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公开(公告)号：US20220415766A1
公开(公告)日：2022-12-29
申请号：US17929884
申请日：2022-09-06
IPC分类号： H01L23/495 , H01L23/00 , H01L25/065 , H01L23/40 , H01L23/367
摘要： Implementations of semiconductor packages may include a first substrate having two or more die coupled to a first side, a clip coupled to each of the two or more die on the first substrate and a second substrate having two or more die coupled to a first side of the second substrate. A clip may be coupled to each of the two or more die on the second substrate. The package may include a lead frame between the first substrate and the second substrate and a molding compound. A second side of each of the first substrate and the second substrate may be exposed through the molding compound. A perimeter of the first substrate and a perimeter of the second substrate may not fully overlap when coupled through the lead frame.
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公开(公告)号：US20220159853A1
公开(公告)日：2022-05-19
申请号：US17588660
申请日：2022-01-31
IPC分类号： H05K5/02 , H01L23/053 , H01L23/40
摘要： In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.
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公开(公告)号：US20200344905A1
公开(公告)日：2020-10-29
申请号：US16587549
申请日：2019-09-30
摘要： A fin frame baseplate is disclosed. Specific implementations include a baseplate configured to be coupled to a substrate, a fin frame including a base portion coupled to the baseplate, and a plurality of fins extending from the base portion, the plurality of fins protruding from the base portion. The fin frame may include a plurality of openings therethrough.
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公开(公告)号：US20200105648A1
公开(公告)日：2020-04-02
申请号：US16145517
申请日：2018-09-28
IPC分类号： H01L23/495 , H01L23/00
摘要： A semiconductor package assembly having a connecting clip disposed on both a first material stack and a second material stack having different thicknesses and disposed on a conducting substrate. This connecting clip has a first portion disposed on to the first material stack and second portion disposed on the second material stack, such that the surfaces of the first portion and second portion opposite the conducting substrate are at the same perpendicular distance from the conducting substrate. For example, in some implementations, when the thickness of the second material stack is smaller than the thickness of the first material stack, the second portion of the connecting clip may include a vertical support disposed on the second material stack to equalize the heights of the surfaces of the first portion and second portion of the connecting clip.
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公开(公告)号：US20180197836A1
公开(公告)日：2018-07-12
申请号：US15912267
申请日：2018-03-05
IPC分类号： H01L23/00 , H01L25/07 , H01L25/065 , H01L23/495
CPC分类号： H01L24/83 , H01L23/49524 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/84 , H01L25/0655 , H01L25/072 , H01L2224/27312 , H01L2224/2732 , H01L2224/27418 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32245 , H01L2224/33181 , H01L2224/37012 , H01L2224/37111 , H01L2224/37124 , H01L2224/37147 , H01L2224/37155 , H01L2224/3716 , H01L2224/40139 , H01L2224/40175 , H01L2224/40499 , H01L2224/45124 , H01L2224/73263 , H01L2224/83101 , H01L2224/83193 , H01L2224/83385 , H01L2224/83438 , H01L2224/83447 , H01L2224/8384 , H01L2224/84385 , H01L2224/84438 , H01L2224/84447 , H01L2224/8484 , H01L2224/92246 , H01L2924/00014 , H01L2924/01006 , H01L2924/0103 , H01L2924/014 , H01L2924/01047 , H01L2924/00012 , H01L2924/01014
摘要： Implementations of a clip for a semiconductor package may include: an electrically conductive clip having a first end and a second end and a middle section between the first end and the second end. The first end may be configured to couple to a first die through a bonding material. The second end may be configured to couple to a second die through a bonding material. The middle section may be configured to couple to an emitter structure through a bonding material. The clip may include an integrally formed electrically conductive material and include an M-shape. A middle of the M-shape may be coupled to the emitter structure.
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公开(公告)号：US20170347456A1
公开(公告)日：2017-11-30
申请号：US15165813
申请日：2016-05-26
CPC分类号： H05K1/181 , H01L23/48 , H05K1/0203 , H05K1/0306 , H05K1/09 , H05K3/341 , H05K3/3431 , H05K3/3494 , H05K3/4015 , H05K2201/10189 , H05K2201/10257 , H05K2201/10333 , H05K2203/1316 , H05K2203/1327 , H05K2203/16
摘要： A method, in some embodiments, comprises: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.
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公开(公告)号：US20170162742A1
公开(公告)日：2017-06-08
申请号：US15439672
申请日：2017-02-22
发明人： Atapol PRAJUCKAMOL , How Kiat LIEW , Bih Wen FON
IPC分类号： H01L31/167 , H01L21/56 , H01L23/31 , H01L21/3105 , H01L23/495 , H01L31/02 , H01L23/00 , H01L21/78
CPC分类号： H01L31/167 , H01L21/31053 , H01L21/561 , H01L21/565 , H01L21/78 , H01L23/3135 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L23/562 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L31/02005 , H01L31/0203 , H01L31/048 , H01L31/12 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48106 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/12041 , H01L2924/12043 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/35121 , Y02E10/50 , H01L2924/00012 , H01L2924/014 , H01L2224/85 , H01L2224/83 , H01L2224/45099 , H01L2924/00 , H01L2224/37099
摘要： A packaged semiconductor device includes a substrate, a die, at least one electrical connector, a first mold compound formed of translucent material, and a second mold compound. A first face of the die is electrically and mechanically coupled to the substrate. The at least one electrical connector electrically couples at least one electrical contact on a second face of the die with at least one conductive path of the substrate. The first mold compound formed of a translucent material at least partially encapsulates the die and the at least one electrical connector. The second mold compound at least partially encapsulates the first mold compound and forms a window through which the first mold compound is exposed. In implementations the second mold compound is opaque and the first mold compound is transparent. In implementations the substrate includes a lead frame having a die flag and a plurality of lead frame fingers.
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公开(公告)号：US20240332148A1
公开(公告)日：2024-10-03
申请号：US18617325
申请日：2024-03-26
IPC分类号： H01L23/498 , H01L21/48 , H01L23/00 , H01L23/367 , H01L23/473 , H01L25/07
CPC分类号： H01L23/49811 , H01L21/4853 , H01L23/3677 , H01L23/473 , H01L24/40 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/40137 , H01L2224/40227 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49176
摘要： A single side direct cooling (SSDC) package is disclosed for use in high-power electronic device modules in electric vehicles and industrial applications. The power modules route large currents through a set of metal power tabs instead of passing high currents through conductive layers of a direct bonded metal structure. By orienting the metal power tabs in a mini-heart design, stray inductance and resistance can both be reduced, thereby improving performance while simultaneously reducing the footprint of the high power module. In addition, wire bonds between chip assemblies in a high-power semiconductor device module can be replaced by solid metal clips that can better withstand high currents and voltages. The SSDC package incorporates the metal power tabs and provides heat dissipation via a metal base plate that includes a heat sink. The heat sink can be immersed in a cooling fluid to provide faster heat dissipation.
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公开(公告)号：US20210035956A1
公开(公告)日：2021-02-04
申请号：US16678039
申请日：2019-11-08
IPC分类号： H01L25/07 , H01L25/00 , H01L23/00 , H01L23/367
摘要： Implementations of semiconductor packages may include: a first substrate having two or more die coupled to a first side, a clip coupled to each of the two or more die on the first substrate and a second substrate having two or more die coupled to a first side of the second substrate. A clip may be coupled to each of the two or more die on the second substrate. The package may include two or more spacers coupled to the first side of the first substrate and a lead frame between the first substrate and the second substrate and a molding compound. A second side of each of the first substrate and the second substrate may be exposed through the molding compound. A perimeter of the first substrate and a perimeter of the second substrate may not fully overlap when coupled through the two or more spacers.
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公开(公告)号：US20200373231A1
公开(公告)日：2020-11-26
申请号：US16502441
申请日：2019-07-03
发明人： Chee Hiong CHEW , Yushuang YAO , Atapol PRAJUCKAMOL , Chuncao NIU
IPC分类号： H01L23/498 , H05K1/18 , H01L23/40 , H01L23/538 , H01L23/00
摘要： A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.
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