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公开(公告)号：US11245192B2
公开(公告)日：2022-02-08
申请号：US17002006
申请日：2020-08-25
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Dae Ki Lim , Young Sik Hur , Kyu Bum Han , Ju Hyoung Park , Myeong Woo Han , Jeong Ki Ryoo
Abstract: A chip antenna includes: a first dielectric layer; a second dielectric layer upwardly spaced apart from the first dielectric layer; a patch antenna pattern disposed on the second dielectric layer; a feed via extending through the first dielectric layer; a feed pattern disposed between the first and second dielectric layers, electrically connected to the feed via, and spaced apart from the patch antenna pattern; and an adhesive layer adhered to the first and second dielectric layers. The adhesive layer includes a cavity surrounding the feed pattern between the first and second dielectric layers and; and a vent disposed between the cavity and an external side surface of the adhesive layer.
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公开(公告)号：US11128030B2
公开(公告)日：2021-09-21
申请号：US16504701
申请日：2019-07-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hong In Kim , Hyung Ho Seo , Young Kyoon Im , Kyu Bum Han , Jeong Ki Ryoo
Abstract: An antenna module includes an integrated circuit (IC) package, a first antenna package, a second antenna package, and a connection member. The IC package includes an IC and mounting electrical connection structures. The first antenna package includes a first patch antenna pattern, a first feed via connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via. The second antenna package includes a second patch antenna pattern, a second feed via connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and disposed to be spaced apart from the first antenna package. The connection member, connecting the IC to the first feed via and the second feed via, connects to the mounting electrical connection structures, and having a stacked structure.
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3.发明授权公开(公告)号：US10068824B2
公开(公告)日：2018-09-04
申请号：US15264684
申请日：2016-09-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Thomas A Kim , Kyu Bum Han , Chang Moo Jung , Kyung In Kang , Sang Kyu Lee
IPC: H01L23/31 , H01L23/367 , H01L23/00 , H01L21/56
Abstract: An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.
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公开(公告)号：US11658420B2
公开(公告)日：2023-05-23
申请号：US17022553
申请日：2020-09-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Nam Ki Kim , Jeong Ki Ryoo , Kyu Bum Han , Young Kyoon Im
IPC: H01Q1/52 , H01Q9/28 , H01Q9/04 , H01Q21/00 , H01Q21/30 , H01Q1/24 , H01Q1/48 , H01Q21/24 , H01Q19/24 , H01Q21/06 , H01Q21/10
CPC classification number: H01Q9/285 , H01Q1/243 , H01Q1/48 , H01Q1/521 , H01Q1/526 , H01Q9/0407 , H01Q19/24 , H01Q21/0006 , H01Q21/065 , H01Q21/10 , H01Q21/24 , H01Q21/30
Abstract: An antenna apparatus includes first dipole antenna patterns, feed lines, a first ground plane, and a first blocking pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern, connected to and extending from the first ground plane, is disposed between adjacent ones of the first dipole antenna patterns.
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公开(公告)号：US11322857B2
公开(公告)日：2022-05-03
申请号：US16822867
申请日：2020-03-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Hyoung Park , Young Sik Hur , Sung Yong An , Myeong Woo Han , Kyu Bum Han , Dae Ki Lim
Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.
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Patent Agency Ranking
公开(公告)号：US11121476B2
公开(公告)日：2021-09-14
申请号：US16725377
申请日：2019-12-23
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong Kim , Sung Nam Cho , Ju Hyoung Park , Jeong Ki Ryoo , Kyu Bum Han , Sung Yong An
Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
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公开(公告)号：US10763563B2
公开(公告)日：2020-09-01
申请号：US16176053
申请日：2018-10-31
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Joong Jin Nam , Kyu Bum Han , Jae Soon Lee , Young Kyoon Im
IPC: H01P1/203 , H03H7/01 , H03H1/00 , H01L23/66 , H01Q21/06 , H05K1/02 , H05K9/00 , H01L23/552 , H01L23/538 , H01L25/16
Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.
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公开(公告)号：US11245201B2
公开(公告)日：2022-02-08
申请号：US16662528
申请日：2019-10-24
Inventor： Ju Hyoung Park , Jung Woo Seo , Jung Suek Oh , Jeong Ki Ryoo , Kyu Bum Han
Abstract: An antenna apparatus includes a patch antenna pattern; a first feed via to feed power to the patch antenna pattern in a non-contact manner on a first side of the patch antenna pattern; and a plurality of feed patterns disposed on the first side of the patch antenna pattern on different levels and overlapping each other, and including at least one feed pattern that is electrically connected to the first feed via, and each having a width greater than a width of the first feed via and a cross-sectional area smaller than a cross-sectional area of the patch antenna pattern.
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公开(公告)号：US11018418B2
公开(公告)日：2021-05-25
申请号：US16185118
申请日：2018-11-09
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong Kim , Sung Yong An , Sang Jong Lee , Seong Hee Choi , Kyu Bum Han , Jeong Ki Ryoo , Byeong Cheol Moon , Chang Hak Choi
IPC: H01Q1/38 , H01Q15/14 , H01Q9/04 , H01Q1/48 , H01Q1/22 , H01Q19/30 , H01Q11/02 , H01Q1/24 , H01Q19/00
Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.
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10.发明授权公开(公告)号：US10985442B2
公开(公告)日：2021-04-20
申请号：US16515464
申请日：2019-07-18
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jeong Ki Ryoo , Nam Ki Kim , Eun Young Jung , Hong In Kim , Ju Hyoung Park , Won Cheol Lee , Kyu Bum Han
Abstract: An antenna apparatus includes: a ground plane having a through-hole; a feed line disposed below the ground plane; an insulating layer disposed between the feed line and the ground plane; a feed via electrically connected to the feed line, and passing through the through-hole; and a chip patch antenna electrically connected to the feed via. The chip patch antenna includes: a patch antenna pattern electrically connected to the feed via; an upper coupling pattern disposed above the patch antenna pattern; edge coupling patterns surrounding a portion of the patch antenna pattern; upper edge coupling patterns surrounding a portion of the upper coupling pattern; and a dielectric layer disposed in a first region between the patch antenna pattern and the upper coupling pattern, and in a second region between the edge coupling patterns and the upper edge coupling patterns, and having a dielectric constant higher than that of the insulating layer.
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