IMAGE SENSOR
    2.
    发明申请

    公开(公告)号:US20240405041A1

    公开(公告)日:2024-12-05

    申请号:US18639136

    申请日:2024-04-18

    Abstract: An image sensor that includes a substrate including a photoelectric conversion region, a semiconductor pattern on the substrate, a gate electrode on the semiconductor pattern, and a gate insulating layer between the semiconductor pattern and the gate electrode. The semiconductor pattern includes a first sub pattern including a first source/drain region, a second sub pattern including a second source/drain region, and a third sub pattern between the first sub pattern and the second sub pattern. The gate electrode is on the third sub pattern. The first sub pattern, the second sub pattern, and the third sub pattern extend along different directions.

    IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20200251521A1

    公开(公告)日:2020-08-06

    申请号:US16857839

    申请日:2020-04-24

    Abstract: An image sensor includes a substrate having a first surface and a second surface opposite to each other, a first floating diffusion region provided in the substrate and being adjacent to the first surface, a through-electrode provided in the substrate and electrically connected to the first floating diffusion region, an insulating structure, a bottom electrode, a photoelectric conversion layer, and a top electrode sequentially stacked on the second surface, a color filter buried in the insulating structure, and a top contact plug penetrating the insulating structure to connect the bottom electrode to the through-electrode.

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