公开(公告)号：US20240321851A1

公开(公告)日：2024-09-26

申请号：US18506346

申请日：2023-11-10

申请人： SAMSUNG ELECTERONICS CO., LTD.

发明人： CHOONGBIN YIM ,  Jongkook Kim ,  Chengtar Wu

IPC分类号： H01L25/18 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H10B80/00

CPC分类号： H01L25/18 ,  H01L21/568 ,  H01L24/05 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/73 ,  H01L24/80 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L25/50 ,  H10B80/00 ,  H01L2224/0557 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/08145 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/19 ,  H01L2224/214 ,  H01L2224/215 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/80006 ,  H01L2224/80357 ,  H01L2224/80379 ,  H01L2224/80896 ,  H01L2224/83005 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2224/95001 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0504 ,  H01L2924/05442 ,  H01L2924/059

摘要： A semiconductor package includes: a redistribution layer structure; a first semiconductor die and a second semiconductor die disposed on the redistribution layer structure; a bridge die disposed on the first semiconductor die and the second semiconductor die and that electrically connects the first semiconductor die and the second semiconductor die to each other; and a molding material disposed on the redistribution layer structure and that molds of the first semiconductor die, the second semiconductor die, and the bridge die. A bottom surface of the first semiconductor die and a bottom surface of the second semiconductor die are coplanar with an upper surface of the redistribution layer structure.