公开(公告)号：US20250136374A1

公开(公告)日：2025-05-01

申请号：US18608425

申请日：2024-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seong Sil JEONG ,  Youn Gon Oh ,  Sang Hyuk Park

IPC: B65G1/04

Abstract: A transport vehicle includes: a frame having an internal area; a driver on top of the frame, the driver being configured to travel along a rail; a support structure in the internal area, the support structure being configured to seat, thereon, a drone configured to transport an article; and a controller configured to control an operation of at least one of the driver and the support structure.

公开(公告)号：US20160202290A1

公开(公告)日：2016-07-14

申请号：US14959641

申请日：2015-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngin KIM ,  Jungho KIM ,  Jongsam KIM ,  Byung-Soo PARK ,  Sookil PARK ,  Byungkook YOO ,  Seong Sil JEONG ,  Wooseong CHOI

IPC: G01R1/04 ,  G01R1/073

CPC classification number: G01R31/2893

Abstract: Probe card transfer units and probe card management apparatuses including the same may be provided. The transfer unit includes a hand part including grippers holding a package and a moving part moving the hand part. Each of the grippers includes at least one locking pin protruding from a holding bar, which extends in a direction perpendicular to the holding bar, to securely hold the package.

Abstract translation: 可以提供包括其的探针卡传送单元和探针卡管理装置。 转印单元包括手部，其包括保持包装的夹持器和移动手部的移动部。 每个夹持器包括从保持杆突出的至少一个锁定销，其沿垂直于保持杆的方向延伸，以牢固地保持包装。

公开(公告)号：US20230101674A1

公开(公告)日：2023-03-30

申请号：US17718754

申请日：2022-04-12

Applicant: SAMSUNG ELECTRONICS Co., LTD.

Inventor： Youn Gon OH ,  Ji Hun KIM ,  SaeYun KO ,  Gil Ho GU ,  Dong Su KIM ,  Eun Hee LEE ,  Ho Chan LEE ,  Seong Sil JEONG ,  Seong Pyo HONG

IPC: H01L21/673 ,  H01L21/66

Abstract: Provided is a tray including a plate including a first region and a second region, a first groove on the first region of the plate and to which a stub is fixed, and a second groove on the second region of the plate and to which a grid holder is fixed, wherein the stub is configured to store test wafer pieces, and wherein the grid holder is configured to store a test sample.

公开(公告)号：US20230067060A1

公开(公告)日：2023-03-02

申请号：US17690317

申请日：2022-03-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youn Gon OH ,  Ji Hun KIM ,  Sae Yun KO ,  Gil Ho GU ,  Dong Su KIM ,  Eun Hee LEE ,  Ho Chan LEE ,  Seong Sil JEONG ,  Seong Pyo HONG

IPC: G01R31/28 ,  H01L21/673 ,  H01L21/677

Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

公开(公告)号：US20160185535A1

公开(公告)日：2016-06-30

申请号：US14955432

申请日：2015-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngin KIM ,  Jongsam KIM ,  Byung-Soo PARK ,  Sookil PARK ,  Byungkook YOO ,  Younghyen LEE ,  Seong Sil JEONG ,  Wooseong CHOI

IPC: B65G47/90 ,  G01R31/26 ,  G01R1/04

CPC classification number: G01R31/2601 ,  G01R31/2889 ,  G01R31/2893

Abstract: A loading apparatus is provided which includes a package jig, a transfer unit, and a load port. The package jig is fixed to a package. The transfer unit includes a hand for holding the package jig and transferring the package. The package transferred by the transfer unit is loaded on the load port. The load port and the hand include first alignment pins and first alignment sockets for aligning the package to the load port.

Abstract translation: 提供一种装载装置，其包括封装夹具，转印单元和装载端口。 包装夹具固定在包装上。 传送单元包括用于保持包装夹具并传送包装的手。 由传送单元传送的包裹装载在装载端口上。 装载端口和手包括第一对准销和用于使包装与装载端口对准的第一对准插座。