公开(公告)号：US09633419B2

公开(公告)日：2017-04-25

申请号：US14605173

申请日：2015-01-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung-Joon Baek ,  Joon-Ki Paik ,  Tae-Chan Kim ,  Dong-Gyun Kim ,  Jin-Ho Park

IPC: H04N5/225 ,  G06T5/00 ,  G06K9/46 ,  G06K9/52 ,  H04N5/357 ,  G06T5/20

CPC classification number: H04N5/3572 ,  G06K9/46 ,  G06K9/522 ,  G06K2009/4666 ,  G06T5/003 ,  G06T5/006 ,  G06T5/20 ,  H04N5/2173

Abstract: A lens distortion correction device and an application processor having the same include a distortion correction unit configured to correct a distorted image into an undistorted image and an image enhancement unit configured to improve the undistorted image using a high-frequency component of the distorted image.

公开(公告)号：US09986183B2

公开(公告)日：2018-05-29

申请号：US15405613

申请日：2017-01-13

Applicant: Samsung Electronics Co., LTD.

Inventor： Byung-Joon Baek ,  Joon-Ki Paik ,  Tae-Chan Kim ,  Dong-Gyun Kim ,  Jin-Ho Park

IPC: H04N5/217 ,  H04N5/357 ,  G06T5/00 ,  G06K9/52 ,  G06T5/20

CPC classification number: H04N5/3572 ,  G06K9/46 ,  G06K9/522 ,  G06K2009/4666 ,  G06T5/003 ,  G06T5/006 ,  G06T5/20 ,  H04N5/2173

Abstract: A lens distortion correction device and an application processor having the same include a distortion correction unit configured to correct a distorted image into an undistorted image and an image enhancement unit configured to improve the undistorted image using a high-frequency component of the distorted image.

公开(公告)号：US20140199810A1

公开(公告)日：2014-07-17

申请号：US14153545

申请日：2014-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-Ho Park ,  Pil-Kyu Kang ,  Tae-Yeong Kim ,  Byung-Lyul Park ,  Jum-Yong Park ,  Kyu-Ha Lee ,  Deok-Young Jung ,  Gil-Heyun Choi

IPC: H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/06181 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

Abstract: A fabricating method for a semiconductor device is provided. The fabricating method includes providing a first wafer, forming a sacrificial layer on the first wafer, forming a release layer on the sacrificial layer, forming an adhesive layer on the release layer, and placing a second wafer on the adhesive layer and bonding the first wafer to the second wafer.

Abstract translation: 提供了一种用于半导体器件的制造方法。 制造方法包括提供第一晶片，在第一晶片上形成牺牲层，在牺牲层上形成剥离层，在剥离层上形成粘合剂层，将第二晶片放置在粘合剂层上，并将第一晶片 到第二晶片。