公开(公告)号：US20230101674A1

公开(公告)日：2023-03-30

申请号：US17718754

申请日：2022-04-12

Applicant: SAMSUNG ELECTRONICS Co., LTD.

Inventor： Youn Gon OH ,  Ji Hun KIM ,  SaeYun KO ,  Gil Ho GU ,  Dong Su KIM ,  Eun Hee LEE ,  Ho Chan LEE ,  Seong Sil JEONG ,  Seong Pyo HONG

IPC: H01L21/673 ,  H01L21/66

Abstract: Provided is a tray including a plate including a first region and a second region, a first groove on the first region of the plate and to which a stub is fixed, and a second groove on the second region of the plate and to which a grid holder is fixed, wherein the stub is configured to store test wafer pieces, and wherein the grid holder is configured to store a test sample.