公开(公告)号：US20170110316A1

公开(公告)日：2017-04-20

申请号：US15237646

申请日：2016-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mi-hyun PARK ,  Jung-min OH ,  Kyoung-hwan KIM ,  In-gi KIM ,  Hyo-san LEE ,  Ji-hoon JEONG ,  Kyoung-seob KIM ,  Seok-hoon KIM

IPC: H01L21/02 ,  H01L29/06 ,  H01L29/161 ,  H01L29/16 ,  C11D11/00 ,  H01L29/51 ,  H01L29/49 ,  H01L29/66 ,  C11D1/29 ,  H01L29/78 ,  H01L29/08

CPC classification number: C11D11/0047 ,  C11D1/146 ,  C11D1/22 ,  C11D1/29 ,  H01L21/02068 ,  H01L21/02071 ,  H01L21/67051 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/1608 ,  H01L29/161 ,  H01L29/4966 ,  H01L29/517 ,  H01L29/66545 ,  H01L29/66636 ,  H01L29/66795

Abstract: A method of cleaning a substrate includes providing the substrate, the substrate including a metal material film, performing physical cleaning of the substrate, performing chemical cleaning of the substrate, and drying a surface of the substrate. Performing the chemical cleaning includes supplying a chemical cleaning solution including an anionic surfactant at a concentration that is equal to or greater than a critical micelle concentration (CMC) onto the surface of the substrate.