公开(公告)号：US10930695B2

公开(公告)日：2021-02-23

申请号：US15767944

申请日：2016-10-07

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Satoru Wakiyama ,  Kan Shimizu ,  Toshihiko Hayashi ,  Takuya Nakamura ,  Naoki Jyo

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/31

Abstract: An imaging device includes a first semiconductor element including at least one bump pad that has a concave shape. The at least one bump pad includes a first metal layer and a second metal layer on the first metal layer. The imaging device includes a second semiconductor element including at least one electrode. The imaging device includes a microbump electrically connecting the at least one bump pad to the at least one electrode. The microbump includes a diffused portion of the second metal layer, and first semiconductor element or the second semiconductor element includes a pixel unit.

公开(公告)号：US11848346B2

公开(公告)日：2023-12-19

申请号：US17162221

申请日：2021-01-29

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Satoru Wakiyama ,  Kan Shimizu ,  Toshihiko Hayashi ,  Takuya Nakamura ,  Naoki Jyo

IPC: H01L23/00 ,  H01L27/146 ,  H01L23/31

CPC classification number: H01L27/14636 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/14 ,  H01L24/81 ,  H01L27/14607 ,  H01L27/14634 ,  H01L27/14643 ,  H01L23/3192 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/0239 ,  H01L2224/039 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0361 ,  H01L2224/0391 ,  H01L2224/03616 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05082 ,  H01L2224/05157 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05547 ,  H01L2224/05548 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/48463 ,  H01L2224/73257 ,  H01L2224/81011 ,  H01L2224/8114 ,  H01L2224/81022 ,  H01L2224/81065 ,  H01L2224/8182 ,  H01L2224/81191 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/81469 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/05664 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05669 ,  H01L2924/00014 ,  H01L2224/05157 ,  H01L2924/00014 ,  H01L2224/05187 ,  H01L2924/04941 ,  H01L2224/05181 ,  H01L2924/00014 ,  H01L2224/05187 ,  H01L2924/04953 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2224/13111 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/01029 ,  H01L2224/13111 ,  H01L2924/01049 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/0345 ,  H01L2924/00014 ,  H01L2224/0346 ,  H01L2924/00014 ,  H01L2224/03616 ,  H01L2924/00014 ,  H01L2224/0361 ,  H01L2924/00012 ,  H01L2224/81447 ,  H01L2924/00014 ,  H01L2224/81455 ,  H01L2924/00014 ,  H01L2224/81464 ,  H01L2924/00014 ,  H01L2224/81444 ,  H01L2924/00014 ,  H01L2224/81469 ,  H01L2924/00014 ,  H01L2224/039 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/03616 ,  H01L2224/0361 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2224/05571 ,  H01L2924/00012 ,  H01L2224/0239 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: An imaging device includes a first semiconductor element including at least one bump pad that has a concave shape. The at least one bump pad includes a first metal layer and a second metal layer on the first metal layer. The imaging device includes a second semiconductor element including at least one electrode. The imaging device includes a microbump electrically connecting the at least one bump pad to the at least one electrode. The microbump includes a diffused portion of the second metal layer, and first semiconductor element or the second semiconductor element includes a pixel unit.