INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    集成电路装置及其制造方法

    公开(公告)号:US20170040328A1

    公开(公告)日:2017-02-09

    申请号:US15333491

    申请日:2016-10-25

    Abstract: A method includes providing a plurality of active regions on a substrate, and at least a first device isolation layer between two of the plurality of active regions, wherein the plurality of active regions extend in a first direction; providing a gate layer extending in a second direction, the gate layer forming a plurality of gate lines including a first gate line and a second gate line extending in a straight line with respect to each other and having a space therebetween, each of the first gate line and second gate line crossing at least one of the active regions, providing an insulation layer covering the first device isolation layer and covering the active region around each of the first and second gate lines; and providing an inter-gate insulation region in the space between the first gate line and the second gate line.

    Abstract translation: 一种方法包括在衬底上提供多个有源区,以及在所述多个有源区中的两个之间的至少第一器件隔离层,其中所述多个有源区在第一方向上延伸; 提供沿第二方向延伸的栅极层,所述栅极层形成多条栅极线,所述栅极线包括相对于彼此以直线延伸的第一栅极线和第二栅极线,所述第二栅极线和第二栅极线之间具有间隔,所述第一栅极 线和第二栅极线交叉有效区域中的至少一个,提供覆盖第一器件隔离层并围绕第一和第二栅极线周围的有源区域覆盖的绝缘层; 以及在所述第一栅极线和所述第二栅极线之间的空间中提供栅极间绝缘区域。

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