-
公开(公告)号:US09716214B2
公开(公告)日:2017-07-25
申请号:US15147315
申请日:2016-05-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ju-heon Yoon , Hak-hwan Kim , Dae-sup Kim , Jeong-hee Kim , Dong-myung Shin , Kwang-seok Yun
CPC classification number: H01L33/62 , H01L33/16 , H01L33/20 , H01L33/38 , H05B33/086
Abstract: An LED package includes a substrate, a light-emitting structure provided on the substrate, an electrode structure provided on the light-emitting structure, and an external connection terminal provided on the electrode structure, the external connection terminal comprising a major axis and a minor axis. The major axis of the external connection terminal is perpendicular to a cleaving plane of the substrate.
-
公开(公告)号:US10305003B2
公开(公告)日:2019-05-28
申请号:US15866968
申请日:2018-01-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyung-wook Hwang , Dong-myung Shin
Abstract: Provided is a light-emitting device including: a substrate; a light-emitting structure formed on the substrate; a first transmissive conductive layer on the light-emitting structure; a first dielectric pattern layer formed on the first transmissive conductive layer, the first dielectric pattern layer including a plurality of openings; a second transmissive conductive layer conformally formed on the first transmissive conductive layer exposed through the plurality of openings and on the first dielectric pattern layer; a second dielectric pattern layer filling the plurality of openings; and a reflective electrode layer formed on the second transmissive conductive layer and the second dielectric pattern layer.
-
3.
公开(公告)号:US20190019922A1
公开(公告)日:2019-01-17
申请号:US15866968
申请日:2018-01-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyung-wook Hwang , Dong-myung Shin
Abstract: Provided is a light-emitting device including: a substrate; a light-emitting structure formed on the substrate; a first transmissive conductive layer on the light-emitting structure; a first dielectric pattern layer formed on the first transmissive conductive layer, the first dielectric pattern layer including a plurality of openings; a second transmissive conductive layer conformally formed on the first transmissive conductive layer exposed through the plurality of openings and on the first dielectric pattern layer; a second dielectric pattern layer filling the plurality of openings; and a reflective electrode layer formed on the second transmissive conductive layer and the second dielectric pattern layer.
-
-