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公开(公告)号:US12074571B2
公开(公告)日:2024-08-27
申请号:US17885831
申请日:2022-08-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dong Su Kim , Jun Suk Bang
CPC classification number: H03F1/0227 , H02M1/0025 , H02M3/158 , H03F3/245 , H03F3/72 , H03F2203/7227
Abstract: A semiconductor device is provided. The semiconductor device comprises an output terminal from which an output voltage is output, a switching converter configured to control the output voltage on the basis of a first reference voltage, a load capacitor configured to be charged with a voltage corresponding to the output voltage, a linear amplifier connected to one end of an alternating current (AC) coupling capacitor and configured to control a voltage of the AC coupling capacitor on the basis of a second reference voltage, and a switching circuit configured to control a charging speed of the load capacitor and control a connection between the output terminal and one end and another end of the AC coupling capacitor.
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公开(公告)号:US12113437B2
公开(公告)日:2024-10-08
申请号:US17658317
申请日:2022-04-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jeong Kwang Lee , Young Hwan Choo , Dong Su Kim
CPC classification number: H02M1/44 , H02M1/096 , H03H1/0007 , H03H9/52 , H03H9/6489
Abstract: A power noise filter and a supply modulator including the same, and a wireless communication device including the power noise filter are provided. The power noise filter includes a band stop filter and a low pass filter. The band stop filter includes an inductor and a first capacitor, which are connected in parallel between first and second nodes. The first node receives a first voltage, which is filtered by the band pass filter to thereby generate a second voltage at the second node. The first low pass filter includes the inductor and a second capacitor, which has one end connected to the second node and an opposite end connected to a ground source.
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公开(公告)号:US11982705B2
公开(公告)日:2024-05-14
申请号:US17690317
申请日:2022-03-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youn Gon Oh , Ji Hun Kim , Sae Yun Ko , Gil Ho Gu , Dong Su Kim , Eun Hee Lee , Ho Chan Lee , Seong Sil Jeong , Seong Pyo Hong
IPC: G01R31/28 , H01L21/673 , H01L21/677
CPC classification number: G01R31/2831 , H01L21/6735 , H01L21/6773
Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.
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公开(公告)号:US20180013955A1
公开(公告)日:2018-01-11
申请号:US15643048
申请日:2017-07-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Young Min KIM , Sug Woo Yoo , Kwang Young Kim , Dong Su Kim , Byoung Woo Kim , Hyun Soo Kim , Su Jin Ryu
CPC classification number: H04N5/23241 , G06F1/1686 , G06F1/26 , G06K9/00335 , G06K9/4661 , G06K9/6202 , G06T1/20 , G06T2200/28 , H04N5/2258 , H04N5/23229 , H04N5/23238 , H04N5/23245 , H04N5/23293 , H04N5/44504 , H04N13/25
Abstract: An electronic device includes a sensor module, a dual camera including a first image sensor and a second image sensor, and a controller that processes first image data and second image data. The controller allows at least one of the first image sensor and the second image sensor to maintain a power restricted state based on at least one of a first condition associated with information extracted from the first image data or the second image data, a second condition associated with sensing information collected by the sensor module, and a third condition associated with a zoom characteristic of each of a plurality of lenses, a respective one of the plurality of lenses being mounted in each of the first image sensor and the second image sensor.
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