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公开(公告)号：US20210226328A1
公开(公告)日：2021-07-22
申请号：US17225790
申请日：2021-04-08
发明人： Doo li Kim , Dae Kwon Jung , Young Sik Hur , Won Wook So , Yong Ho Baek , Woo Jung Choi
IPC分类号： H01Q1/38 , H01L23/31 , H01L23/538 , H01L23/552 , H01L23/66 , H01L21/48 , H01L21/56 , H01L23/00 , H05K1/11
摘要： An antenna module includes a first connection member including at least one first wiring layer and at least one first insulating layer; an antenna package disposed on a first surface of the first connection member, and including a plurality of antenna members and a plurality of feed vias; an integrated circuit (IC) disposed on a second surface of the first connection member and electrically connected to the corresponding wire of at least one first wiring layer; and a second connection member including at least one second wiring layer electrically connected to the IC and at least one second insulating layer, and disposed between the first connection member and the IC, wherein the second connection member has a third surface facing the first connection member and having an area smaller than that of the second surface, and a fourth surface facing the IC.
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公开(公告)号：US10741509B2
公开(公告)日：2020-08-11
申请号：US16009732
申请日：2018-06-15
发明人： Doo Il Kim , Dae Kwon Jung , Young Sik Hur , Yong Ho Baek
摘要： An antenna module includes a connection member including at least one wiring layer and at least one insulating layer, an antenna package including a plurality of antenna members transmitting or receiving a radio frequency (RF) signal and a plurality of feed vias respectively electrically connected to the plurality of antenna members at one end and respectively electrically connected to a wiring corresponding to the at least one wiring layer at the other end, and positioned on a first surface of the connection member, an integrated circuit (IC) disposed on a second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer to receive an intermediate frequency (IF) signal or baseband signal and transfer an RF signal or receive an RF signal and transfer an IF signal or baseband signal, and a filter filtering an IF signal or a baseband signal.
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公开(公告)号：US11469193B2
公开(公告)日：2022-10-11
申请号：US16983771
申请日：2020-08-03
发明人： Doo Il Kim , Dae Kwon Jung , Young Sik Hur , Yong Ho Baek
摘要： An antenna module includes a connection member including at least one wiring layer and at least one insulating layer, an antenna package including a plurality of antenna members transmitting or receiving a radio frequency (RF) signal and a plurality of feed vias respectively electrically connected to the plurality of antenna members at one end and respectively electrically connected to a wiring corresponding to the at least one wiring layer at the other end, and positioned on a first surface of the connection member, an integrated circuit (IC) disposed on a second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer to receive an intermediate frequency (IF) signal or baseband signal and transfer an RF signal or receive an RF signal and transfer an IF signal or baseband signal, and a filter filtering an IF signal or a baseband signal.
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公开(公告)号：US11777200B2
公开(公告)日：2023-10-03
申请号：US17225790
申请日：2021-04-08
发明人： Doo Il Kim , Dae Kwon Jung , Young Sik Hur , Won Wook So , Yong Ho Baek , Woo Jung Choi
IPC分类号： H01Q1/22 , H01Q1/38 , H01L23/31 , H01L23/538 , H01L23/552 , H01L23/66 , H01L21/48 , H01L21/56 , H01L23/00 , H05K1/11 , H01Q9/16
CPC分类号： H01Q1/38 , H01L21/4853 , H01L21/4857 , H01L21/565 , H01L21/568 , H01L23/3121 , H01L23/5383 , H01L23/5386 , H01L23/5389 , H01L23/552 , H01L23/66 , H01L24/19 , H01L24/20 , H05K1/115 , H01L2223/6677 , H01L2224/214 , H01L2924/19105 , H01L2924/3025 , H01Q9/16 , H05K2201/10015 , H05K2201/10098 , H05K2201/10522 , H05K2201/10545
摘要： An antenna module includes a first connection member including at least one first wiring layer and at least one first insulating layer; an antenna package disposed on a first surface of the first connection member, and including a plurality of antenna members and a plurality of feed vias; an integrated circuit (IC) disposed on a second surface of the first connection member and electrically connected to the corresponding wire of at least one first wiring layer; and a second connection member including at least one second wiring layer electrically connected to the IC and at least one second insulating layer, and disposed between the first connection member and the IC, wherein the second connection member has a third surface facing the first connection member and having an area smaller than that of the second surface, and a fourth surface facing the IC.
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公开(公告)号：US10985451B2
公开(公告)日：2021-04-20
申请号：US16112432
申请日：2018-08-24
发明人： Doo Il Kim , Dae Kwon Jung , Young Sik Hur , Won Wook So , Yong Ho Baek , Woo Jung Choi
IPC分类号： H01Q1/22 , H01Q1/38 , H01L23/31 , H01L23/538 , H01L23/552 , H01L23/66 , H01L21/48 , H01L21/56 , H01L23/00 , H05K1/11 , H01Q9/16
摘要： An antenna module includes a first connection member including at least one first wiring layer and at least one first insulating layer; an antenna package disposed on a first surface of the first connection member, and including a plurality of antenna members and a plurality of feed vias; an integrated circuit (IC) disposed on a second surface of the first connection member and electrically connected to the corresponding wire of at least one first wiring layer; and a second connection member including at least one second wiring layer electrically connected to the IC and at least one second insulating layer, and disposed between the first connection member and the IC, wherein the second connection member has a third surface facing the first connection member and having an area smaller than that of the second surface, and a fourth surface facing the IC.
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