公开(公告)号：US20150087252A1

公开(公告)日：2015-03-26

申请号：US14491449

申请日：2014-09-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haemin PARK ,  Yonggil HAN ,  Hyejung KIM

IPC: H04H40/18 ,  H03J7/02

CPC classification number: H03J7/02 ,  H03J1/0075 ,  H04H60/43 ,  H04H60/64 ,  H04H2201/37

Abstract: In a method and an electronic device for performing a radio channel connection are provided. The method includes detecting tuning in to a specific radio channel; determining whether there is pre-stored broadcasting information; determining, if the pre-stored broadcasting information exists, whether the specific radio channel is found in the pre-stored broadcasting information; and using, if the specific radio channel is found in the pre-stored broadcasting information, at least one of the pre-stored broadcasting information and a contents server address corresponding to the specific radio channel.

Abstract translation: 提供了一种用于执行无线电信道连接的方法和电子设备。 该方法包括检测到特定无线电信道的调谐; 确定是否存在预先存储的广播信息; 如果存在预先存储的广播信息，则确定在预先存储的广播信息中是否找到特定无线电信道; 以及如果在预先存储的广播信息中找到特定无线电信道，则使用预先存储的广播信息和与特定无线电信道相对应的内容服务器地址中的至少一个。

公开(公告)号：US20240297141A1

公开(公告)日：2024-09-05

申请号：US18659400

申请日：2024-05-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongbeom KO ,  Wooju KIM ,  Heejae NAM ,  Jungseok RYU ,  Haemin PARK

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L24/32 ,  H01L25/0657 ,  H01L24/73 ,  H01L25/18 ,  H01L2224/32057 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2924/10156

Abstract: A semiconductor package includes a semiconductor chip on a substrate. The semiconductor chip includes an active region, and a scribe lane in continuity with an edge of the active region. A non-conductive film (NCF) is between the substrate and the semiconductor chip, the non-conductive film (NCF) at least partially defines a recess region overlapping with the scribe lane in plan view and extending on the active region.

公开(公告)号：US20220415842A1

公开(公告)日：2022-12-29

申请号：US17537994

申请日：2021-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongbeom KO ,  Wooju KIM ,  Heejae NAM ,  Jungseok RYU ,  Haemin PARK

IPC: H01L23/00 ,  H01L25/065

Abstract: A semiconductor package includes a semiconductor chip on a substrate. The semiconductor chip includes an active region, and a scribe lane in continuity with an edge of the active region. A non-conductive film (NCF) is between the substrate and the semiconductor chip, the non-conductive film (NCF) at least partially defines a recess region overlapping with the scribe lane in plan view and extending on the active region.

公开(公告)号：US20230420352A1

公开(公告)日：2023-12-28

申请号：US18154261

申请日：2023-01-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeongbeom KO ,  Junyun KWEON ,  Wooju KIM ,  Heejae NAM ,  Haemin PARK ,  Junggeun SHIN

IPC: H01L23/498 ,  H10B80/00 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/49833 ,  H10B80/00 ,  H01L24/96 ,  H01L24/97 ,  H01L24/32 ,  H01L24/16 ,  H01L24/73 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3135 ,  H01L2924/182 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2224/95001 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L24/48 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/73253

Abstract: A semiconductor package, comprising: a first redistribution structure including a first redistribution via; a first package that is on an upper surface of the first redistribution structure and comprises a first pad; a second redistribution structure that is on a lower surface of the first redistribution structure and comprises a second redistribution via; a second semiconductor chip that is between the first redistribution structure and the second redistribution structure and comprises a connection pad; and a vertical connection structure that is between the first redistribution structure and the second redistribution structure, wherein the vertical connection structure is electrically connected to the first redistribution via and the second redistribution via, the connection pad is electrically connected to the second redistribution via, and the first redistribution via is electrically connected to the first pad.