公开(公告)号：US20240049400A1

公开(公告)日：2024-02-08

申请号：US18127531

申请日：2023-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngja KIM ,  Donguk KWON ,  Youngmin LEE ,  Byungkeun KANG ,  Gongmyeong KIM ,  Chaein MOON

IPC: H05K3/34 ,  H01L23/00

CPC classification number: H05K3/3494 ,  H01L24/13 ,  H05K3/3447 ,  H01L2224/81815

Abstract: A method of manufacturing an electronic device, includes: providing a substrate including a plurality of mounting regions on which electronic components are mounted respectively; forming a plurality of vapor passage holes that penetrate the substrate; disposing the electronic components on the substrate via bumps; heating a first heat transfer fluid to generate a second heat transfer fluid in a vapor state; supplying at least a portion of the second heat transfer fluid in the vapor state through the vapor passage holes of the substrate; and soldering the bumps using the at least the portion of the second heat transfer fluid in the vapor state.

公开(公告)号：US20230361101A1

公开(公告)日：2023-11-09

申请号：US18356350

申请日：2023-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangcheon PARK ,  Youngmin LEE

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/48 ,  H01L23/522 ,  H01L23/544

CPC classification number: H01L25/18 ,  H01L24/08 ,  H01L23/481 ,  H01L23/5226 ,  H01L23/544 ,  H01L2224/0224 ,  H01L2224/08145 ,  H01L2223/54426

Abstract: A semiconductor package includes: a first semiconductor chip including a plurality of front surface pads disposed on a first active surface of a first semiconductor substrate, at least one penetrating electrode penetrating at least a portion of the first semiconductor substrate and connected to the front surface pads, a first rear surface cover layer disposed on a first inactive surface of the first semiconductor substrate, a first rear surface dummy conductive layer penetrating a portion of the first rear surface cover layer; a second semiconductor chip including a second front surface cover layer disposed on a second active surface of a second semiconductor substrate, and a second front surface dummy conductive layer penetrating a portion of the second front surface cover layer; and at least one first bonded pad penetrating the first rear surface cover layer and the second front surface cover layer.

公开(公告)号：US20200264839A1

公开(公告)日：2020-08-20

申请号：US16791073

申请日：2020-02-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeyoung YANG ,  Donghee SUH ,  Hojun JAYGARL ,  Minsung KIM ,  Jinwoong KIM ,  Youngbin KIM ,  Kwangbin LEE ,  Youngmin LEE

IPC: G06F3/16 ,  G10L15/22

Abstract: An electronic device includes a communication circuit, a display, a microphone, a processor operatively connected to the communication circuit, the display, and the microphone, and a memory operatively connected to the processor, wherein the memory is configured to store instructions which, when executed, cause the processor to control the electronic device to: transmit information related to a predetermined event to a server through the communication circuit in response to detection of the predetermined event through an application, display a user interface through the display in response to reception of information related to the user interface including at least one visual object selectable by a user to control a function of the application through the communication circuit, receive a user-uttered input for selecting one of the at least one visual object included in the user interface through the microphone, and transmit information related to the user-uttered input to the server through the communication circuit to perform a function corresponding to the visual object selected by the user-uttered input.

公开(公告)号：US20190391755A1

公开(公告)日：2019-12-26

申请号：US16360547

申请日：2019-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： SeokHeon Lee ,  Won-Gi HONG ,  Youngmin LEE

IPC: G06F3/06 ,  G06F12/02

Abstract: A storage device may include a first storage area, a second storage area, and a controller. The controller may be configured to provide device information containing information on the first and second storage areas to an external host device, to allow a first access type of the external host device to the first storage area, and to allow a second access type of the external host device to the second storage area.

公开(公告)号：US20180081595A1

公开(公告)日：2018-03-22

申请号：US15702035

申请日：2017-09-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngmin LEE ,  Sungho Seo ,  Hyuntae Park ,  Hwaseok Oh ,  JinHyeok Choi

IPC: G06F3/06

CPC classification number: G06F3/0659 ,  G06F3/0604 ,  G06F3/0626 ,  G06F3/0656 ,  G06F3/0683

Abstract: An electronic device includes an embedded storage device and an application processor. The embedded storage device is connected to directly communicate with a removable storage device which processes a packet having a first characteristic. The embedded storage device processes a packet having a second characteristic. The application processor is connected to directly communicate with the embedded storage device, but not directly connected to the removable storage device. The application processor processes a packet having a third characteristic. The embedded storage device compensates at least one of the first characteristic or the second characteristic, such that at least one of a first packet of the first characteristic received from the removable storage device or a second packet of the second characteristic in the embedded storage device is provided to the application processor according to the third characteristic.

公开(公告)号：US20250167179A1

公开(公告)日：2025-05-22

申请号：US19029388

申请日：2025-01-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangcheon PARK ,  Youngmin LEE

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/12 ,  H01L23/538

Abstract: A semiconductor package includes: a first structure having a first insulating layer disposed on one surface, and first electrode pads and first dummy pads penetrating through the first insulating layer, a second structure having a second insulating layer having the other surface bonded to the one surface and the first insulating layer and disposed on the other surface, and second electrode pads and second dummy pads that penetrate through the second insulating layer, the second electrode pads being bonded to the first electrode pads, respectively, and the second dummy pads being bonded to the first dummy pads, respectively. In the semiconductor chip, ratios of surface areas per unit area of the first and second dummy pads to the first and second insulating layers on the one surface and the other surface gradually decrease toward sides of the first and second structures.

公开(公告)号：US20230350246A1

公开(公告)日：2023-11-02

申请号：US17311118

申请日：2021-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyeol KIM ,  Chunsoon PARK ,  Kyehoon LEE ,  Youngmin LEE

IPC: G02F1/1335 ,  G02F1/13357

CPC classification number: G02F1/133607 ,  G02F1/133605 ,  G02F1/133603

Abstract: A display apparatus includes a reflective sheet through which a through hole is disposed, and a light source module exposed through the through hole. The light source module includes a substrate on which the reflective sheet is disposed, and a light emitting diode disposed on a portion of the substrate, the portion corresponding to the through hole. The light source module further includes an optical dome covering the light emitting diode, and a first light pattern disposed on the substrate and inside the optical dome, the first light pattern including a material having a reflectivity higher than a reflectivity of the substrate.

公开(公告)号：US20230055132A1

公开(公告)日：2023-02-23

申请号：US17843413

申请日：2022-06-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin LEE ,  Sungyeol Kim ,  Hyungsuk Kim ,  Seungyong Shin ,  Kyehoon Lee

IPC: G02F1/13357

Abstract: A display apparatus including a liquid crystal panel; and a backlight unit configured to emit light to the liquid crystal panel is provided. The backlight unit includes a bottom chassis; a first interface board disposed on a front surface of the bottom chassis; a plurality of light source modules disposed on the front surface of the bottom chassis, arranged at predetermined intervals, and each of the plurality of light source modules having one end connected to the first interface board; and a second interface board disposed on a rear surface of the bottom chassis and connected to the first interface board.

公开(公告)号：US20230036292A1

公开(公告)日：2023-02-02

申请号：US17542917

申请日：2021-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyeol KIM ,  Kyehoon LEE ,  Youngmin LEE ,  Junsung CHOI

IPC: G02F1/13357 ,  H01L25/075

Abstract: A display apparatus including a light source; a display panel; an optical sheet. The light source including a first light source substrate and a second light source substrate spaced apart from the first light source substrate in a width direction. The light source is mounted on the light source module and a width of a region defined by half of a maximum brightness of a light profile of the light source, is set as a full width at half maximum brightness. A distance between a center of the first light source substrate in the width direction and a center of the second light source substrate in the width direction is referred to as a pitch, the full width at half maximum brightness of the light source and the pitch satisfy: 1.0 ≤ full width at half maximum brightness/pitch ≤ 2.0..

公开(公告)号：US20220293580A1

公开(公告)日：2022-09-15

申请号：US17505040

申请日：2021-10-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangcheon PARK ,  Youngmin LEE

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/48 ,  H01L23/544 ,  H01L23/522

Abstract: A semiconductor package includes: a first semiconductor chip including a plurality of front surface pads disposed on a first active surface of a first semiconductor substrate, at least one penetrating electrode penetrating at least a portion of the first semiconductor substrate and connected to the front surface pads, a first rear surface cover layer disposed on a first inactive surface of the first semiconductor substrate, a first rear surface dummy conductive layer penetrating a portion of the first rear surface cover layer; a second semiconductor chip including a second front surface cover layer disposed on a second active surface of a second semiconductor substrate, and a second front surface dummy conductive layer penetrating a portion of the second front surface cover layer; and at least one first bonded pad penetrating the first rear surface cover layer and the second front surface cover layer.