公开(公告)号：US20160218289A1

公开(公告)日：2016-07-28

申请号：US14811883

申请日：2015-07-29

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chung-Seok LEE ,  Jin Gab BEOM

IPC: H01L51/00 ,  H01L51/56

CPC classification number: H01L51/56 ,  G02F1/13452 ,  H01L27/3276 ,  H01L51/0097 ,  H01L2251/5338 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/10128 ,  H05K2203/0278 ,  H05K2203/107 ,  H05K2203/1105 ,  Y02E10/549

Abstract: A bonding method for a flexible display device, the method including arranging at least two bonding objects and an anisotropic conductive film (ACF) at a bonding position; applying a predetermined pressure to the at least two bonding objects and the ACF; and irradiating a laser beam at the bonding position to bond the at least two bonding objects and the ACF, a temperature and viscosity of the ACF being changed, and a change of the temperature following a predetermined temperature profile.

Abstract translation: 一种用于柔性显示装置的接合方法，所述方法包括在接合位置处布置至少两个接合对象和各向异性导电膜（ACF）; 对所述至少两个结合物和所述ACF施加预定的压力; 以及在所述接合位置处照射激光束以结合所述至少两个接合物体和所述ACF，所述ACF的温度和粘度被改变，以及随着预定温度曲线的温度变化。

公开(公告)号：US20180011369A1

公开(公告)日：2018-01-11

申请号：US15613415

申请日：2017-06-05

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Cheol Geun AN ,  Jong Hyuk LEE ,  Chung-Seok LEE ,  Eui Yun JANG ,  Jeong Ho Hwang

IPC: G02F1/1333 ,  G06F3/14 ,  G02B5/30 ,  G02F1/167 ,  G09G3/20 ,  G09F9/30

CPC classification number: G02F1/133348 ,  G02B5/305 ,  G02B5/3083 ,  G02F1/1345 ,  G02F1/13458 ,  G02F1/167 ,  G02F2001/133311 ,  G06F3/14 ,  G09F9/30 ,  G09F9/301 ,  G09G3/20

Abstract: A display device includes a pad portion disposed on a first substrate, a connection member disposed on the pad portion, and an anisotropic conductive layer disposed between the pad portion and the connection member, the anisotropic conductive layer including conductive particles. The pad portion includes a pad, the pad including a first pad electrode and a second pad electrode. A first insulating layer is disposed between the first pad electrode and the second pad electrode. The first insulating layer overlaps the first pad electrode. The second pad electrode is connected to the first pad electrode through a first contact hole. The first contact hole overlaps a center of the first pad electrode. The first pad electrode is at least twice as wide as the first contact hole.

公开(公告)号：US20210043711A1

公开(公告)日：2021-02-11

申请号：US16895325

申请日：2020-06-08

Applicant: Samsung Display Co., Ltd.

Inventor： Chung-Seok LEE ,  Hayoung CHOI

IPC: H01L27/32

Abstract: A display panel includes a base substrate, pixels, signal lines, a power line, signal pads, power pads, and a conductive portion electrically connected to the power pads and extending from an area overlapping the power pads to an edge of the base substrate. An opening is defined in conductive portion by a removed portion thereof.

公开(公告)号：US20210157374A1

公开(公告)日：2021-05-27

申请号：US16939866

申请日：2020-07-27

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： HAYOUNG CHOI ,  Chung-Seok LEE

IPC: G06F1/18

Abstract: A display device includes a display panel, a bonding substrate and a bridge board. The display panel includes a pixel array disposed on a base substrate and an input pad electrically connected to the pixel array. The bonding substrate is disposed under the display panel and includes an output pad. The bridge board is bonded to the input pad of the display panel and the output pad of the bonding substrate to electrically connect the display panel to the bonding substrate, wherein the bridge board includes a rigid material.

公开(公告)号：US20210064105A1

公开(公告)日：2021-03-04

申请号：US16856032

申请日：2020-04-23

Applicant: Samsung Display Co., Ltd.

Inventor： Chung-Seok LEE ,  Hayoung CHOI

IPC: G06F1/18 ,  H01L27/32 ,  G06F1/16 ,  G09F9/30

Abstract: A display device including a lower substrate having a display area and a pad area, a display structure disposed in the display area of the lower substrate, pad electrodes disposed in the pad area of the lower substrate and spaced apart in a first direction, and a conductive film package including a base substrate disposed on the pad electrodes, and including a corner portion having a curved shape, bump electrodes disposed in a first portion of a bottom surface of the base substrate and overlapping the pad electrodes, metal patterns disposed in second portions of the bottom surface of the base substrate positioned at both sides of the first portion, a first film layer disposed between the base substrate and the lower substrate and overlapping the pad electrodes, a part of the bump electrodes, and the metal patterns, and conductive balls disposed inside the first film layer.

公开(公告)号：US20200373276A1

公开(公告)日：2020-11-26

申请号：US16799811

申请日：2020-02-24

Applicant: Samsung Display Co., LTD.

Inventor： Chung-Seok LEE ,  Joongmok LEE ,  Eunjeong JEON

IPC: H01L23/00 ,  H01L27/12

Abstract: A flexible circuit film bonding apparatus includes: a stage configured to support a TFT substrate; a pressing head configured to press and heat a flexible circuit film attached on the TFT substrate with an anisotropic conductive film interposed therebetween; a backup plate configured to support and heat the TFT substrate positioned below the flexible circuit film; and a heating control unit configured to control a temperature of a lower surface of the pressing head and an upper surface of the backup plate, wherein the temperature of the upper surface of the backup plate is less than 170 degrees Celsius.

公开(公告)号：US20170338198A1

公开(公告)日：2017-11-23

申请号：US15365979

申请日：2016-12-01

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Eui Yun JANG ,  Dong-Hee PARK ,  Cheol Geun AN ,  Ji Hoon OH ,  Chung-Seok LEE ,  Jeong Ho HWANG

IPC: H01L23/00

Abstract: A display device including pads; an anisotropic conductive film on the pads; and a connection member bonded to the pads through the film, the connection member including bumps, the film includes a supporting layer including a plurality of conductive particles having a part protruded from a first and second surface of the support layer; a first adhesive layer contacting the first surface and the part of each conductive particle protruding from the first surface; and a second adhesive layer contacting the second surface and the part of each conductive particle protruding from the second surface, and wherein the first or second adhesive layer is positioned at both of a first and second region of the display device, the first region being a region in which the pads and the bumps are overlapped and the second region being a region in which the pads and the bumps are not overlapped.