摘要:
The present disclosure relates to methods of making an article comprising PTFE, methods of making expanded articles comprising PTFE, articles comprising PTFE, and expanded articles comprising PTFE having improved mechanical and electrical performance and particularly reduced variability in mechanical, electrical and dimensional properties, particularly over long lengths.
摘要:
The present disclosure relates to methods of making an article comprising PTFE, methods of making expanded articles comprising PTFE, articles comprising PTFE, and expanded articles comprising PTFE having improved mechanical and electrical performance and particularly reduced variability in mechanical, electrical and dimensional properties, particularly over long lengths.
摘要:
The present disclosure relates to methods of making an article comprising PTFE, methods of making expanded articles comprising PTFE, articles comprising PTFE, and expanded articles comprising PTFE having improved mechanical and electrical performance and particularly reduced variability in mechanical, electrical and dimensional properties, particularly over long lengths.
摘要:
The present disclosure is directed to composite films, such as subcomponents of a circuit board assembly including a non-meltprocessable fluoropolymer layer and a melt processable fluoropolymer layer having an average thickness in a range of from 0.1 microns to 20 microns. When included within a printed circuit board, the composite can exhibit greater resistance to delamination.