公开(公告)号：US09721902B2

公开(公告)日：2017-08-01

申请号：US14836301

申请日：2015-08-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wei Jiang ,  Yiwei Ma ,  Jinpei Ju ,  Hongmei Hu ,  Qin Gong

IPC: H03F1/30 ,  H03F3/19 ,  H01L23/552 ,  H01L23/057 ,  H01L23/36 ,  H01L23/66 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/057 ,  H01L23/36 ,  H01L23/66 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present disclosure relates to a radio frequency (RF) unit of a base station, and more particularly, to a method of manufacturing an RF power amplifier module, an RF power amplifier module, an RF module, and a base station. The RF power amplifier module includes at least a power device, a power circuit board, a heat-dissipation substrate, and input/output ports. A power device die of the power device and the power circuit board are mounted on the heat-dissipation substrate. The power device die is connected to the power circuit board through packaging lead wires. In one exemplary embodiment, a heat-dissipation effect and manufacturing efficiency of the RF power amplifier module are improved and a cost of the RF power amplifier module is reduced.

公开(公告)号：US10790565B2

公开(公告)日：2020-09-29

申请号：US15749746

申请日：2016-08-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Fei Gao ,  Guangxin Zhao ,  Jianwang Wu ,  Jinpei Ju ,  Lei Cai

IPC: H01P1/205 ,  H01P1/208 ,  H01P7/06 ,  H01P11/00 ,  H01P1/207

Abstract: Provided is a cavity filter that is one of radio frequency filters. The cavity filter includes a printed circuit board (PCB) substrate including a micro band layer, metal layers for grounding, which are arranged on both surfaces of the PCB substrate, having the micro band layer interposed therebetween, a plurality of standard cavity modules which are arranged on the both surfaces of the PCB substrate, in each of which an open side surface is fixed and sealed onto the metal layer, and a plurality of coupling windows, in each of which a part of the metal layer for grounding is removed to expose a part of the PCB substrate.

公开(公告)号：US09627807B2

公开(公告)日：2017-04-18

申请号：US14638268

申请日：2015-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Fei Gao ,  Guangxin Zhao ,  Jinpei Ju ,  Shengjun Ou ,  Wensheng Chen ,  Chunliang Chang

IPC: H01R13/64 ,  H01R13/627 ,  H01R13/52

CPC classification number: H01R13/6273 ,  H01R13/5202

Abstract: A cable connector assembly includes a connecting frame, wherein an opening through which a cable penetrates is formed at an end of the connecting frame, a cable support connected to another end of the connecting frame and supporting the cable, a first locking part including a fixed end fixed to a first side of the connecting frame and a free end that is movable about the fixed end, a second locking part including a fixed end fixed to a second side of the connecting frame opposite to the first side of the connecting frame, and a free end that is movable about the fixed end, and a sealing portion surrounding the connecting frame and being elastic deformable.