公开(公告)号：US08580684B2

公开(公告)日：2013-11-12

申请号：US12939523

申请日：2010-11-04

申请人： Robert Seidel ,  Kai Frohberg ,  Carsten Peters

发明人： Robert Seidel ,  Kai Frohberg ,  Carsten Peters

IPC分类号： H01L21/44

CPC分类号： H01L21/76808 ,  H01L21/76814 ,  H01L21/76829 ,  H01L29/66795 ,  H01L2029/7858

摘要： In sophisticated semiconductor devices, contact elements in the contact level may be formed by patterning the contact openings and filling the contact openings with the metal of the first metallization layer in a common deposition sequence. To this end, in some illustrative embodiments, a sacrificial fill material may be provided in contact openings prior to depositing the dielectric material of the first metallization layer.

摘要翻译： 在复杂的半导体器件中，可以通过图案化接触开口并以公共沉积顺序用第一金属化层的金属填充接触开口来形成接触电平的接触元件。 为此，在一些说明性实施例中，在沉积第一金属化层的介电材料之前，可以在接触开口中提供牺牲填充材料。

公开(公告)号：US20110210447A1

公开(公告)日：2011-09-01

申请号：US12939523

申请日：2010-11-04

申请人： Robert Seidel ,  Kai Frohberg ,  Carsten Peters

发明人： Robert Seidel ,  Kai Frohberg ,  Carsten Peters

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/76808 ,  H01L21/76814 ,  H01L21/76829 ,  H01L29/66795 ,  H01L2029/7858

摘要： In sophisticated semiconductor devices, contact elements in the contact level may be formed by patterning the contact openings and filling the contact openings with the metal of the first metallization layer in a common deposition sequence. To this end, in some illustrative embodiments, a sacrificial fill material may be provided in contact openings prior to depositing the dielectric material of the first metallization layer.

摘要翻译： 在复杂的半导体器件中，可以通过图案化接触开口并以公共沉积顺序用第一金属化层的金属填充接触开口来形成接触电平的接触元件。 为此，在一些说明性实施例中，在沉积第一金属化层的介电材料之前，可以在接触开口中提供牺牲填充材料。

公开(公告)号：US20110117723A1

公开(公告)日：2011-05-19

申请号：US13014771

申请日：2011-01-27

申请人： Robert Seidel ,  Carsten Peters ,  Frank Feustel

发明人： Robert Seidel ,  Carsten Peters ,  Frank Feustel

IPC分类号： H01L21/768 ,  H01L21/762 ,  H01L21/28

CPC分类号： B81B7/0006 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/28114 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76804 ,  H01L21/76807 ,  H01L21/76817 ,  H01L21/76838 ,  H01L21/76852 ,  H01L21/76885 ,  H01L2221/1021

摘要： By forming metallization structures on the basis of an imprint technique, in which via openings and trenches may be commonly formed, a significant reduction of process complexity may be achieved due to the omission of at least one further alignment process as required in conventional process techniques. Furthermore, the flexibility and efficiency of imprint lithography may be increased by providing appropriately designed imprint molds in order to provide via openings and trenches exhibiting an increased fill capability, thereby also improving the performance of the finally obtained metallization structures with respect to reliability, resistance against electromigration and the like.

摘要翻译： 通过基于压印技术形成金属化结构，其中可以通常形成通孔和沟槽，由于根据常规工艺技术所要求的至少一个进一步对准过程，可以实现工艺复杂性的显着降低。 此外，可以通过提供适当设计的压印模具来提高压印光刻的灵活性和效率，以便提供表现出增加的填充能力的通孔开口和沟槽，从而也提高了最终获得的金属化结构在可靠性，抗性 电迁移等。

公开(公告)号：US07785956B2

公开(公告)日：2010-08-31

申请号：US12168443

申请日：2008-07-07

申请人： Ralf Richter ,  Robert Seidel ,  Carsten Peters

发明人： Ralf Richter ,  Robert Seidel ,  Carsten Peters

IPC分类号： H01L21/8238

CPC分类号： H01L21/823807 ,  H01L21/76816 ,  H01L21/76819 ,  H01L21/76829 ,  H01L21/76832 ,  H01L29/7843

摘要： By selectively providing a buffer layer having an appropriate thickness, height differences occurring during the deposition of an SACVD silicon dioxide may be reduced during the formation of an interlayer dielectric stack of advanced semiconductor devices. The buffer material may be selectively provided after the deposition of contact etch stop layers of both types of internal stress or may be provided after the deposition of one type of dielectric material and may be used during the subsequent patterning of the other type of dielectric stop material as an efficient etch stop layer.

摘要翻译： 通过选择性地提供具有适当厚度的缓冲层，在形成先进的半导体器件的层间电介质叠层的过程中，可以减少沉积SACVD二氧化硅期间出现的高度差异。 可以在沉积两种类型的内部应力的接触蚀刻停止层之后选择性地提供缓冲材料，或者可以在沉积一种类型的电介质材料之后提供缓冲材料，并且可以在随后的其它类型的电介质停止材料的图案化期间使用缓冲材料 作为有效的蚀刻停止层。

公开(公告)号：US07928004B2

公开(公告)日：2011-04-19

申请号：US11671688

申请日：2007-02-06

申请人： Robert Seidel ,  Carsten Peters ,  Frank Feustel

发明人： Robert Seidel ,  Carsten Peters ,  Frank Feustel

IPC分类号： H01L21/4763

CPC分类号： B81B7/0006 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/28114 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76804 ,  H01L21/76807 ,  H01L21/76817 ,  H01L21/76838 ,  H01L21/76852 ,  H01L21/76885 ,  H01L2221/1021

摘要： By forming metallization structures on the basis of an imprint technique, in which via openings and trenches may be commonly formed, a significant reduction of process complexity may be achieved due to the omission of at least one further alignment process as required in conventional process techniques. Furthermore, the flexibility and efficiency of imprint lithography may be increased by providing appropriately designed imprint molds in order to provide via openings and trenches exhibiting an increased fill capability, thereby also improving the performance of the finally obtained metallization structures with respect to reliability, resistance against electromigration and the like.

摘要翻译： 通过基于压印技术形成金属化结构，其中可以通常形成通孔和沟槽，由于根据常规工艺技术所要求的至少一个进一步对准过程，可以实现工艺复杂性的显着降低。 此外，可以通过提供适当设计的压印模具来提高压印光刻的灵活性和效率，以便提供表现出增加的填充能力的通孔开口和沟槽，从而也提高了最终获得的金属化结构在可靠性，抗性 电迁移等。

公开(公告)号：US20100285668A1

公开(公告)日：2010-11-11

申请号：US12841313

申请日：2010-07-22

申请人： Ralf Richter ,  Robert Seidel ,  Carsten Peters

发明人： Ralf Richter ,  Robert Seidel ,  Carsten Peters

IPC分类号： H01L21/311 ,  H01L21/31

CPC分类号： H01L21/823807 ,  H01L21/76816 ,  H01L21/76819 ,  H01L21/76829 ,  H01L21/76832 ,  H01L29/7843

摘要： By selectively providing a buffer layer having an appropriate thickness, height differences occurring during the deposition of an SACVD silicon dioxide may be reduced during the formation of an interlayer dielectric stack of advanced semiconductor devices. The buffer material may be selectively provided after the deposition of contact etch stop layers of both types of internal stress or may be provided after the deposition of one type of dielectric material and may be used during the subsequent patterning of the other type of dielectric stop material as an efficient etch stop layer.

摘要翻译： 通过选择性地提供具有适当厚度的缓冲层，在形成先进的半导体器件的层间电介质叠层的过程中，可以减少沉积SACVD二氧化硅期间出现的高度差异。 可以在沉积两种类型的内部应力的接触蚀刻停止层之后选择性地提供缓冲材料，或者可以在沉积一种类型的电介质材料之后提供缓冲材料，并且可以在随后的其它类型的电介质停止材料的图案化期间使用缓冲材料 作为有效的蚀刻停止层。

公开(公告)号：US07875514B2

公开(公告)日：2011-01-25

申请号：US12841313

申请日：2010-07-22

申请人： Ralf Richter ,  Robert Seidel ,  Carsten Peters

发明人： Ralf Richter ,  Robert Seidel ,  Carsten Peters

IPC分类号： H01L21/8238

CPC分类号： H01L21/823807 ,  H01L21/76816 ,  H01L21/76819 ,  H01L21/76829 ,  H01L21/76832 ,  H01L29/7843

摘要： By selectively providing a buffer layer having an appropriate thickness, height differences occurring during the deposition of an SACVD silicon dioxide may be reduced during the formation of an interlayer dielectric stack of advanced semiconductor devices. The buffer material may be selectively provided after the deposition of contact etch stop layers of both types of internal stress or may be provided after the deposition of one type of dielectric material and may be used during the subsequent patterning of the other type of dielectric stop material as an efficient etch stop layer.

摘要翻译： 通过选择性地提供具有适当厚度的缓冲层，在形成先进的半导体器件的层间电介质叠层的过程中，可以减少沉积SACVD二氧化硅期间出现的高度差异。 可以在沉积两种类型的内部应力的接触蚀刻停止层之后选择性地提供缓冲材料，或者可以在沉积一种类型的电介质材料之后提供缓冲材料，并且可以在随后的其它类型的电介质停止材料的图案化期间使用缓冲材料 作为有效的蚀刻停止层。

公开(公告)号：US08293641B2

公开(公告)日：2012-10-23

申请号：US13014771

申请日：2011-01-27

申请人： Robert Seidel ,  Carsten Peters ,  Frank Feustel

发明人： Robert Seidel ,  Carsten Peters ,  Frank Feustel

IPC分类号： H01L21/4763

CPC分类号： B81B7/0006 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/28114 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76804 ,  H01L21/76807 ,  H01L21/76817 ,  H01L21/76838 ,  H01L21/76852 ,  H01L21/76885 ,  H01L2221/1021

摘要： By forming metallization structures on the basis of an imprint technique, in which via openings and trenches may be commonly formed, a significant reduction of process complexity may be achieved due to the omission of at least one further alignment process as required in conventional process techniques. Furthermore, the flexibility and efficiency of imprint lithography may be increased by providing appropriately designed imprint molds in order to provide via openings and trenches exhibiting an increased fill capability, thereby also improving the performance of the finally obtained metallization structures with respect to reliability, resistance against electromigration and the like.

摘要翻译： 通过基于压印技术形成金属化结构，其中可以通常形成通孔和沟槽，由于根据常规工艺技术所要求的至少一个进一步对准过程，可以实现工艺复杂性的显着降低。 此外，可以通过提供适当设计的压印模具来提高压印光刻的灵活性和效率，以便提供表现出增加的填充能力的通孔开口和沟槽，从而也提高了最终获得的金属化结构在可靠性，抗性 电迁移等。

公开(公告)号：US20090087999A1

公开(公告)日：2009-04-02

申请号：US12168443

申请日：2008-07-07

申请人： Ralf Richter ,  Robert Seidel ,  Carsten Peters

发明人： Ralf Richter ,  Robert Seidel ,  Carsten Peters

IPC分类号： H01L21/31

CPC分类号： H01L21/823807 ,  H01L21/76816 ,  H01L21/76819 ,  H01L21/76829 ,  H01L21/76832 ,  H01L29/7843

摘要： By selectively providing a buffer layer having an appropriate thickness, height differences occurring during the deposition of an SACVD silicon dioxide may be reduced during the formation of an interlayer dielectric stack of advanced semiconductor devices. The buffer material may be selectively provided after the deposition of contact etch stop layers of both types of internal stress or may be provided after the deposition of one type of dielectric material and may be used during the subsequent patterning of the other type of dielectric stop material as an efficient etch stop layer.

摘要翻译： 通过选择性地提供具有适当厚度的缓冲层，在形成先进的半导体器件的层间电介质叠层的过程中，可以减少沉积SACVD二氧化硅期间出现的高度差异。 可以在沉积两种类型的内部应力的接触蚀刻停止层之后选择性地提供缓冲材料，或者可以在沉积一种类型的电介质材料之后提供缓冲材料，并且可以在随后的其它类型的电介质停止材料的图案化期间使用缓冲材料 作为有效的蚀刻停止层。

公开(公告)号：US20080003818A1

公开(公告)日：2008-01-03

申请号：US11671688

申请日：2007-02-06

申请人： Robert Seidel ,  Carsten Peters ,  Frank Feustel

发明人： Robert Seidel ,  Carsten Peters ,  Frank Feustel

IPC分类号： H01L21/44

CPC分类号： B81B7/0006 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/28114 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76804 ,  H01L21/76807 ,  H01L21/76817 ,  H01L21/76838 ,  H01L21/76852 ,  H01L21/76885 ,  H01L2221/1021

摘要： By forming metallization structures on the basis of an imprint technique, in which via openings and trenches may be commonly formed, a significant reduction of process complexity may be achieved due to the omission of at least one further alignment process as required in conventional process techniques. Furthermore, the flexibility and efficiency of imprint lithography may be increased by providing appropriately designed imprint molds in order to provide via openings and trenches exhibiting an increased fill capability, thereby also improving the performance of the finally obtained metallization structures with respect to reliability, resistance against electromigration and the like.

摘要翻译： 通过基于压印技术形成金属化结构，其中可以通常形成通孔和沟槽，由于根据常规工艺技术所要求的至少一个进一步对准过程，可以实现工艺复杂性的显着降低。 此外，可以通过提供适当设计的压印模具来提高压印光刻的灵活性和效率，以便提供表现出增加的填充能力的通孔开口和沟槽，从而也提高了最终获得的金属化结构在可靠性，抗性 电迁移等。