知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.014 seconds)

    Power supply circuits with variable number of power inputs and cross-coupled diodes and storage devices having the same
    1.
    发明授权
    Power supply circuits with variable number of power inputs and cross-coupled diodes and storage devices having the same 有权

    公开(公告)号：US10050518B2

    公开(公告)日：2018-08-14

    申请号：US15196473

    申请日：2016-06-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyoung-Taek Lim ,  Chung-Hyun Ryu

    IPC: G11C14/00 ,  G11C16/30 ,  H02M3/04

    Abstract: A power supply circuit may include a first power converter that may be configured to generate a first inner supply voltage having a first voltage level based on a first external supply voltage and to output the first inner supply voltage to a first node that is coupled to the first node, a second power converter that may be configured to generate a second inner supply voltage having the first voltage level based on a second external supply voltage and to output the second inner supply voltage to a second node that is coupled to the second node, a first diode that may include an anode coupled to the first node and a cathode coupled to the second node, and a second diode that may include an anode coupled to the second node and a cathode coupled to the first node.

    SEMICONDUCTOR SUPPORT FRAME AND STORAGE DEVICE HAVING THE SAME
    2.
    发明申请
    SEMICONDUCTOR SUPPORT FRAME AND STORAGE DEVICE HAVING THE SAME 审中-公开

    公开(公告)号：US20170105290A1

    公开(公告)日：2017-04-13

    申请号：US15285261

    申请日：2016-10-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yu-Sung Kim ,  Ji-Yong Kim ,  Chung-Hyun Ryu

    IPC: H05K5/00 ,  H05K1/14 ,  G11C5/04 ,  H05K1/18

    CPC classification number: H05K5/0008 ,  G11C5/04 ,  H05K1/148 ,  H05K5/0026 ,  H05K2201/056 ,  H05K2201/10424

    Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.

    Solid state drive devices and storage systems having the same
    3.
    发明授权
    Solid state drive devices and storage systems having the same 有权

    公开(公告)号：US10679701B2

    公开(公告)日：2020-06-09

    申请号：US15333384

    申请日：2016-10-25

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Ji-Won Park ,  Ho-Jin Chun ,  Chung-Hyun Ryu

    IPC: G11C16/10 ,  G11C16/34 ,  G11C7/04 ,  G06F3/06 ,  G11C16/30 ,  G11C16/32

    Abstract: A solid state drive (SSD) device includes nonvolatile memory devices, a controller, a main power supply circuit and an auxiliary reprogram device. The controller controls the nonvolatile memory devices. The main power supply circuit provides an operation voltage to the nonvolatile memory devices and the controller using a supply voltage provided through a power line. The auxiliary reprogram device provides an auxiliary supply voltage to the nonvolatile memory devices and the controller and generates a reprogram command. The controller is configured to, if the SSD is not powered, perform periodically at a first period a reprogram operation on the nonvolatile memory devices.

    Semiconductor support frame and storage device having the same
    5.
    发明授权
    Semiconductor support frame and storage device having the same 有权

    公开(公告)号：US10306779B2

    公开(公告)日：2019-05-28

    申请号：US15285261

    申请日：2016-10-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yu-Sung Kim ,  Ji-Yong Kim ,  Chung-Hyun Ryu

    IPC: H05K5/00 ,  H05K1/14 ,  G11C5/04

    Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.

Patent Agency Ranking