Abstract:
A film peeling device for peeling a film from a substrate including a transfer module configured to transfer the substrate that is arranged in a vertical direction with respect to a bottom surface of the substrate, and a peeling module configured to peel the film from the substrate transferred by the transfer module.
Abstract:
A film sticking device includes a pressing part configured to press a film by contacting a surface of the film and pressing the film. A supporting part is coupled to the pressing part and supports the pressing part. A guiding part is configured to guide the supporting part and move the supporting part between a first position and a second position. The second position is separated from the first position. A body has one end coupled to the guiding part. The supporting part is positioned at the first position when a center part of the pressing part contacts the surface of the film.
Abstract:
A method of manufacturing a flexible display apparatus includes sequentially forming a flexible substrate, a thin film transistor (TFT), an organic light-emitting diode (OLED) including a first electrode, an intermediate layer, and a second electrode, and a first attachment layer on a carrier substrate, sequentially forming a deposition layer and a second attachment layer on a sealing film, attaching the carrier substrate and the sealing film to each other such that the sealing film covers flexible substrate on the carrier substrate, sealing the first and second attachment layers, laminating the carrier substrate and the sealing film, and separating the sealing film and the flexible substrate from the carrier substrate.
Abstract:
An apparatus for fabricating an organic light emitting display panel is disclosed. In one embodiment, the apparatus includes i) a first roll around which a film is wound to be continuously drawn, ii) a second roll arranged to face the first roll and around which the film is continuously wound, iii) a plurality of chambers disposed between the first and second rolls and through which the film passes, and in which laser induced thermal imaging (LITI) is performed on a substrate by forming a transfer layer on the film, and iv) a gate unit installed at least one of the chambers and disposed at at least one of a film inlet and a film output of the chambers that are installed, to maintain a substantially vacuum state in the chambers during passing of the film.
Abstract:
A thermal transfer method includes a step of forming a donor member having a base layer, a light-to-heat conversion layer disposed on the base layer, an intermediate layer disposed on the light-to-heat conversion layer, an organic transfer layer disposed on the intermediate layer, and a first protecting film disposed over the base layer and contacting at least one edge of the base layer, irradiating a first laser onto the donor member to form a preliminary organic layer on the display substrate, forming a pressing member having a second protecting film and a third protecting film disposed over the second protecting film and contacting at least one edge of the second protecting film, disposing the display substrate within a space formed by the second protecting film and the third protecting film, and irradiating a second laser onto the pressing member to change the preliminary organic layer to an organic layer.