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    Image sensor
    2.
    发明授权
    Image sensor 有权

    公开(公告)号：US12284838B2

    公开(公告)日：2025-04-22

    申请号：US17647348

    申请日：2022-01-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jiyoun Song ,  Ingyu Baek ,  Daehoon Kim ,  Seungsik Kim

    IPC: H01L27/146 ,  H10F39/00 ,  H10F39/12 ,  H10F39/18 ,  H04N25/53 ,  H04N25/77

    Abstract: Provided is an image sensor including a semiconductor substrate having first and second surfaces, transistors on the first surface, first and second lower pad electrodes apart from each other on a first interlayer insulating film covering the transistors, a mold insulating layer on the first and second lower pad electrodes, a first lower electrode inside a first opening passing through the mold insulating layer on the first lower pad electrode, a second lower electrode inside a second opening passing through the mold insulating layer on the second lower pad electrode, a dielectric film and an upper electrode on the first and second lower electrodes, a first contact plug passing through the mold insulating layer and connected to the first lower pad electrode, and a second contact plug passing through the mold insulating layer and connected to the second lower pad electrode.

    IMAGE SENSOR
    3.
    发明申请
    IMAGE SENSOR 有权

    公开(公告)号：US20220231060A1

    公开(公告)日：2022-07-21

    申请号：US17647348

    申请日：2022-01-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jiyoun Song ,  Ingyu Baek ,  Daehoon Kim ,  Seungsik Kim

    IPC: H01L27/146

    Abstract: Provided is an image sensor including a semiconductor substrate having first and second surfaces, transistors on the first surface, first and second lower pad electrodes apart from each other on a first interlayer insulating film covering the transistors, a mold insulating layer on the first and second lower pad electrodes, a first lower electrode inside a first opening passing through the mold insulating layer on the first lower pad electrode, a second lower electrode inside a second opening passing through the mold insulating layer on the second lower pad electrode, a dielectric film and an upper electrode on the first and second lower electrodes, a first contact plug passing through the mold insulating layer and connected to the first lower pad electrode, and a second contact plug passing through the mold insulating layer and connected to the second lower pad electrode.

    Method and apparatus for performing enhanced synchronization in wireless communication system
    4.
    发明授权
    Method and apparatus for performing enhanced synchronization in wireless communication system 有权

    公开(公告)号：US11202270B2

    公开(公告)日：2021-12-14

    申请号：US16771406

    申请日：2018-12-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Bongjin Kim ,  Daehoon Kim ,  Taekyoung Kim ,  Jongho Oh

    IPC: H04W56/00 ,  H04L5/00 ,  H04W16/28 ,  H04W52/02

    Abstract: The present disclosure relates to a communication technique that fuses, with IoT technology, a 5G communication system for supporting higher data transmission rates than 4G systems, and a system thereof. The present disclosure can be applied to intelligent services (such as smart home, smart building, smart city, smart car, or connected car, health care, digital education, retail business, security and safety-related services, etc.) on the basis of 5G communication technology and IoT-related technology. The present disclosure relates to a method and an apparatus for performing synchronization using previous synchronization information where the previous synchronization information may be information about synchronization that is lost when the terminal turns off a radio frequency module to enter a low power mode.

    STACKED IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    STACKED IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20250142233A1

    公开(公告)日：2025-05-01

    申请号：US18885926

    申请日：2024-09-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Changhwa Kim ,  Gwideok Ryan Lee ,  Doowon Kwon ,  Daehoon Kim ,  Changyong Um

    IPC: H04N25/79 ,  H01L27/146

    Abstract: A stacked image sensor includes a first semiconductor chip, wherein the first semiconductor chip includes a first contact electrically connected to the first transfer transistor and disposed to extend in a Z-axis direction, a second contact electrically connected to the second transfer transistor and disposed to extend in the Z-axis direction, a plurality of third contacts electrically connected with each of the first floating diffusion region and the second floating diffusion region and disposed to extend in the Z-axis direction, and a first metal region configured to electrically connect the plurality of third contacts to one another and disposed to extend in the Z-axis direction, and the first contact, the second contact, and the first metal region contact a first surface of a first interlayer insulation layer where the first contact, the second contact, and the first metal region are formed.

    MEMORY SYSTEMS AND METHODS FOR OPERATING MEMORY SYSTEMS
    6.
    发明申请
    MEMORY SYSTEMS AND METHODS FOR OPERATING MEMORY SYSTEMS 有权

    公开(公告)号：US20250077433A1

    公开(公告)日：2025-03-06

    申请号：US18604783

    申请日：2024-03-14

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Daehoon Kim ,  Hyungwon Park ,  Jin Jung ,  Minho Kim ,  Jin In So ,  Jong-Geon Lee ,  Hwanjun Lee ,  Minwoo Jang ,  Yeaji Jung

    IPC: G06F12/0862

    Abstract: Memory systems and methods for operating the same. A memory system comprises a first memory, a second memory having an operating speed different from that of the first memory, a storage unit configured to store an instruction, a prefetcher configured to update prefetcher data in response to occurrence of cache hits and a processor configured to execute the instruction stored in the storage unit. When the instruction is executed, the processor is configured to generate prefetcher friendly data by filtering the prefetcher data, set a prefetcher friendly bit in a first pointer area corresponding to the first memory and a second pointer area corresponding to the second memory based on the prefetcher friendly data, and determine whether data of the first pointer area and the second pointer area are migrated, in consideration of a reference bit and the prefetcher friendly bit of the first and second pointer areas.

    PROCESSOR, SYSTEM, AND METHOD FOR DYNAMIC CACHE ALLOCATION
    8.
    发明公开
    PROCESSOR, SYSTEM, AND METHOD FOR DYNAMIC CACHE ALLOCATION 审中-公开

    公开(公告)号：US20240311302A1

    公开(公告)日：2024-09-19

    申请号：US18589852

    申请日：2024-02-28

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jin Jung ,  Daehoon Kim ,  Hwanjun Lee ,  Jonggeon Lee ,  Jinin So

    IPC: G06F12/0811 ,  G06F12/084

    CPC classification number: G06F12/0811 ,  G06F12/084

    Abstract: A processor includes a processing core configured to process each of a plurality of requests by accessing a corresponding one of a first memory and a second memory, a latency monitor configured to generate first latency information and second latency information, the first latency information comprising a first access latency to the first memory, and the second latency information comprising a second access latency to the second memory, a plurality of cache ways divided into a first partition and a second partition, and a decision engine configured to allocate each of the plurality of cache ways to one of the first partition and the second partition, based on the first latency information and the second latency information.

    Beam operation method and device at terminal of beamforming communication system
    10.
    发明授权
    Beam operation method and device at terminal of beamforming communication system 有权

    公开(公告)号：US11374643B2

    公开(公告)日：2022-06-28

    申请号：US16954044

    申请日：2019-01-31

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Daehoon Kim ,  Bongjin Kim ,  Taekyoung Kim ,  Jongho Oh ,  Hyoungjin Lim ,  Jungju Kim ,  Eungkuk Nam ,  Joosung Park ,  Wonjun Hwang

    IPC: H04B7/08

    Abstract: The present disclosure relates to a communication technique for converging IoT technology with a 5G communication system for supporting a higher data transmission rate beyond a 4G system, and a system therefor. The present disclosure may be applied to an intelligent service (for example, a smart home, a smart building, a smart city, a smart car or connected car, health care, digital education, retail business, a security and safety-related service, etc.) on the basis of 5G communication technology and IoT-related technology. A communication method of a terminal of a mobile communication system, according to one embodiment of the present specification, comprises the steps of: acquiring moving speed information of a terminal; determining a reception beam candidate group on the basis of the moving speed information; and determining a reception beam, in the reception beam candidate group, for receiving a signal.

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