公开(公告)号：US20240034932A1

公开(公告)日：2024-02-01

申请号：US17815317

申请日：2022-07-27

Applicant: Dongwoo Fine-Chem Co., Ltd. ,  Samsung Electronics CO., LTD

Inventor： Jin-Kyu Roh ,  Ji-Won Kim ,  Kyu-Sang Ahn

IPC: C09K13/00 ,  H01L21/306

CPC classification number: C09K13/00 ,  H01L21/30604

Abstract: An etchant composition contains (A) an alkaline compound, (B) an organoaluminum, and (C) water. The composition may be used in a method of forming a pattern. The composition also may be used in a method of fabricating an array substrate.

公开(公告)号：US20230272279A1

公开(公告)日：2023-08-31

申请号：US18176215

申请日：2023-02-28

Applicant: DONGWOO FINE-CHEM CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD

Inventor： Ji-Won Kim ,  Jin-Kyu Roh ,  Hyo-Joong Yoon ,  Han-Woo Park ,  Min-Jae Sung ,  Soo-Jin Kim ,  Jung-Min Oh ,  Sang-Won Bae

IPC: C09K13/06

CPC classification number: C09K13/06 ,  H01L21/32134

Abstract: Disclosed is a ruthenium etchant composition containing periodic acid and ammonium ions and having a pH of 6 to 7.5. Further disclosed are a pattern formation method including a step of etching a ruthenium metal film using the etchant composition, a method of manufacturing a display device array substrate by employing the pattern formation method, and a display device array substrate manufactured by the method.

公开(公告)号：US11233422B2

公开(公告)日：2022-01-25

申请号：US16640017

申请日：2018-04-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mincheol Ha ,  Dongzo Kim ,  Ji-Won Kim ,  Jae-Wan Park ,  Chang-Hak O ,  Jongchul Hong ,  Yong Sang Yun

IPC: H02J50/00 ,  H02J50/80 ,  H02J50/12

Abstract: According to various embodiments, provided is an electronic device, which comprises a housing and a relay circuit located inside the housing and is capable of receiving and/or retransmitting an electromagnetic field of an external electronic device, wherein the relay circuit is configured to form a resonant frequency higher than that of an operating frequency range of the electromagnetic field transmitted by the external electronic device. Additional various embodiments are possible.

公开(公告)号：US10211947B2

公开(公告)日：2019-02-19

申请号：US15797495

申请日：2017-10-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Won Kim

IPC: H04L1/00 ,  H04L25/02 ,  G06N99/00 ,  G06F13/00 ,  G06F1/26

Abstract: Inventive concepts relates to a system-on-chip using a dynamic voltage frequency scaling and a method of operating the same. The method of operating the system-on-chip may include learning a correlation between network throughput of a network input/output device receiving data packets and processing performance of a central processing unit processing the data packets, estimating a data transmission rate of the data packets based on a learning result of the correlation, dynamically changing setting information of a dynamic voltage frequency scaling algorithm based on the estimated data transmission rate, and controlling an operation frequency of the central processing unit according to the dynamic voltage frequency scaling algorithm. According to example embodiments of inventive concepts, the dynamic voltage frequency scaling algorithm may dynamically be applied considering the data transmission rate of the data packets being received.

公开(公告)号：US10978915B2

公开(公告)日：2021-04-13

申请号：US16489012

申请日：2018-02-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Seob Kim ,  Dong-Zo Kim ,  Ji-Won Kim ,  Keum-Su Song ,  Min-Cheol Ha ,  Jong-Chul Hong ,  Se-Hyun Cho

IPC: H02J50/12 ,  H02J7/02 ,  H02M7/58

Abstract: A wireless power transmission apparatus according to various embodiments of the present invention may comprise: a power provision circuit for providing direct current (DC) power; a first conductive pattern; a second conductive pattern; multiple first switches connected to one end of the first conductive pattern and one end of the second conductive pattern; multiple second switches connected to the other end of the first conductive pattern; multiple third switches connected to the other end of the second conductive pattern; and a control circuit, wherein the control circuit controls the multiple first switches and the multiple second switches to convert the DC power into first alternating current (AC) power and apply the first AC power to the first conductive pattern and control the multiple first switches and the multiple third switches to convert the DC power into second AC power and apply the second AC power to the second conductive pattern. Various other embodiments are possible.

公开(公告)号：US10411327B2

公开(公告)日：2019-09-10

申请号：US15056638

申请日：2016-02-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Won Kim ,  Jinu Kim ,  Hui-Won Cho

IPC: H01Q1/24 ,  H01Q1/38

Abstract: An electronic device and an antenna device are provided herein. An electronic device includes a conductive sidewall; a conductive structure located within a space formed by the conductive sidewall and extending from the conductive sidewall, wherein the conductive structure includes a first surface directed toward a front of the portable electronic device and a second surface directed toward a back of the portable electronic device; a non-conductive structure located within the space formed by the conductive sidewall and contacting the conductive structure, wherein the non-conductive structure includes a first surface directed toward the front of the portable electronic device and a second surface directed toward the back of the portable electronic device; an antenna pattern electrically connected to the conductive structure; and a flexible conductive connector electrically connected to the conductive structure and the antenna pattern. The antenna pattern extends on a portion of the first surface of the conductive structure and on a portion of the first surface of the non-conductive structure, or extends on a portion of the second surface of the conductive structure and on a portion of the second surface of the non-conductive structure.

公开(公告)号：US11456236B2

公开(公告)日：2022-09-27

申请号：US16722418

申请日：2019-12-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woo-Sung Yang ,  Joon-Sung Lim ,  Sung-Min Hwang ,  Ji-Young Kim ,  Ji-Won Kim

IPC: H01L23/48 ,  H01L27/11582 ,  H01L27/11575

Abstract: A vertical semiconductor device including a plurality of vertical memory cells on an upper surface of a first substrate, an adhesive layer on a lower surface of the first substrate that is opposite to the upper surface of the first substrate, a second substrate having first peripheral circuits thereon, a lower insulating interlayer on the second substrate, and a plurality of wiring structures electrically connecting the vertical memory cells and the first peripheral circuits. A lower surface of the adhesive layer and an upper surface of the lower insulating interlayer may be in contact with each other.

公开(公告)号：US10725845B2

公开(公告)日：2020-07-28

申请号：US15683181

申请日：2017-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyu-Dong Lee ,  Baek-Kyu Choi ,  Ji-Won Kim

IPC: G06F11/00 ,  G06F11/07 ,  G06F12/14 ,  G06F21/57 ,  G06F12/06 ,  G06F12/02 ,  G06F21/79

Abstract: A method of operating a memory system includes setting a secured area in a volatile memory device of the memory system during a secure mode, writing secure data in the secured area during the secure mode, and when a write command for the secured area is inputted in a normal operation mode, preventing a write operation from occurring and generating an error signal. Accordingly, the secured area is set in the volatile memory device so that the hacking and the data forgery may be prevented.