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1.
公开(公告)号:US20220411696A1
公开(公告)日:2022-12-29
申请号:US17896073
申请日:2022-08-26
发明人: Bong-Kyun Kim , JinSeuk Kim , SeungBo Shim , ShinHyuk Choi , Seung-Hee Kim , Donghee Lee
IPC分类号: C09K13/08 , H01L29/45 , H01L21/3213 , H01L27/12 , C23F1/10 , C23F1/16 , C09K13/00 , C23F1/02 , C23F1/18 , C23F1/26 , C23F1/44 , G03F7/20 , H01L21/306 , H01L21/311 , C09K13/06
摘要: A method for manufacturing a metal pattern, the method including forming a photosensitive layer pattern on a multilayer metal substrate including titanium and copper; providing an etchant composition on the multilayer metal substrate on which the photosensitive layer pattern is formed to form the source electrode and the drain electrode; and removing the photosensitive layer pattern, wherein the etchant composition includes a persulfate, a four-nitrogen ring compound, a two-chlorine compound, a fluorine compound, and water, and a weight ratio of the four-nitrogen ring compound and the two-chlorine compound is from about 1:0.5 to about 1:4.
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2.
公开(公告)号:US11441071B2
公开(公告)日:2022-09-13
申请号:US16702773
申请日:2019-12-04
发明人: Bong-Kyun Kim , JinSeuk Kim , SeungBo Shim , ShinHyuk Choi , Seung-Hee Kim , Donghee Lee
IPC分类号: C09K13/08 , H01L29/45 , H01L21/3213 , H01L27/12 , C23F1/10 , C23F1/16 , C09K13/00 , C23F1/02 , C23F1/18 , C23F1/26 , C23F1/44 , G03F7/20 , H01L21/306 , H01L21/311 , C09K13/06 , G02F1/1368
摘要: An etchant composition of an embodiment includes a persulfate, a four-nitrogen ring compound, a two-chlorine compound, a fluorine compound and water, and has a weight ratio of the four-nitrogen ring compound and the two-chlorine compound of about 1:0.5 to about 1:4. The etchant composition may etch a multilayer metal substrate of titanium/copper and may be used for manufacturing a multilayer metal pattern and an array substrate having excellent properties of etched patterns.
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