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公开(公告)号：US11358172B2
公开(公告)日：2022-06-14
申请号：US14863523
申请日：2015-09-24
发明人： Davide Dattilo , Uwe Dietze , SherJang Singh
IPC分类号： B08B3/10 , G03F1/82 , B08B7/00 , C11D11/00 , C11D3/30 , B05D3/00 , B05B1/00 , H01L21/67 , G03F7/20 , G03F7/42 , H01L21/311
摘要： Methods for treating substrates are described. The methods comprise the steps of flowing an aqueous liquid medium through a flow channel and at least one outlet slit onto a substrate to be treated and exposing the aqueous liquid medium to UV-radiation of a specific wavelength at least in a portion of the flow channel immediately adjacent the at least one outlet slit and after the aqueous liquid medium has flown through the outlet opening towards the substrate and thus prior to and while applying the aqueous liquid medium to the surface of the substrate to be treated. In one method, the electrical conductance of the aqueous liquid medium is adjusted to be in the range of 20 to 2000 μS, by the addition of an additive to the aqueous liquid medium, the aqueous liquid medium prior to the addition of the additive having an electrical conductivity below 20 μS, prior to or while exposing the same to the UV-radiation. Additionally, the pH of the aqueous liquid medium may be adjusted to a range of 8 to 11 or 3 to 6 prior to or while exposing the same to the UV-radiation. The adjustments may lead to a shift in an equilibrium of reactive species generated in the aqueous liquid medium by the UV-radiation towards preferred species.
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公开(公告)号：US10898932B2
公开(公告)日：2021-01-26
申请号：US15893993
申请日：2018-02-12
发明人： Uwe Dietze , Habib Hichri , Seongkuk Lee , Davide Dattilo , Martin Samayoa
摘要： A method and an apparatus for cleaning a substrate having at least one surface having a residue to be removed thereon is described. The method comprises: scanning at least an area of the surface having the residue thereon with laser light to thereby heat the surface and the residue; controlling the heating so that a part of the residue first liquefies such that the liquefied part of the residue starts flowing towards the solid part of the residue, thereby forming a meniscus with the solid part of the residue and accumulating in part on top of the solid part, the thus generated thicker layer of residue absorbing further heat to be decomposed or vaporized.
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公开(公告)号：US20170087585A1
公开(公告)日：2017-03-30
申请号：US14863523
申请日：2015-09-24
发明人： Davide Dattilo , Uwe Dietze , SherJang Singh
IPC分类号： B05D3/00
CPC分类号： B05D3/002 , B05B1/00 , B05D2203/30 , B08B3/10 , B08B7/0057 , C11D3/30 , C11D11/0047 , C11D11/007 , G03F1/82 , G03F7/42 , G03F7/423 , G03F7/425 , G03F7/70925 , H01L21/31138 , H01L21/67051 , H01L21/6708 , H01L21/67115
摘要： Methods for treating substrates are described. The methods comprise the steps of flowing an aqueous liquid medium through a flow channel and at least one outlet slit onto a substrate to be treated and exposing the aqueous liquid medium to UV-radiation of a specific wavelength at least in a portion of the flow channel immediately adjacent the at least one outlet slit and after the aqueous liquid medium has flown through the outlet opening towards the substrate and thus prior to and while applying the aqueous liquid medium to the surface of the substrate to be treated. In one method, the electrical conductance of the aqueous liquid medium is adjusted to be in the range of 20 to 2000 μS, by the addition of an additive to the aqueous liquid medium, the aqueous liquid medium prior to the addition of the additive having an electrical conductivity below 20 μS, prior to or while exposing the same to the UV-radiation. Additionally, the pH of the aqueous liquid medium may be adjusted to a range of 8 to 11 or 3 to 6 prior to or while exposing the same to the UV-radiation. The adjustments may lead to a shift in an equilibrium of reactive species generated in the aqueous liquid medium by the UV-radiation towards preferred species.
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