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    Multi-layered chip electronic component
    1.
    发明授权
    Multi-layered chip electronic component 有权
    多层芯片电子元器件

    公开(公告)号：US09536647B2

    公开(公告)日：2017-01-03

    申请号：US13715899

    申请日：2012-12-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Woo Hahn ,  So Yeon Song ,  Sung Yong An ,  Byeong Cheol Moon ,  Soo Hwan Son

    IPC: H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F27/29

    CPC classification number: H01F5/003 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/292

    Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body formed by stacking a plurality of magnetic layers; and conductive patterns disposed between the plurality of magnetic layers and electrically connected in a lamination direction to form coil patterns, wherein in a case in which a single coil pattern in the coil pattern is projected in the length and width directions of the multi-layered body, when an area of the magnetic layer inside of the coil pattern is defined as Ai and an area of the magnetic layer outside of the coil pattern is defined as Ao, 0.40≦Ai:Ao≦1.03 is satisfied.

    Abstract translation: 提供了一种多层芯片电子部件，包括：通过堆叠多个磁性层而形成的多层体; 以及设置在所述多个磁性层之间并且在层叠方向上电连接以形成线圈图案的导电图案，其中在所述线圈图案中的单个线圈图案在所述多层体的长度和宽度方向上突出的情况下 当线圈图案内部的磁性层的面积被定义为Ai，并且将线圈图案外部的磁性层的面积定义为Ao时，则满足0.40≤Ai：Ao≤1.03。

    ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
    4.
    发明申请
    ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
    天线模块和电子设备，包括它们

    公开(公告)号：US20150054692A1

    公开(公告)日：2015-02-26

    申请号：US14463516

    申请日：2014-08-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Kang Ryong Choi ,  Hyung Jin Jeon ,  Sung Yong An ,  Kang Heon Hur ,  Jung Wook Seo

    IPC: H01Q1/24 ,  H01Q7/06 ,  H01Q7/00

    CPC classification number: H01Q1/243 ,  H01Q1/44 ,  H01Q7/06

    Abstract: There is provided an antenna module formed to correspond to an opening formed in a frame, including: a coil conductor part disposed in the opening of the frame when viewed on a plane; and a substrate including the coil conductor part formed thereon. The coil conductor part is wound outside a non-conductive portion of the substrate.

    Abstract translation: 提供了一种形成为对应于形成在框架中的开口的天线模块，包括：当在平面上观察时设置在框架的开口中的线圈导体部分; 以及包括形成在其上的线圈导体部的基板。 线圈导体部分被卷绕在衬底的非导电部分的外部。

    Chip antenna module and electronic device
    9.
    发明授权
    Chip antenna module and electronic device 有权

    公开(公告)号：US11417959B2

    公开(公告)日：2022-08-16

    申请号：US16661241

    申请日：2019-10-23

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Ju Hyoung Park ,  Won Cheol Lee ,  Sung Yong An ,  Kyu Bum Han

    IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q5/40

    Abstract: A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.

    Array antenna
    10.
    发明授权
    Array antenna 有权

    公开(公告)号：US11322856B2

    公开(公告)日：2022-05-03

    申请号：US16732661

    申请日：2020-01-02

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Jae Yeong Kim ,  Ji Hyung Jung ,  Chin Mo Kim ,  Sung Nam Cho ,  Sung Yong An

    IPC: H01Q21/06 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q1/38

    Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

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