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公开(公告)号:US20170358553A1
公开(公告)日:2017-12-14
申请号:US15413824
申请日:2017-01-24
Applicant: Samsung Electronics Co. Ltd.
Inventor: TAE-YEONG KIM , Pil-kyu KANG , Seok-ho KIM , Kwang-jin MOON , Ho-jin LEE
IPC: H01L23/00
CPC classification number: H01L24/94 , H01L24/02 , H01L24/05 , H01L24/29 , H01L24/80 , H01L24/83 , H01L24/92 , H01L2224/02215 , H01L2224/04105 , H01L2224/05147 , H01L2224/29187 , H01L2224/29188 , H01L2224/8012 , H01L2224/8312 , H01L2224/83896 , H01L2224/9211 , H01L2224/94 , H01L2924/0537 , H01L2924/05432 , H01L2924/05442 , H01L2924/0549 , H01L2924/365 , H01L2224/80
Abstract: A wafer-to-wafer bonding structure includes a first wafer including a first conductive pad in a first insulating layer and a first barrier layer surrounding a lower surface and side surfaces of the first conductive pad, a second wafer including a second conductive pad in a second insulating layer and a second barrier layer surrounding a lower surface and side surfaces of the second conductive pad, the second insulating layer being bonded to the first insulating layer, and at least a portion of an upper surface of the second conductive pad being partially or entirely bonded to at least a portion of an upper surface of the first conductive pad, and a third barrier layer between portions of the first and second wafers where the first and second conductive pads are not bonded to each other.
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公开(公告)号:US20200027784A1
公开(公告)日:2020-01-23
申请号:US16242122
申请日:2019-01-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Su-jeong PARK , Dong-chan LIM , Kwang-jin MOON , Ju-bin SEO , Ju-ll CHOI , Atsushi FUJISAKI
IPC: H01L21/768
Abstract: An integrated circuit device includes a substrate, a landing pad on the substrate, and a through-via structure passing through the substrate and connected to the landing pad. The through-via structure may include a conductive plug, a first conductive barrier layer covering a sidewall and a lower surface of the conductive plug, and a second conductive barrier layer covering a sidewall of the first conductive barrier layer.
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