公开(公告)号：US11532572B2

公开(公告)日：2022-12-20

申请号：US17357542

申请日：2021-06-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoo Rim Cha ,  Joo Hwan Jung ,  Jung Chul Gong ,  Yong Ho Baek ,  Young Sik Hur

IPC: H01L23/64 ,  H01L23/13 ,  H01L23/498

Abstract: A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.

公开(公告)号：US11469193B2

公开(公告)日：2022-10-11

申请号：US16983771

申请日：2020-08-03

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Doo Il Kim ,  Dae Kwon Jung ,  Young Sik Hur ,  Yong Ho Baek

IPC: H01L27/14 ,  H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01Q9/04

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer, an antenna package including a plurality of antenna members transmitting or receiving a radio frequency (RF) signal and a plurality of feed vias respectively electrically connected to the plurality of antenna members at one end and respectively electrically connected to a wiring corresponding to the at least one wiring layer at the other end, and positioned on a first surface of the connection member, an integrated circuit (IC) disposed on a second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer to receive an intermediate frequency (IF) signal or baseband signal and transfer an RF signal or receive an RF signal and transfer an IF signal or baseband signal, and a filter filtering an IF signal or a baseband signal.

公开(公告)号：US10790595B2

公开(公告)日：2020-09-29

申请号：US15949386

申请日：2018-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Il Kim ,  Young Sik Hur ,  Yong Ho Baek ,  Jin Seon Park

IPC: H01Q9/04 ,  H01Q21/06 ,  H01Q23/00 ,  G06K19/077 ,  H01Q1/38 ,  H01Q1/22

Abstract: An antenna module includes a connection member, an integrated circuit (IC), a dielectric layer, antenna members, feed vias, and a plating member. The connection member includes one or more wiring layer(s) and insulating layer(s). The IC is disposed on one surface of the connection member and is electrically connected to the wiring layer(s). The dielectric layer is disposed on another surface of the connection member. The antenna members are disposed in the dielectric layer, and the feed vias are disposed in the dielectric layer so that each has one end electrically connected to a corresponding antenna member and the other end electrically connected to a corresponding one of the wiring layer(s). The plating member is disposed in the dielectric layer to surround side surfaces of the feed vias. The dielectric layer has a dielectric constant Dk greater than that of at least one insulating layer.

公开(公告)号：US11909099B2

公开(公告)日：2024-02-20

申请号：US17517874

申请日：2021-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won Wook So ,  Jin Seon Park ,  Young Sik Hur ,  Jung Chul Gong ,  Yong Ho Baek

IPC: H01Q1/22 ,  H01Q1/24 ,  H01L23/00 ,  H01L23/66 ,  H01L23/31 ,  H01L23/522

CPC classification number: H01Q1/2283 ,  H01L23/3107 ,  H01L23/5226 ,  H01L23/66 ,  H01L24/09 ,  H01L24/17 ,  H01L24/33 ,  H01Q1/243 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/02377 ,  H01L2224/02379

Abstract: An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate.

公开(公告)号：US11217543B2

公开(公告)日：2022-01-04

申请号：US16941697

申请日：2020-07-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Il Kim ,  Yong Ho Baek ,  Jin Seon Park ,  Young Sik Hur

IPC: H01L23/66 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22 ,  H01L23/31 ,  H01Q1/52 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q1/24

Abstract: An antenna module includes a fan-out semiconductor package including an IC, an encapsulant encapsulating at least a portion of the IC, a core member having a first side surface facing the IC or the encapsulant, and a connection member including at least one wiring layer electrically connected to the IC and the core member and at least one insulating layer; and an antenna package including a plurality of first directional antenna members configured to transmit or receive a first RF signal. The fan-out semiconductor package further includes at least one second directional antenna member disposed on a second side surface of the core member opposing the first side surface of the core member, stood up from a position electrically connected to at least one wiring layer, and configured to transmit or receive a second RF signal.

公开(公告)号：US11075175B2

公开(公告)日：2021-07-27

申请号：US16285606

申请日：2019-02-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoo Rim Cha ,  Joo Hwan Jung ,  Jung Chul Gong ,  Yong Ho Baek ,  Young Sik Hur

IPC: H01L23/64 ,  H01L23/13 ,  H01L23/498

Abstract: A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.

公开(公告)号：US10811379B2

公开(公告)日：2020-10-20

申请号：US16287064

申请日：2019-02-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Il Kim ,  Yong Ho Baek ,  Won Wook So ,  Young Sik Hur

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/04

Abstract: A semiconductor package includes a semiconductor chip including a body, a connection pad, a passivation film, a first connection bump disposed, and a first coating layer; an encapsulant covering at least a portion of the semiconductor chip; and a connection structure including an insulating layer, a redistribution layer, and a connection via. The first connection bump includes a low melting point metal, the redistribution layer and the connection via include a conductive material, and the low melting point metal has a melting point lower than a melting point of the conductive material.

公开(公告)号：US10763225B2

公开(公告)日：2020-09-01

申请号：US15949439

申请日：2018-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Il Kim ,  Yong Ho Baek ,  Jin Seon Park ,  Young Sik Hur

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/552 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q1/24

Abstract: An antenna module includes a fan-out semiconductor package including an IC, an encapsulant encapsulating at least a portion of the IC, a core member having a first side surface facing the IC or the encapsulant, and a connection member including at least one wiring layer electrically connected to the IC and the core member and at least one insulating layer; and an antenna package including a plurality of first directional antenna members configured to transmit or receive a first RF signal. The fan-out semiconductor package further includes at least one second directional antenna member disposed on a second side surface of the core member opposing the first side surface of the core member, stood up from a position electrically connected to at least one wiring layer, and configured to transmit or receive a second RF signal.

公开(公告)号：US10547119B2

公开(公告)日：2020-01-28

申请号：US15972905

申请日：2018-05-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Il Kim ,  Jung Hyun Cho ,  Won Wook So ,  Young Sik Hur ,  Yong Ho Baek

IPC: H01Q21/00 ,  H01Q1/02 ,  H01Q1/38 ,  H01Q21/28 ,  H01Q1/22 ,  H01Q3/24 ,  H01Q1/24

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) package disposed on a first surface of the connection member; and an antenna package including a plurality of antenna members and a plurality of feed vias, and disposed on a second surface of the connection member, wherein the IC package includes: an IC having an active surface electrically connected to at least one wiring layer and an inactive surface opposing the active surface, and generating the RF signal; a heat sink member disposed on the inactive surface of the IC; and an encapsulant encapsulating at least portions of the IC and the heat sink member.

公开(公告)号：US10475756B2

公开(公告)日：2019-11-12

申请号：US16218203

申请日：2018-12-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Ho Baek ,  Doo Il Kim ,  Young Sik Hur ,  Jung Hyun Cho ,  Won Wook So

IPC: H01L23/66 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00

Abstract: A composite antenna substrate and semiconductor package module includes: a fan-out semiconductor package including a semiconductor chip, an encapsulant encapsulating at least portions of the semiconductor chip, and a connection member including a redistribution layer electrically connected to connection pads; and an antenna substrate including an antenna member including antenna patterns, ground patterns, and feed lines, and a wiring member disposed below the antenna member and including wiring layers including feeding patterns electrically connected to the feed lines.