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公开(公告)号:US20240222963A1
公开(公告)日:2024-07-04
申请号:US18402453
申请日:2024-01-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyoungil Do , Jinwoo Jung , Jooyoung Song , Mijin Lee , Chanhee Jeon
IPC: H02H9/04
CPC classification number: H02H9/045
Abstract: A device including a first clamp circuit connected between a first node and a second node, wherein the first clamp circuit includes: a symmetric bipolar transistor comprising a control terminal, a first current terminal and a second current terminal, wherein the first current terminal and the second current terminal are symmetrical to each other with respect to the control terminal; a first bipolar transistor electrically connected to the symmetric bipolar transistor and to the first node; and a second bipolar transistor electrically connected to the symmetric bipolar transistor and to the second node.
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公开(公告)号:US20240421149A1
公开(公告)日:2024-12-19
申请号:US18582871
申请日:2024-02-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jinwoo Jung , Kyoungil Do , Jooyoung Song , Chanhee Jeon
Abstract: A semiconductor device includes a substrate doped with first conductivity-type impurities, a first well doped with second conductivity-type impurities different from the first conductivity-type impurities, first active regions in the first well, the first active regions being doped with the first conductivity-type impurities and connected to a first pad through a first interconnection, second active regions outside the first well, the second active regions being doped with the second conductivity-type impurities and connected to a second pad through a second interconnection, third active regions around the first active regions in the first well and doped with the second conductivity-type impurities, and fourth active regions around the second active regions outside the first well and doped with the first conductivity-type impurities, wherein at least one of the third active regions and at least one of the fourth active regions are electrically connected to each other through a third interconnection.
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公开(公告)号:US20240222362A1
公开(公告)日:2024-07-04
申请号:US18402387
申请日:2024-01-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyoungil Do , Jinwoo Jung , Jooyoung Song , Mijin Lee , Chanhee Jeon
CPC classification number: H01L27/0262 , H01L27/0255 , H01L27/0292 , H02H9/046
Abstract: A device, including a first silicon controlled rectifier comprising a first anode connected to a first node, a first cathode connected to a pad, and a first gate; a second silicon controlled rectifier comprising a second anode connected to the pad, a second cathode connected to a second node, and a second gate; and a back diode forwardly connected from the second node to the first gate.
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