公开(公告)号：US11984415B2

公开(公告)日：2024-05-14

申请号：US17528954

申请日：2021-11-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yukyung Park ,  Ungcheon Kim ,  Wonil Lee

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/544 ,  H01L25/10 ,  H01L25/18 ,  H01L23/48

CPC classification number: H01L24/02 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L25/105 ,  H01L25/18 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/04 ,  H01L2223/54426 ,  H01L2224/0213 ,  H01L2224/02141 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/03019 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05019 ,  H01L2224/05025 ,  H01L2224/05082 ,  H01L2224/0603 ,  H01L2224/06182

Abstract: An interposer according to an embodiment of the present invention includes a base layer having opposite first and second surfaces, a wiring structure on the first surface of the base layer, an interposer protective layer disposed on the second surface of the base layer and having a pad recess with a lower surface of the interposer protective layer positioned at a first vertical level and a bottom surface of the pad recess positioned at a second vertical level that is higher than the first vertical level, an interposer pad of which a portion fills the pad recess of the interposer protective layer and the remaining portion protrudes from the interposer protective layer, and an interposer through electrode extending through the base layer and the interposer protective layer to the interposer pad, the interposer through electrode electrically connecting the wiring structure to the interposer pad.

公开(公告)号：US11195785B2

公开(公告)日：2021-12-07

申请号：US16891443

申请日：2020-06-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yukyung Park ,  Seungkwan Ryu ,  Yunseok Choi

IPC: H01L23/12 ,  H01L23/14 ,  H01L23/48 ,  H01L21/00 ,  H01L21/44 ,  H01L23/498 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/768 ,  H01L21/48 ,  H01L23/532

Abstract: An interposer includes a base layer having a first surface and a second surface, a redistribution structure on the first surface, an interposer protection layer on the second surface, a pad wiring layer on the interposer protection layer, an interposer through electrode passing through the base layer and the interposer protection layer and electrically connecting the redistribution structure to the pad wiring layer, an interposer connection terminal attached to the pad wiring layer, and a wiring protection layer including a first portion covering a portion of the interposer protection layer adjacent to the pad wiring layer, a second portion covering a portion of a top surface of the pad wiring layer, and a third portion covering a side surface of the pad wiring layer. The third portion is disposed between the first portion and the second portion. The first to third portions have thicknesses different from each other.

公开(公告)号：US20210167001A1

公开(公告)日：2021-06-03

申请号：US16891443

申请日：2020-06-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yukyung Park ,  Seungkwan Ryu ,  Yunseok Choi

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/31

Abstract: An interposer includes a base layer having a first surface and a second surface, a redistribution structure on the first surface, an interposer protection layer on the second surface, a pad wiring layer on the interposer protection layer, an interposer through electrode passing through the base layer and the interposer protection layer and electrically connecting the redistribution structure to the pad wiring layer, an interposer connection terminal attached to the pad wiring layer, and a wiring protection layer including a first portion covering a portion of the interposer protection layer adjacent to the pad wiring layer, a second portion covering a portion of a top surface of the pad wiring layer, and a third portion covering a side surface of the pad wiring layer. The third portion is disposed between the first portion and the second portion. The first to third portions have thicknesses different from each other.

公开(公告)号：US11728255B2

公开(公告)日：2023-08-15

申请号：US17154067

申请日：2021-01-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ungcheon Kim ,  Sungwoo Park ,  Yukyung Park ,  Seungkwan Ryu

IPC: H01L23/498 ,  H01L21/48 ,  H01L25/18

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49838 ,  H01L25/18

Abstract: An interposer including a base layer, a redistribution structure on a first surface of the base layer and including a conductive redistribution pattern, a first lower protection layer on a second surface of the base layer, a lower conductive pad on the first lower protection layer, a through electrode connecting the conductive redistribution pattern and the lower conductive pad, a second lower protection layer on the first lower protection layer, including a different material than the first lower protection layer, and contacting at least a portion of the lower conductive pad, and an indentation formed in an outer edge region of the interposer to provide a continuous angled sidewall extending entirely through the second lower protection layer and through at least a portion of the first protection layer.

公开(公告)号：US11482483B2

公开(公告)日：2022-10-25

申请号：US17038306

申请日：2020-09-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yukyung Park ,  Ungcheon Kim ,  Sungwoo Park ,  Seungkwan Ryu

IPC: H01L23/498 ,  H01L23/538 ,  H01L25/18 ,  H01L21/48 ,  H01L23/544

Abstract: Provided is an interposer for a semiconductor package, the interposer including an interposer substrate comprising a first main surface and a second main surface opposite to the first main surface, a first through-electrode structure and a second through-electrode structure each passing through the interposer substrate and protruding from the first main surface, a connection terminal structure contacting both the first through-electrode structure and the second through-electrode structure, and a photosensitive polymer layer arranged between the connection terminal structure and the interposer substrate, and between the first through-electrode structure and the second through-electrode structure.

公开(公告)号：US20240274553A1

公开(公告)日：2024-08-15

申请号：US18643474

申请日：2024-04-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yukyung Park ,  Ungcheon Kim ,  Wonil Lee

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01L23/544 ,  H01L25/10 ,  H01L25/18

CPC classification number: H01L24/02 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L25/105 ,  H01L25/18 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/04 ,  H01L2223/54426 ,  H01L2224/0213 ,  H01L2224/02141 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/03019 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05019 ,  H01L2224/05025 ,  H01L2224/05082 ,  H01L2224/0603 ,  H01L2224/06182

Abstract: An interposer according to an embodiment of the present invention includes a base layer having opposite first and second surfaces, a wiring structure on the first surface of the base layer, an interposer protective layer disposed on the second surface of the base layer and having a pad recess with a lower surface of the interposer protective layer positioned at a first vertical level and a bottom surface of the pad recess positioned at a second vertical level that is higher than the first vertical level, an interposer pad of which a portion fills the pad recess of the interposer protective layer and the remaining portion protrudes from the interposer protective layer, and an interposer through electrode extending through the base layer and the interposer protective layer to the interposer pad, the interposer through electrode electrically connecting the wiring structure to the interposer pad.

公开(公告)号：US20230352386A1

公开(公告)日：2023-11-02

申请号：US18347519

申请日：2023-07-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ungcheon Kim ,  Sungwoo Park ,  Yukyung Park ,  Seungkwan Ryu

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49822 ,  H01L23/49838 ,  H01L21/4857 ,  H01L23/49816 ,  H01L25/18

Abstract: An interposer including a base layer, a redistribution structure on a first surface of the base layer and including a conductive redistribution pattern, a first lower protection layer on a second surface of the base layer, a lower conductive pad on the first lower protection layer, a through electrode connecting the conductive redistribution pattern and the lower conductive pad, a second lower protection layer on the first lower protection layer, including a different material than the first lower protection layer, and contacting at least a portion of the lower conductive pad, and an indentation formed in an outer edge region of the interposer to provide a continuous angled sidewall extending entirely through the second lower protection layer and through at least a portion of the first protection layer.

公开(公告)号：US20230052195A1

公开(公告)日：2023-02-16

申请号：US17971321

申请日：2022-10-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yukyung Park ,  Ungcheon Kim ,  Sungwoo Park ,  Seungkwan Ryu

IPC: H01L23/498 ,  H01L25/18 ,  H01L21/48 ,  H01L23/538

Abstract: Provided is an interposer for a semiconductor package, the interposer including an interposer substrate comprising a first main surface and a second main surface opposite to the first main surface, a first through-electrode structure and a second through-electrode structure each passing through the interposer substrate and protruding from the first main surface, a connection terminal structure contacting both the first through-electrode structure and the second through-electrode structure, and a photosensitive polymer layer arranged between the connection terminal structure and the interposer substrate, and between the first through-electrode structure and the second through-electrode structure.

公开(公告)号：US20220302053A1

公开(公告)日：2022-09-22

申请号：US17528954

申请日：2021-11-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yukyung Park ,  Ungcheon Kim ,  Wonil Lee

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/544 ,  H01L25/10 ,  H01L25/18 ,  H01L21/48

Abstract: An interposer according to an embodiment of the present invention includes a base layer having opposite first and second surfaces, a wiring structure on the first surface of the base layer, an interposer protective layer disposed on the second surface of the base layer and having a pad recess with a lower surface of the interposer protective layer positioned at a first vertical level and a bottom surface of the pad recess positioned at a second vertical level that is higher than the first vertical level, an interposer pad of which a portion fills the pad recess of the interposer protective layer and the remaining portion protrudes from the interposer protective layer, and an interposer through electrode extending through the base layer and the interposer protective layer to the interposer pad, the interposer through electrode electrically connecting the wiring structure to the interposer pad.

公开(公告)号：US20210175161A1

公开(公告)日：2021-06-10

申请号：US17038306

申请日：2020-09-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yukyung Park ,  Ungcheon Kim ,  Sungwoo Park ,  Seungkwan Ryu

IPC: H01L23/498 ,  H01L25/18 ,  H01L21/48 ,  H01L23/538

Abstract: Provided is an interposer for a semiconductor package, the interposer including an interposer substrate comprising a first main surface and a second main surface opposite to the first main surface, a first through-electrode structure and a second through-electrode structure each passing through the interposer substrate and protruding from the first main surface, a connection terminal structure contacting both the first through-electrode structure and the second through-electrode structure, and a photosensitive polymer layer arranged between the connection terminal structure and the interposer substrate, and between the first through-electrode structure and the second through-electrode structure.