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    Optical transmitter and optical communication system using resonance modulator that is thermally coupled
    2.
    发明授权
    Optical transmitter and optical communication system using resonance modulator that is thermally coupled 有权
    使用热耦合的共振调制器的光发射机和光通信系统

    公开(公告)号：US08983307B2

    公开(公告)日：2015-03-17

    申请号：US13734447

    申请日：2013-01-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyun-Il Byun ,  Dong-Jae Shin

    IPC: H04B10/54 ,  H04B10/572 ,  H04J14/02 ,  H04B10/50

    CPC classification number: H04B10/572 ,  H04B10/506 ,  H04J14/02 ,  H04J14/0221

    Abstract: An optical transmitter for an optical communication system includes a light source that outputs optical signals having a plurality of wavelengths, and a wavelength control unit. The wavelength control unit receives an optical signal from the light source, resonates an optical signal having a first wavelength, modulates the optical signal of the first wavelength with a first transmission data signal to obtain an intensity modulated optical signal, and outputs the intensity modulated optical signal. The wavelength control unit may be integrally formed on a semiconductor substrate in which a high thermal conductivity material is used. Alternatively, a trench that intercepts external heat may be formed in a boundary surface of the wavelength control unit, and may be filled with a low thermal conductivity material.

    Abstract translation: 用于光通信系统的光发射机包括输出具有多个波长的光信号的光源和波长控制单元。 波长控制单元从光源接收光信号，使具有第一波长的光信号谐振，用第一透射数据信号调制第一波长的光信号，以获得强度调制光信号，并输出强度调制光 信号。 波长控制单元可以一体地形成在使用高导热性材料的半导体衬底上。 或者，可以在波长控制单元的边界表面形成截取外部热的沟槽，并且可以填充低导热性材料。

    OPTICAL TRANSMITTER AND OPTICAL COMMUNICATION SYSTEM USING RESONANCE MODULATOR THAT IS THERMALLY COUPLED
    3.
    发明申请
    OPTICAL TRANSMITTER AND OPTICAL COMMUNICATION SYSTEM USING RESONANCE MODULATOR THAT IS THERMALLY COUPLED 有权
    使用谐波调制器进行热耦合的光学发射器和光通信系统

    公开(公告)号：US20130195463A1

    公开(公告)日：2013-08-01

    申请号：US13734447

    申请日：2013-01-04

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyun-Il Byun ,  Dong-Jae Shin

    IPC: H04B10/572 ,  H04J14/02

    CPC classification number: H04B10/572 ,  H04B10/506 ,  H04J14/02 ,  H04J14/0221

    Abstract: An optical transmitter for an optical communication system includes a light source that outputs optical signals having a plurality of wavelengths, and a wavelength control unit. The wavelength control unit receives an optical signal from the light source, resonates an optical signal having a first wavelength, modulates the optical signal of the first wavelength with a first transmission data signal to obtain an intensity modulated optical signal, and outputs the intensity modulated optical signal. The wavelength control unit may be integrally formed on a semiconductor substrate in which a high thermal conductivity material is used Alternatively, a trench that intercepts external heat may be formed in a boundary surface of the wavelength control unit, and may be filled with a low thermal conductivity material.

    Abstract translation: 用于光通信系统的光发射机包括输出具有多个波长的光信号的光源和波长控制单元。 波长控制单元从光源接收光信号，使具有第一波长的光信号谐振，用第一透射数据信号调制第一波长的光信号，以获得强度调制光信号，并输出强度调制光 信号。 波长控制单元可以一体地形成在其中使用高导热性材料的半导体衬底上。或者，可以在波长控制单元的边界表面中形成截取外部热的沟槽，并且可以填充低热 导电材料。

    Semiconductor Package and Semiconductor Device Including the Same
    6.
    发明申请
    Semiconductor Package and Semiconductor Device Including the Same 有权
    半导体封装和包括其的半导体器件

    公开(公告)号：US20130330035A1

    公开(公告)日：2013-12-12

    申请号：US13787918

    申请日：2013-03-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dong-Jae Shin ,  Hyun-il Byun ,  Kwang-hyun Lee ,  Kwan-sik Cho ,  Ho-chul Ji ,  Jung-hyung Pyo ,  Kyoung-ho Ha

    IPC: G02B6/12

    CPC classification number: G02B6/12 ,  G02B6/4207 ,  G02B6/4214 ,  G02B6/428 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311

    Abstract: A semiconductor package and a semiconductor device including the same. The semiconductor package includes: a package substrate; a plurality of connection elements that are disposed on the package substrate; and a semiconductor chip that includes at least one optical input/output element that transmits/receives an optical signal to/from the outside at an optical input/output angle with respect to a direction perpendicular to a bottom surface of the package substrate, and is electrically connected to the package substrate through the plurality of connection

    Abstract translation: 一种半导体封装和包括该半导体封装的半导体器件。 半导体封装包括：封装衬底; 多个连接元件，其设置在所述封装基板上; 以及半导体芯片，其包括至少一个光输入/输出元件，所述至少一个光输入/输出元件相对于垂直于所述封装基板的底面的方向以光输入/输出角度向/从外部发送/接收光信号，并且是 通过多个连接电连接到封装衬底

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