公开(公告)号：US20230086253A1

公开(公告)日：2023-03-23

申请号：US17740649

申请日：2022-05-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seonho LEE ,  Wonkeun KIM ,  Myoungchul EUM

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/82 ,  C08L75/04 ,  C09J133/08 ,  C08L29/04 ,  C08L39/06

Abstract: A method includes preparing a protective film including a base film and a protective layer laminated on a surface of the base film, mounting the protective film on a semiconductor wafer having a rear surface attached to a dicing tape and a front surface positioned opposite to the rear surface, the protective layer being disposed on the front surface, irradiating the rear surface of the semiconductor wafer with a dicing laser, removing the base film of the protective film from the semiconductor wafer, dividing the semiconductor wafer into individual semiconductor chips, and removing the protective layer from the individual semiconductor chips.

公开(公告)号：US20240087940A1

公开(公告)日：2024-03-14

申请号：US18243725

申请日：2023-09-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheonil PARK ,  Myoungchul EUM

IPC: H01L21/683 ,  C09J7/29 ,  C09J7/38

CPC classification number: H01L21/6836 ,  C09J7/29 ,  C09J7/385 ,  C09J2203/326 ,  C09J2301/416 ,  C09J2433/00 ,  H01L2221/68327 ,  H01L2221/68386

Abstract: A wafer temporary adhesive tape includes a device adhesive layer configured to be attached to a device wafer, a base layer on the device adhesive layer, and a carrier adhesive layer on the base layer and configured to be attached to a carrier wafer, wherein the base layer includes a laser decomposable material layer that can be chemically decomposed by absorbing a laser beam.

公开(公告)号：US20240145417A1

公开(公告)日：2024-05-02

申请号：US18205721

申请日：2023-06-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeongwoo JIN ,  Myoungchul EUM

IPC: H01L23/00 ,  H01L25/18 ,  H10B80/00

CPC classification number: H01L24/10 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/18 ,  H10B80/00 ,  H01L2224/02175 ,  H01L2224/0219 ,  H01L2224/03002 ,  H01L2224/0382 ,  H01L2224/05555 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/10145 ,  H01L2224/10175 ,  H01L2224/11002 ,  H01L2224/1182 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/27002 ,  H01L2224/27618 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/83005 ,  H01L2224/83203 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/014 ,  H01L2924/05442 ,  H01L2924/0665

Abstract: A semiconductor package and a method of fabricating the same. The semiconductor package includes a lower structure including a first lower conductive pad disposed on an upper surface thereof, a first semiconductor chip disposed on the lower structure, the first semiconductor chip including a first chip conductive pad disposed on a lower surface thereof, a solder ball connecting the first lower conductive pad and the first chip conductive pad, a photosensitive insulating layer filling a space between the lower structure and the first semiconductor chip, and a first organic insulating layer covering a side surface of the first chip conductive pad.