SEMICONDUCTOR DEVICE INCLUDING ELECTROSTATIC DISCHARGE (ESD) CIRCUIT

    公开(公告)号:US20250169192A1

    公开(公告)日:2025-05-22

    申请号:US18674705

    申请日:2024-05-24

    Abstract: A semiconductor device includes a first pad configured to receive and transmit a signal; a second pad to which a predetermined reference voltage is input; and an electrostatic protection circuit includes an emitter region electrically connected to the second pad and doped with a first conductivity-type impurity, a base region having a shape surrounding the emitter region in the first direction and the second direction and doped with a second conductivity-type impurity, different from the first conductivity-type impurity, a collector region connected to the first pad and having a shape surrounding the emitter region in the first direction and the second direction, and an impurity region disposed between the collector region and the base region and separated from the collector region and the base region by an element isolation film.

    DEVICE FOR ELECTROSTATIC DISCHARGE PROTECTION USING SILICON CONTROLLED RECTIFIER

    公开(公告)号:US20240222963A1

    公开(公告)日:2024-07-04

    申请号:US18402453

    申请日:2024-01-02

    CPC classification number: H02H9/045

    Abstract: A device including a first clamp circuit connected between a first node and a second node, wherein the first clamp circuit includes: a symmetric bipolar transistor comprising a control terminal, a first current terminal and a second current terminal, wherein the first current terminal and the second current terminal are symmetrical to each other with respect to the control terminal; a first bipolar transistor electrically connected to the symmetric bipolar transistor and to the first node; and a second bipolar transistor electrically connected to the symmetric bipolar transistor and to the second node.

    SEMICONDUCTOR DEVICES WITH VOLTAGE ADJUSTMENT

    公开(公告)号:US20240235187A9

    公开(公告)日:2024-07-11

    申请号:US18350608

    申请日:2023-07-11

    CPC classification number: H02H9/04 H03K19/018571

    Abstract: A semiconductor device includes: a voltage clamping circuit including a plurality of first elements operating upon receiving a voltage having a first level and configured to output a clamp signal swinging in the first level by adjusting a voltage of an external input signal swinging in a second level more than twice the first level; a first buffer circuit configured to buffer the clamp signal; a level down shifter circuit configured to reduce the voltage of the clamp signal and output an internal input signal swinging in the first level between a predetermined reference voltage and a first power supply voltage higher than the reference voltage; and a second buffer circuit configured to buffer the internal input signal and transmits the internal input signal to a core circuit.

    LEVEL SHIFTER AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

    公开(公告)号:US20240137023A1

    公开(公告)日:2024-04-25

    申请号:US18350640

    申请日:2023-07-10

    CPC classification number: H03K19/018571 H03K3/356113

    Abstract: A level shifter includes: an input circuit receiving an input signal swinging between a reference voltage and a first power supply voltage having a level higher than a level of the reference voltage; an output circuit outputting an output signal swinging between a second power supply voltage having a level higher than the level of the first power supply voltage and a third power supply voltage having a level higher than the level of the second power supply voltage; and a tolerant circuit connected between the input circuit and the output circuit, and configured to limit an output voltage of the input circuit to a range between the reference voltage and the second power supply voltage.

    ELECTROSTATIC DISCHARGE PROTECTION DEVICE

    公开(公告)号:US20220231126A1

    公开(公告)日:2022-07-21

    申请号:US17542728

    申请日:2021-12-06

    Abstract: An electrostatic discharge protection device includes: an emitter region disposed on a semiconductor substrate; a base region surrounding the emitter region; a first collector region surrounding the base region; a second collector region surrounding the first collector region; a second conductivity-type drift region below the emitter region, and being deeper than the base region; a second conductivity-type well region disposed below the base region, and having a junction interface with the second conductivity-type drift region; and a plurality of isolation portions disposed between the emitter region, the base region, and the first collector region and the second collector region.

    SEMICONDUCTOR DEVICE
    6.
    发明申请

    公开(公告)号:US20240421149A1

    公开(公告)日:2024-12-19

    申请号:US18582871

    申请日:2024-02-21

    Abstract: A semiconductor device includes a substrate doped with first conductivity-type impurities, a first well doped with second conductivity-type impurities different from the first conductivity-type impurities, first active regions in the first well, the first active regions being doped with the first conductivity-type impurities and connected to a first pad through a first interconnection, second active regions outside the first well, the second active regions being doped with the second conductivity-type impurities and connected to a second pad through a second interconnection, third active regions around the first active regions in the first well and doped with the second conductivity-type impurities, and fourth active regions around the second active regions outside the first well and doped with the first conductivity-type impurities, wherein at least one of the third active regions and at least one of the fourth active regions are electrically connected to each other through a third interconnection.

    LEVEL SHIFTER AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

    公开(公告)号:US20240235553A9

    公开(公告)日:2024-07-11

    申请号:US18350640

    申请日:2023-07-11

    CPC classification number: H03K19/018571 H03K3/356113

    Abstract: A level shifter includes: an input circuit receiving an input signal swinging between a reference voltage and a first power supply voltage having a level higher than a level of the reference voltage; an output circuit outputting an output signal swinging between a second power supply voltage having a level higher than the level of the first power supply voltage and a third power supply voltage having a level higher than the level of the second power supply voltage; and a tolerant circuit connected between the input circuit and the output circuit, and configured to limit an output voltage of the input circuit to a range between the reference voltage and the second power supply voltage.

    DEVICE FOR ELECTROSTATIC DISCHARGE PROTECTION USING SILICON CONTROLLED RECTIFIER

    公开(公告)号:US20240222357A1

    公开(公告)日:2024-07-04

    申请号:US18400792

    申请日:2023-12-29

    CPC classification number: H01L27/0248 H01L29/7408 H01L29/7412

    Abstract: Provided is a device including a first clamp circuit electrically connected between a first node and a second node, and a second clamp circuit electrically connected between the second node and a third node, wherein the first clamp circuit includes a first silicon controlled rectifier (SCR) including a first region of a first conductivity type electrically connected to the first node, a second region of a second conductivity type, a third region of the first conductivity type, and a fourth region of the second conductivity type electrically connected to the second node, and a first gate electrode disposed over a channel region including a junction of the second region and the third region between the first region and the fourth region.

    Semiconductor device
    10.
    发明授权

    公开(公告)号:US11508718B2

    公开(公告)日:2022-11-22

    申请号:US16921846

    申请日:2020-07-06

    Abstract: A semiconductor device includes first well regions in a substrate and spaced apart from each other, a connection doped region between the first well regions, and a first interconnection line electrically connected to the connection doped region through a first contact. The first well regions and the connection doped region include impurities of a first conductivity type, and a concentration of the impurities in the connection doped region is higher than that in the first well regions. The first well regions extend into the substrate to a depth larger than that of the connection doped region. A first portion of the connection doped region is disposed in the first well regions and a second portion of the connection doped region contacts the substrate.

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