-
公开(公告)号:US11808357B2
公开(公告)日:2023-11-07
申请号:US16731248
申请日:2019-12-31
Inventor: Zong Zong , Jiezhu Jin , Nafih Mekhilef
IPC: F16J15/3284 , F16J15/3272
CPC classification number: F16J15/3284 , F16J15/3272
Abstract: A seal can include a seal body and a coating disposed on a surface of the seal body. The seal body can include a high-performance thermoplastic material. The coating can include a fluoropolymer. In an embodiment, the seal can have a wear rate of at most 3.7×10−6 mm3/(N·m). A method of forming a seal can include forming a seal body and disposing a coating over a surface of the seal body.
-
公开(公告)号:US12129938B2
公开(公告)日:2024-10-29
申请号:US17823266
申请日:2022-08-30
Inventor: Qiaoxi Li , Jessica Kenepp , James Ludlow , Cody Gleason , Gayla Lyon , Jiezhu Jin
Abstract: A multilayer tube includes: an inner layer including a polymer, wherein the polymer includes a fluoropolymer, a polyolefin, a blend thereof, or combination thereof; and an outer layer adjacent to the inner layer, wherein the outer layer includes a polymer including a fluoropolymer, a polyolefin, a blend thereof, or combination thereof; wherein the inner layer, the outer layer, or combination thereof includes at least one blocking agent, wherein the at least one blocking agent reduces the percent transmission by at least 99% at wavelengths between 240 nm to 450 nm.
-
公开(公告)号:US20200208744A1
公开(公告)日:2020-07-02
申请号:US16731248
申请日:2019-12-31
Inventor: Zong ZONG , Jiezhu Jin , Nafih Mekhilef
IPC: F16J15/3284 , F16J15/3272
Abstract: A seal can include a seal body and a coating disposed on a surface of the seal body. The seal body can include a high-performance thermoplastic material. The coating can include a fluoropolymer. In an embodiment, the seal can have a wear rate of at most 3.7×10−6 mm3/(N·m). A method of forming a seal can include forming a seal body and disposing a coating over a surface of the seal body.
-
公开(公告)号:US20160227647A1
公开(公告)日:2016-08-04
申请号:US14984976
申请日:2015-12-30
Inventor: Philip C. Guy , Jiezhu Jin , Kevin M. Manchester , Deirdre M. Zammit
IPC: H05K1/03 , C09D129/10 , C09D127/18 , C09D123/28
CPC classification number: H05K1/0366 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/12 , B32B27/16 , B32B27/304 , B32B27/322 , B32B2037/243 , B32B2250/02 , B32B2255/10 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2270/00 , B32B2307/732 , B32B2457/08 , C09D123/283 , C09D127/18 , C09D129/10 , H05K1/036 , H05K2201/015 , H05K2201/0195
Abstract: The present disclosure is directed to composite films, such as subcomponents of a circuit board assembly including a non-meltprocessable fluoropolymer layer and a melt processable fluoropolymer layer having an average thickness in a range of from 0.1 microns to 20 microns. When included within a printed circuit board, the composite can exhibit greater resistance to delamination.
Abstract translation: 本公开涉及复合膜,例如包括非熔融加工的含氟聚合物层的电路板组件的子部件和具有在0.1微米至20微米范围内的平均厚度的可熔融加工的氟聚合物层。 当包含在印刷电路板中时,复合材料可以表现出更大的抗分层性。
-
-
-