INTEGRATED CIRCUIT DEVICES HAVING BURIED WORD LINES THEREIN AND METHODS OF FORMING THE SAME

    公开(公告)号:US20250113482A1

    公开(公告)日:2025-04-03

    申请号:US18980204

    申请日:2024-12-13

    Abstract: An integrated circuit device includes a substrate having an active region and a word line trench therein. The word line trench includes a lower portion having a first width, and an upper portion, which extends between the lower portion and a surface of the substrate. A word line is provided, which extends in and adjacent a bottom of the word line trench. A gate insulation layer is provided, which extends between the word line and sidewalls of the lower portion of the word line trench. An electrically insulating gate capping layer is provided in the upper portion of the word line trench. An insulation liner is provided, which extends between the gate capping layer and sidewalls of the upper portion of the word line trench. The gate insulation layer extends between the insulation liner and a portion of the gate capping layer.

    Electronic device, and method for displaying content in electronic device

    公开(公告)号:US12026339B2

    公开(公告)日:2024-07-02

    申请号:US18126197

    申请日:2023-03-24

    CPC classification number: G06F3/04166 G06F2203/04102

    Abstract: An electronic device a flexible display including a first area and a second area extending from the first area, the second area being configured to be inserted into an inside of a housing of the electronic device or exposed to an outside of the housing; and a processor configured to, based on detecting an enlarge event or a shrink event on the display while displaying content on the display in a state in which the first area is exposed and the second area is inserted in or exposed from the housing, resize the display by exposing the second area according to an enlarging ratio corresponding to the enlarge event or inserting the second area according to an shrinking ratio corresponding to the shrink event, and display content resized according to in the enlarging ratio or the shrinking ratio on the resized display.

    Method of controlling the supply of power and electronic device and adapted thereto

    公开(公告)号:US10411465B2

    公开(公告)日:2019-09-10

    申请号:US15172219

    申请日:2016-06-03

    Abstract: An electronic device includes a connector for connecting to an external device; a battery; and a controller operatively coupled to the connector and the battery. The controller includes a power controller configured to: supply the external device with a first signal having a first voltage level in response to detecting that the external device is connected to the connector. The external device is supplied with a second signal having a second voltage level that differs from the first voltage level, in response to detecting that the external device is connected to an external power supply. The first signal is generated at least in part by the battery.

    Electronic device for updating firmware by using security integrated circuit and operation method thereof

    公开(公告)号:US11385880B2

    公开(公告)日:2022-07-12

    申请号:US17033367

    申请日:2020-09-25

    Abstract: An apparatus and a method for updating firmware by using a security integrated circuit in an electronic device. An electronic device may include a security integrated circuit (IC) providing a rich execution environment and a secure execution environment. The security integrated circuit includes a main processor operating in the rich execution environment and a secure processor operating in the secure execution environment. The secure processor is configured to perform user authentication based on firmware update information received from a server through the main processor. If the user authentication is successful, authentication information is generated corresponding to the firmware update information and stored in at least a part of a secure memory. If the firmware is installed, authentication of the firmware is performed based on the authentication information stored in the secure memory, and if the authentication of the firmware is successful, the firmware is installed.

    Method for compensating for pressure value of force sensor and electronic device using same

    公开(公告)号:US11068150B2

    公开(公告)日:2021-07-20

    申请号:US16762750

    申请日:2018-12-27

    Abstract: Various embodiments of the present invention relate to a method for compensating for a pressure value of a force sensor and an electronic device using the same, the electronic device comprising: a touch screen display; a force sensor bonded to a lower portion of the touch screen display; a memory; and a processor electrically connected to the touch screen display, the force sensor, and the memory, wherein the processor is configured to: obtain a pressure value of the touch screen display and a pressure value of the force sensor; measure the correlation between the obtained pressure value of the touch screen display and the pressure value of the force sensor; identify a spacing state between the touch screen display and the force sensor by using the correlation; determine whether the spacing state is of a predetermined distance or less and compensate for the pressure value for determining whether to operate the force sensor by using a predetermined reference value when the spacing state is of the predetermined distance or less, thereby sensing the spacing state in real time when spacing occurs between the touch screen display and the force sensor of the electronic device, and compensating for the pressure value of the force sensor such that user convenience can be improved. In addition to the embodiments disclosed in the present invention, other various embodiments are possible.

    INTEGRATED CIRCUIT DEVICES HAVING BURIED WORD LINES THEREIN AND METHODS OF FORMING THE SAME

    公开(公告)号:US20220344344A1

    公开(公告)日:2022-10-27

    申请号:US17720664

    申请日:2022-04-14

    Abstract: An integrated circuit device includes a substrate having an active region and a word line trench therein. The word line trench includes a lower portion having a first width, and an upper portion, which extends between the lower portion and a surface of the substrate and has a second width that is greater than the first width. A word line is provided, which extends in and adjacent a bottom of the word line trench. A gate insulation layer is provided, which extends between the word line and sidewalls of the lower portion of the word line trench. An electrically insulating gate capping layer is provided in the upper portion of the word line trench. An insulation liner is provided, which extends between the gate capping layer and sidewalls of the upper portion of the word line trench. The gate insulation layer extends between the insulation liner and a portion of the gate capping layer, which extends within the upper portion of the word line trench.

    Electronic device for updating firmware by using security integrated circuit and operation method thereof

    公开(公告)号:US11429366B2

    公开(公告)日:2022-08-30

    申请号:US17033367

    申请日:2020-09-25

    Abstract: An apparatus and a method for updating firmware by using a security integrated circuit in an electronic device. An electronic device may include a security integrated circuit (IC) providing a rich execution environment and a secure execution environment. The security integrated circuit includes a main processor operating in the rich execution environment and a secure processor operating in the secure execution environment. The secure processor is configured to perform user authentication based on firmware update information received from a server through the main processor. If the user authentication is successful, authentication information is generated corresponding to the firmware update information and stored in at least a part of a secure memory. If the firmware is installed, authentication of the firmware is performed based on the authentication information stored in the secure memory, and if the authentication of the firmware is successful, the firmware is installed.

    PROXIMITY CORRECTION METHODS FOR SEMICONDUCTOR MANUFACTURING PROCESSES

    公开(公告)号:US20210405521A1

    公开(公告)日:2021-12-30

    申请号:US17180984

    申请日:2021-02-22

    Abstract: A proximity correction method for a semiconductor manufacturing process includes: generating a plurality of pieces of original image data from a plurality of sample regions, with the sample regions selected from layout data used in the semiconductor manufacturing process; removing some pieces of original image data that overlap with each other from the plurality of pieces of original image data, resulting in a plurality of pieces of input image data; inputting the plurality of pieces of input image data to a machine learning model; obtaining a prediction value of critical dimensions of target patterns included in the plurality of pieces of input image data from the machine learning model; measuring a result value for critical dimensions of actual patterns corresponding to the target patterns on a semiconductor substrate on which the semiconductor manufacturing process is performed; and performing learning of the machine learning model using the prediction value and the result value.

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