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公开(公告)号：US11264703B2
公开(公告)日：2022-03-01
申请号：US17151952
申请日：2021-01-19
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sung Nam Cho , Sung Yong An , Jae Yeong Kim , Ju Hyoung Park
Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.
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公开(公告)号：US11251518B2
公开(公告)日：2022-02-15
申请号：US16828788
申请日：2020-03-24
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Chin Mo Kim , Sung Yong An , Ji Hyung Jung , Jae Yeong Kim , Ju Hyoung Park , Sung Nam Cho
Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.
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公开(公告)号：US11121476B2
公开(公告)日：2021-09-14
申请号：US16725377
申请日：2019-12-23
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong Kim , Sung Nam Cho , Ju Hyoung Park , Jeong Ki Ryoo , Kyu Bum Han , Sung Yong An
Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
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公开(公告)号：US09984821B2
公开(公告)日：2018-05-29
申请号：US15052241
申请日：2016-02-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sung Yong An , Kang Ryong Choi , Jae Yeong Kim , Yong Hui Li , Byeong Cheol Moon , Jeong Gu Yeo
CPC classification number: H01G4/1218 , H01G4/008 , H01G4/0085 , H01G4/01 , H01G4/224 , H01G4/30 , H01G4/38 , H01G5/38 , H01G7/06
Abstract: A multilayer ceramic capacitor includes an active region including a plurality of dielectric layers, and first and second internal electrodes alternately disposed with each of the dielectric layers interposed therebetween; and upper and lower cover regions including at least one ferromagnetic layer and disposed on and below the active region, respectively.
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公开(公告)号：US11721913B2
公开(公告)日：2023-08-08
申请号：US17399572
申请日：2021-08-11
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong Kim , Sung Nam Cho , Ju Hyoung Park , Jeong Ki Ryoo , Kyu Bum Han , Sung Yong An
CPC classification number: H01Q21/065 , H01Q1/2283 , H01Q1/48 , H01Q19/10
Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
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Patent Agency Ranking
公开(公告)号：US11695220B2
公开(公告)日：2023-07-04
申请号：US17713453
申请日：2022-04-05
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong Kim , Ji Hyung Jung , Chin Mo Kim , Sung Nam Cho , Sung Yong An
CPC classification number: H01Q21/065 , H01Q1/2283 , H01Q1/38 , H01Q1/526
Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.
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公开(公告)号：US11322856B2
公开(公告)日：2022-05-03
申请号：US16732661
申请日：2020-01-02
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong Kim , Ji Hyung Jung , Chin Mo Kim , Sung Nam Cho , Sung Yong An
Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.
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公开(公告)号：US11165156B2
公开(公告)日：2021-11-02
申请号：US16829603
申请日：2020-03-25
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong Kim , Sung Yong An
Abstract: A chip antenna includes: a hexahedral-shaped body portion having a permittivity, and including a first surface and a second surface opposite to the first surface; a hexahedral-shaped radiation portion coupled to the first surface of the body portion; and a hexahedral-shaped ground portion coupled to the second surface of the body portion, wherein a width of each of the radiation portion and the ground portion is in a range of 100 μm to 500 μm.
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公开(公告)号：US10978785B2
公开(公告)日：2021-04-13
申请号：US16456048
申请日：2019-06-28
Applicant: Samsung Electro-Mechanics., Co., Ltd.
Inventor： Seong Hee Choi , Sang Jong Lee , Sung Yong An , Jae Yeong Kim , Ju Hyoung Park
Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
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公开(公告)号：US11749875B2
公开(公告)日：2023-09-05
申请号：US17343235
申请日：2021-06-09
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Chin Mo Kim , Sungyong An , Jae Yeong Kim
CPC classification number: H01Q1/2283 , H01Q9/0407 , H05K1/11 , H05K1/181 , H05K3/10 , H05K2201/10098
Abstract: A chip antenna includes a substrate having a concavo-convex pattern on a surface thereof, and a conductor pattern disposed on the surface of the substrate having the concavo-convex pattern, wherein a convex portion extending in one direction and a concave portion extending in one direction are alternately disposed in the concavo-convex pattern.
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