LEE ,  Yoichiro IWA ,  Sewon JEON ,  Youngho JUNG

IPC: B08B3/02 ,  B24B37/005

CPC classification number: B08B3/02 ,  B24B37/0053

Abstract: A wafer polishing apparatus includes a base support; a polishing pad on the base support; a polishing head on an upper portion of the base support and configured to rotate; a polishing head support on the upper portion of the base support and connected to the polishing head, a retainer ring attached to a lower portion of the polishing head; an illumination device configured to provide light to at least a part of an inner surface of the retainer ring; and a camera device configured to capture an image of at least a part of the inner surface of the retainer ring while the polishing head rotates. The polishing head support may be configured to rotate on the base support such that the polishing head is on at least one of a treatment region or a maintenance region of the base support.