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公开(公告)号：US12113049B2
公开(公告)日：2024-10-08
申请号：US18490172
申请日：2023-10-19
发明人： Chulwoo Kim
IPC分类号： H01L25/065 , H01L23/00 , H01L23/31 , H01L23/498
CPC分类号： H01L25/0655 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/3511
摘要： A semiconductor package includes a package substrate, an interposer on the package substrate, semiconductor devices in individual mounting regions on a first surface of the interposer, respectively, first conductive connection members, and a molding member on the interposer. The interposer has first bonding pads in the individual mounting regions, respectively. The semiconductor devices each have chip pads electrically connected to the first bonding pads. The first conductive connection members are between the first bonding pads and the chip pads. The molding member covers the semiconductor devices and fills gaps between the first surface of the interposer and the semiconductor devices. At least one of the individual mounting regions includes a pad-free region with a cross shape and pad regions defined by the pad-free region, and the first bonding pads are in the pad regions.
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公开(公告)号：US12057408B2
公开(公告)日：2024-08-06
申请号：US17171475
申请日：2021-02-09
发明人： Chulwoo Kim , Yanggyoo Jung , Soohyun Nam
IPC分类号： H01L23/00 , H01L23/16 , H01L23/31 , H01L23/367 , H01L23/498 , H01L25/065
CPC分类号： H01L23/562 , H01L23/16 , H01L23/3185 , H01L23/3675 , H01L23/49838 , H01L24/16 , H01L25/0652 , H01L2224/16227 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/18161 , H01L2924/3511
摘要： A semiconductor package includes a substrate including a wiring, a semiconductor chip structure on the substrate, and electrically connected to the wiring, an underfill resin in a space between the substrate and the semiconductor chip structure, and a stiffener surrounding the semiconductor chip structure, on the substrate, wherein the stiffener includes a conductive frame having a cavity and an insulating filler in the cavity.
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公开(公告)号：US11588453B2
公开(公告)日：2023-02-21
申请号：US17176239
申请日：2021-02-16
发明人： Kyoungho Kim , Chulwoo Kim , Hyunsu Park , Jin-Cheol Sim
摘要： A signal receiver includes a data sampler receiving a differential input signal having first and second input signals and determining bit values of the differential input signal based on first and second reference voltages, and a reference voltage generator performing a pre-tuning operation and a post-tuning operation to generate the reference voltages. The reference voltage generator performs the pre-tuning operation by generating first and second initial voltages and adjusting one of the initial voltages to generate third and fourth voltages. After the pre-tuning operation, the reference voltage generator performs the post-tuning operation by increasing or decreasing the third voltage to generate the first reference voltage and decreasing or increasing the fourth voltage to generate the second reference voltage based on a comparison result between the third voltage and the first input signal and a second comparison result between the fourth voltage and second input signal.
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公开(公告)号：US10567877B2
公开(公告)日：2020-02-18
申请号：US16270175
申请日：2019-02-07
发明人： Myoungwoo Nam , Heejin Kim , Ochae Kwon , Chulwoo Kim , Joongsam Yun , Younghak Oh
摘要： An electronic device, method, and non-transitory computer-readable recording medium are provided. Electronic device includes first speaker and second speaker arranged in electronic device, processor operatively connected with first speaker and second speaker, and memory operatively connected to the processor, wherein the memory is configured to store instructions executed to enable the processor to detect an orientation or attitude of the electronic device while playing first channel audio data and second channel audio data via the first speaker and the second speaker, and based on at least part of the detected orientation or attitude of the electronic device, keep outputting a first frequency component of the first channel audio data and a second frequency component of the second channel audio data via the first speaker and the second speaker and switch a second frequency component of the first channel audio data and a first frequency component of the second channel audio data.
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5.发明授权Method and apparatus for displaying keypad in terminal having touch screen 有权用于在具有触摸屏的终端中显示键盘的方法和装置公开(公告)号：US09569099B2
公开(公告)日：2017-02-14
申请号：US13707926
申请日：2012-12-07
发明人： Ilgeun Bok , Chulwoo Kim , Seungah Oh
IPC分类号： G06F3/00 , G06F9/00 , G06F17/00 , G06F3/0488
CPC分类号： G06F3/04883 , G06F3/04886
摘要： A method and an apparatus thereof display a key pad and solve the trouble and difficulty of a user in selecting the key pad displayed in a terminal having a touch screen. The method detects a touch gesture with respect to the touch screen; determines whether the detects touch gesture is zoom-out; displays thumbnails representing key pads, respectively, when the detected touch gesture is the zoom-out; and displays a key pad of a selected thumbnail when one of the displayed thumbnails is selected by a user.
摘要翻译： 一种方法及其装置显示键盘，解决用户选择显示在具有触摸屏的终端中的键盘的麻烦和困难。 该方法检测相对于触摸屏的触摸手势; 确定检测到的触摸手势是否缩小; 当检测到的触摸手势是缩小时，分别显示代表键盘的缩略图; 并且当用户选择所显示的缩略图之一时，显示所选缩略图的键盘。
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公开(公告)号：US20220013475A1
公开(公告)日：2022-01-13
申请号：US17171475
申请日：2021-02-09
发明人： Chulwoo Kim , Yanggyoo Jung , Soohyun Nam
IPC分类号： H01L23/00 , H01L25/065 , H01L23/16 , H01L23/31 , H01L23/367 , H01L23/498
摘要： A semiconductor package includes a substrate including a wiring, a semiconductor chip structure on the substrate, and electrically connected to the wiring, an underfill resin in a space between the substrate and the semiconductor chip structure, and a stiffener surrounding the semiconductor chip structure, on the substrate, wherein the stiffener includes a conductive frame having a cavity and an insulating filler in the cavity.
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公开(公告)号：US20210366818A1
公开(公告)日：2021-11-25
申请号：US17109925
申请日：2020-12-02
发明人： Chulwoo Kim
IPC分类号： H01L23/498
摘要： A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, and a plurality of underfills between the package substrate and the semiconductor chip. The package substrate includes a trench formed in the package substrate and a plurality of dams on both sides of the trench, respectively. The top surfaces of the plurality of dams may be positioned at a lower level than the bottom surface of the semiconductor chip in a cross-sectional view of the semiconductor package with the package substrate providing a base reference level.
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公开(公告)号：US11508652B2
公开(公告)日：2022-11-22
申请号：US17109925
申请日：2020-12-02
发明人： Chulwoo Kim
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/498
摘要： A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, and a plurality of underfills between the package substrate and the semiconductor chip. The package substrate includes a trench formed in the package substrate and a plurality of dams on both sides of the trench, respectively. The top surfaces of the plurality of dams may be positioned at a lower level than the bottom surface of the semiconductor chip in a cross-sectional view of the semiconductor package with the package substrate providing a base reference level.
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公开(公告)号：US11095484B2
公开(公告)日：2021-08-17
申请号：US16817760
申请日：2020-03-13
发明人： Chulwoo Kim , Yeonho Lee , Jonghyuck Choi
IPC分类号： H04L25/02 , H04L25/493 , H04L25/08
摘要： A differential signal processing device is described which includes an encoder configured to encode input data into one or more differential signals and a transmitter configured to sequentially transmit the one or more differential signals using a plurality of transmission lines. The encoder converts a plurality of bits, corresponding to a transmission time interval, among the input data into an encoding code array in the transmission time interval obtained by increasing an encoding unit time, encoded for each of the one or more differential signals, by an integer multiple.
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公开(公告)号：US11501069B2
公开(公告)日：2022-11-15
申请号：US17048321
申请日：2019-04-10
发明人： Chulwoo Kim
IPC分类号： G06F3/04886 , G06F40/274
摘要： Various embodiments of the present invention relate to an electronic device for inputting characters and a method of operation of same. At this time, the electronic device comprises a display, at least one processor, and a memory operatively connected to the processor, wherein the memory may store instructions that, when executed, cause the at least one processor to: detect at least one input word; determine a priority of a plurality of categories for a content on the basis of the at least one input word; determine at least one recommendation category on the basis of the determined priority of the plurality of categories; and control the display so as to display at least one content corresponding to the at least one determined recommendation category as at least one recommendation content for the at least one input word. Other embodiments may also be possible.
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