公开(公告)号：US08901727B2

公开(公告)日：2014-12-02

申请号：US13774209

申请日：2013-02-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myun-sung Kang ,  Jung-min Ko ,  Sang-sick Park ,  Won-keun Kim ,  Ji-seok Hong

IPC: H01L25/10 ,  H01L23/28 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/28 ,  H01L21/486 ,  H01L21/563 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03009 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/1017 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A semiconductor package comprises a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a third semiconductor chip on the second semiconductor chip and a fourth semiconductor chip on the third semiconductor chip. A first underfill layer is positioned between the second semiconductor chip and the first semiconductor chip; a second underfill layer is positioned between the third semiconductor chip and the second semiconductor chip, and a third underfill layer is positioned between the fourth semiconductor chip and the third semiconductor chip. In some embodiments, the second underfill layer comprises a material that is different than the first and third underfill layers.

Abstract translation: 半导体封装包括第一半导体芯片，第一半导体芯片上的第二半导体芯片，第二半导体芯片上的第三半导体芯片和第三半导体芯片上的第四半导体芯片。 第一底部填充层位于第二半导体芯片和第一半导体芯片之间; 第二底部填充层位于第三半导体芯片和第二半导体芯片之间，第三底层填充层位于第四半导体芯片和第三半导体芯片之间。 在一些实施例中，第二底部填充层包括不同于第一和第三底部填充层的材料。