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公开(公告)号:US20200032064A1
公开(公告)日:2020-01-30
申请号:US16480283
申请日:2018-01-29
发明人: Yuko Kawahara , Keigo Oowashi , Kouji Ashiba , Masataka Sugimoto
IPC分类号: C08L101/00 , C08K3/38 , B32B27/20 , B32B27/26 , H01L23/373 , H01B3/30 , H01B3/00
摘要: Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and effectively controlling the variation in dielectric breakdown strength. A resin material according to the present invention includes first boron nitride aggregate particles, second boron nitride aggregate particles, and a binder resin, and a 10% K value of the second boron nitride aggregate particles is smaller than a 30% K value of the second boron nitride aggregate particles, and a 30% K value of the second boron nitride aggregate particles is smaller than a 10% K value of the first boron nitride aggregate particles.
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公开(公告)号:US11383499B2
公开(公告)日:2022-07-12
申请号:US16611148
申请日:2018-05-09
发明人: Masataka Sugimoto , Keigo Oowashi , Kouji Ashiba , Yuko Kawahara
IPC分类号: B32B27/18 , C08K3/38 , C01B21/064
摘要: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing variation in the adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average aspect ratio of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average aspect ratio of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.
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公开(公告)号:US20210139761A1
公开(公告)日:2021-05-13
申请号:US16623172
申请日:2018-06-21
发明人: Yuko Kawahara , Keigo Oowashi , Kouji Ashiba , Rui Zhang , Osamu Inui , Hiroshi Maenaka
IPC分类号: C09K5/14 , C08K3/08 , C08K3/38 , B32B27/20 , B32B27/36 , B32B27/34 , B32B27/08 , B32B7/06 , B32B15/09 , B32B15/20
摘要: Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.
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公开(公告)号:US20200090831A1
公开(公告)日:2020-03-19
申请号:US16611176
申请日:2018-05-09
发明人: Masataka Sugimoto , Keigo Oowashi , Kouji Ashiba , Yuko Kawahara
摘要: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing generation of voids. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average major diameter of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average major diameter of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.
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公开(公告)号:US20200079063A1
公开(公告)日:2020-03-12
申请号:US16611148
申请日:2018-05-09
发明人: Masataka Sugimoto , Keigo Oowashi , Kouji Ashiba , Yuko Kawahara
IPC分类号: B32B27/18 , C08K3/38 , C01B21/064
摘要: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing variation in the adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average aspect ratio of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average aspect ratio of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.
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公开(公告)号:US20190352486A1
公开(公告)日:2019-11-21
申请号:US16480626
申请日:2018-01-29
发明人: Yuko Kawahara , Keigo Oowashi , Kouji Ashiba , Masataka Sugimoto
摘要: Provided is a resin material capable of effectively improving the insulating properties and the long-term reliability, effectively controlling the variation in dielectric breakdown strength, and effectively increasing the adhesion. A resin material according to the present invention includes first boron nitride aggregate particles, second boron nitride aggregate particles, and a binder resin, and the first boron nitride aggregate particles have a porosity of less than 30%, the second boron nitride aggregate particles have a porosity of 30% or more, and each of an aspect ratio of primary particles constituting the first boron nitride aggregate particles, and an aspect ratio of primary particles constituting the second boron nitride aggregate particles is 7 or less.
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公开(公告)号:US11884039B2
公开(公告)日:2024-01-30
申请号:US16611094
申请日:2018-05-09
发明人: Masataka Sugimoto , Keigo Oowashi , Kouji Ashiba , Yuko Kawahara
CPC分类号: B32B27/20 , B32B27/18 , C08K3/38 , B32B2264/10 , B32B2307/202 , B32B2307/206 , C08K2003/385 , C08K2201/001 , C08K2201/005 , C08K2201/016 , Y10T428/25
摘要: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and a thermally conductive filler, the thermally conductive filler contains boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first content of the boron nitride in 100% by volume of a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second content of the boron nitride in 100% by volume of a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.
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公开(公告)号:US11827766B2
公开(公告)日:2023-11-28
申请号:US16479845
申请日:2018-01-29
发明人: Yuko Kawahara , Keigo Oowashi , Kouji Ashiba , Masataka Sugimoto
IPC分类号: C08K3/38 , B32B27/20 , B32B27/38 , B32B15/092 , B32B15/20 , B32B27/26 , H01L23/373
CPC分类号: C08K3/38 , B32B15/092 , B32B15/20 , B32B27/20 , B32B27/26 , B32B27/38 , H01L23/3735 , B32B2264/107 , B32B2307/302 , B32B2307/304 , C08K2003/385 , C08K2201/001 , C08K2201/003 , C08K2201/014 , C08K2201/016
摘要: Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and further effectively controlling the variation in dielectric breakdown strength, and further effectively increasing the adhesion. A resin material according to the present invention includes first inorganic particles, second inorganic particles, and a binder resin, and a ratio of a compressive strength at 10% compression of the first inorganic particles to a compressive strength at 10% compression of the second inorganic particles is 2.5 or more, the second inorganic particles have a compressive strength at 10% compression of 1.5 N/mm2 or less, and the second inorganic particles include primary particles having an aspect ratio of 7 or less.
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公开(公告)号:US11798863B2
公开(公告)日:2023-10-24
申请号:US16770186
申请日:2018-12-07
发明人: Kouji Ashiba , Keigo Oowashi , Aki Koukami , Rui Zhang
IPC分类号: B32B15/08 , B32B27/20 , B32B15/092 , H01L23/373 , B32B3/10 , H01L21/48 , H01L23/00
CPC分类号: H01L23/3735 , B32B3/10 , B32B15/08 , B32B15/092 , B32B27/20 , H01L21/4882 , H01L24/73 , B32B2264/10 , B32B2264/102 , B32B2264/107 , B32B2307/206 , B32B2307/304 , B32B2457/00 , H01L2224/32225 , H01L2224/73265 , H01L2924/0503 , H01L2924/05032 , H01L2924/0532 , H01L2924/05432 , H01L2924/15787 , H01L2924/15798
摘要: The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate (1) according to the present invention includes a metal substrate (4), an insulating layer (2) laminated on one surface of the metal substrate (4), and a patterned metal layer (3) laminated on the surface of the insulating layer (2) on the side opposite to the metal substrate (4), the metal layer (3) is 300 μm or more in thickness, and the insulating layer (2) includes boron nitride (12) and an inorganic filler (13) other than boron nitride.
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公开(公告)号:US11492528B2
公开(公告)日:2022-11-08
申请号:US16623172
申请日:2018-06-21
发明人: Yuko Kawahara , Keigo Oowashi , Kouji Ashiba , Rui Zhang , Osamu Inui , Hiroshi Maenaka
IPC分类号: B32B7/06 , B32B15/09 , B32B15/20 , B32B27/08 , B32B27/20 , B32B27/34 , B32B27/36 , B32B27/06 , B32B27/18 , C09K5/14 , C08K7/00 , C08K3/08 , C08K3/38 , H05K3/38 , H05K7/20 , B32B37/10 , H01L23/373 , H05K1/03
摘要: Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.
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