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公开(公告)号：US20200205726A1
公开(公告)日：2020-07-02
申请号：US16614472
申请日：2018-04-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Wonkyu LEE , Hwan SHIM , Hyunsu KIM , Seounghun KIM , Taeho KIM , Sun-Kee LEE
Abstract: An electronic device according to various embodiments comprises: a bio-signal detection sensor configured to acquire first and second biometric information on an object outside the electronic device; and a processor, wherein the processor can be configured to: acquire the first and second biometric information by using the bio-signal detection sensor; configure a first variance, in which the first biometric information is changed, and a second variance, in which the second biometric information is changed; determining a state of the object related to the sleep on the basis of at least a part of the first variance and the second variance; and estimate a sleep latency related to the object on the basis of at least a part of the state.
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公开(公告)号：US20170033004A1
公开(公告)日：2017-02-02
申请号：US15176187
申请日：2016-06-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yong Kong SIEW , Hyunsu KIM
IPC: H01L21/768
CPC classification number: H01L21/76871 , H01L21/76802 , H01L21/7682 , H01L21/76832 , H01L21/76834 , H01L21/76858 , H01L21/76865 , H01L21/76877 , H01L21/76885 , H01L21/76897 , H01L23/53238 , H01L23/53295
Abstract: A method of fabricating a semiconductor device, the method including forming at least one interconnection structure that includes a metal interconnection and a first insulating pattern sequentially stacked on a substrate; forming barrier patterns covering sidewalls of the interconnection structure; forming second insulating patterns at sides of the interconnection structure, the second insulating patterns being spaced apart from the interconnection structure with the barrier patterns interposed therebetween; forming a via hole in the first insulating pattern by etching a portion of the first insulating pattern, the via hole exposing a top surface of the metal interconnection and sidewalls of the barrier patterns; and forming a via in the via hole.
Abstract translation: 一种制造半导体器件的方法，所述方法包括形成至少一个互连结构，所述至少一个互连结构包括依次层叠在基板上的金属互连和第一绝缘图案; 形成覆盖所述互连结构的侧壁的阻挡图案; 在所述互连结构的侧面形成第二绝缘图案，所述第二绝缘图案与所述互连结构间隔开，其间插入所述阻挡图案; 通过蚀刻第一绝缘图案的一部分，在第一绝缘图案中形成通孔，所述通孔暴露金属互连的顶表面和阻挡图案的侧壁; 以及在所述通孔中形成通孔。
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公开(公告)号：US20230163635A1
公开(公告)日：2023-05-25
申请号：US17982855
申请日：2022-11-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunsu KIM , Inyeong JANG , Donghyuk CHOI , Sungwoo MOON , Youso CHEON
Abstract: A wireless power transmission device includes a converter circuit configured to generate a test signal having a test frequency based on an input current generated from a power source, a resonant tank configured to transmit wireless power in response to the test signal, a current sensing circuit configured to sense the input current when the wireless power is transmitted, and a controller configured to control the converter circuit to generate a test signal, calculate a quality factor of the resonant tank based on the sensed input current, reset the test frequency according to a comparison result between the quality factor and a stored reference quality factor, and control the converter circuit to reset the test frequency or transmit a digital ping signal to the wireless power reception device according to a result of comparing the quality factor with the stored reference quality factor.
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Patent Agency Ranking
公开(公告)号：US20210104615A1
公开(公告)日：2021-04-08
申请号：US16893795
申请日：2020-06-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunsu KIM , Seonghun PARK , Sunjung LEE , Hun KIM , Namgil YOU
IPC: H01L29/49 , H01L23/532 , G11C5/02
Abstract: A semiconductor device includes a peripheral circuit region comprising a first substrate, circuit elements on the first substrate, a first insulating layer covering the circuit elements, and a contact plug passing through the first insulating layer and disposed to be connected to the first substrate; and a memory cell region comprising a second substrate, gate electrodes on the second substrate and stacked in a vertical direction, and channel structures passing through the gate electrodes, wherein the contact plug comprises a metal silicide layer disposed to contact the first substrate and having a first thickness, a first metal nitride layer on the metal silicide layer to contact the metal silicide layer and having a second thickness, greater than the first thickness, a second metal nitride layer on the first metal nitride layer, and a conductive layer on the second metal nitride layer.
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公开(公告)号：US20230122804A1
公开(公告)日：2023-04-20
申请号：US17837260
申请日：2022-06-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunsu KIM
IPC: H01L25/065 , H01L23/498 , H01L23/31 , H01L23/00
Abstract: A semiconductor package including: a package substrate; a spacer chip attached on a surface of the package substrate, the spacer chip having a groove pattern in a surface of the spacer chip; at least one semiconductor chip mounted on the package substrate, the at least one semiconductor chip being attached on the surface of the spacer chip via an adhesive film; and a sealing member on the surface of the package substrate, the sealing member covering the spacer chip and the at least one semiconductor chip.
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公开(公告)号：US20210215534A1
公开(公告)日：2021-07-15
申请号：US16760536
申请日：2018-09-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yong Jin LEE , Hyunsu KIM , Hwan SHIM , Wonkyu LEE , Dawoon JUNG , Taeho KIM
Abstract: Various embodiments of the present invention relate to: an electronic device capable of measuring illuminance by using an optical sensor and providing information on the measured illuminance to a user; and an operating method therefor. The electronic device according to various embodiments of the present invention comprises: a light emitting unit; a sensor having a light receiving unit; and a processor, wherein the processor is set so as to: sense a first illuminance outside the electronic device by using the sensor; emit light by using the light emitting unit when the first illuminance belongs to a predetermined range; confirm whether an external object is nearby by using the sensor based on at least the light emitted using the light emitting unit; determine the first illuminance as the illuminance outside the electronic device when the external object is not nearby; and estimate a second illuminance corresponding to the first illuminance by using a selected method based on at least context information related to the electronic device when the external object is nearby.
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公开(公告)号：US20230061348A1
公开(公告)日：2023-03-02
申请号：US17982585
申请日：2022-11-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Younhee LEE , Hyunsu KIM , Yumi PARK , Jeongyup HAN
IPC: A61B5/00
Abstract: According to certain embodiments, an electronic device comprises: a sensor module; a processor operatively connected to the sensor module; and a memory operatively connected to the processor, wherein the memory stores instructions that, when executed, cause the processor to perform a plurality of operations comprising: acquiring sensor information through the sensor module, determining sleep information of a user, based on the sensor information, and determining a biorhythm of the user, based on the sleep information.
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公开(公告)号：US20210361179A1
公开(公告)日：2021-11-25
申请号：US16967970
申请日：2019-01-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Wonkyu LEE , Hwan SHIM , Hyunsu KIM , Yongjin LEE , Dawoon JUNG , Seounghun KIM , Taeho KIM
Abstract: Disclosed is an electronic device including a detection circuit and a processor operatively connected to the detection circuit. The processor is configured to obtain a first signal associated with an external object through the detection circuit, to obtain a first HR, using a first filter having an attribute of a first frequency band and to obtain a second HR, using a second filter having an attribute of a second frequency band, based at least on the first signal, to change at least some attributes associated with the second filter, based at least on the first HR and the second HR, and to obtain a second signal associated with the external object through the detection circuit, and generate heart rate variability (HRV) information, using the second filter, in which the at least some attributes are changed, based on the second signal. In addition, various embodiments as understood from the specification are also possible.
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