Stencil apparatus for applying solder paste
    1.
    发明授权
    Stencil apparatus for applying solder paste 失效
    用于涂抹焊膏的模板装置

    公开(公告)号:US5669970A

    公开(公告)日:1997-09-23

    申请号:US458710

    申请日:1995-06-02

    摘要: A stencil for applying solder paste in a desired pattern for mounting electronic components on a surface of a circuit board, said stencil including a sheet having holes therethrough in a pattern corresponding to the desired pattern, a smooth upper surface for receiving the solder paste thereon, and a smooth lower surface for contacting the surface of the circuit board, the upper surface having relieved portions so as to increase the friction between the upper surface and the solder paste being squeegeed thereover.

    摘要翻译: 一种用于以期望的图案施加焊膏以将电子部件安装在电路板的表面上的模板,所述模板包括具有穿过其中的孔的片材,其中图案对应于所需图案,用于在其上接收焊膏的光滑的上表面, 以及用于与电路板的表面接触的光滑的下表面,上表面具有释放部分,以便增加上表面和焊膏之间的摩擦。

    MATERIAL DEPOSITION SYSTEM FOR DEPOSITING MATERIALS ON A SUBSTRATE
    2.
    发明申请
    MATERIAL DEPOSITION SYSTEM FOR DEPOSITING MATERIALS ON A SUBSTRATE 审中-公开
    用于在基材上沉积材料的材料沉积系统

    公开(公告)号:US20130133574A1

    公开(公告)日:2013-05-30

    申请号:US13306115

    申请日:2011-11-29

    IPC分类号: B05C5/02 B05C11/00

    摘要: A material deposition system for depositing materials on an electronic substrate with a material deposition system is disclosed. The deposition system includes a frame, a gantry system coupled to the frame, a deposition head coupled to the gantry system and configured to deposit dots of low viscous and semi-viscous material on the electronic substrate, and a controller configured to control the operation of the material deposition system, including the operation of the gantry system and the deposition head. The system is capable of depositing a line or a pattern of material on the electronic substrate by moving the deposition head along an axis of motion that is substantially non-parallel to a direction of the line or pattern. Other deposition systems and methods are further disclosed.

    摘要翻译: 公开了一种用材料沉积系统在电子衬底上沉积材料的材料沉积系统。 沉积系统包括框架,连接到框架的台架系统,耦合到台架系统并构造成在电子基板上沉积低粘度和半粘性材料的点的沉积头,以及控制器,其被配置为控制 材料沉积系统,包括龙门架系统和沉积头的操作。 该系统能够通过沿着基本上不平行于线或图案的方向的运动轴移动沉积头来在电子衬底上沉积线或图案材料。 进一步公开了其它沉积系统和方法。

    Systems for detecting defects in printed solder paste
    4.
    发明授权
    Systems for detecting defects in printed solder paste 有权
    用于检测印刷焊膏缺陷的系统

    公开(公告)号:US07310438B2

    公开(公告)日:2007-12-18

    申请号:US11479076

    申请日:2006-06-30

    申请人: David P. Prince

    发明人: David P. Prince

    IPC分类号: G06K9/00

    摘要: A method of inspecting a stencil having apertures through which a substance is deposited onto an electronic substrate includes depositing the substance through the stencil and onto the substrate, capturing a first image of the stencil after the deposit of the substance and detecting variations in texture of the substance in the first image, capturing a second image of the electronic substrate having the substance on its surface and detecting variations in texture of the substance in the second image, defining a region of interest in the first image and in the second image to determine whether at least one feature exists in the region of interest, measuring a first span of the at least one feature in the region of interest in the first image and a second span of the at least one feature in the region of interest in the second image, and correlating the first span of the at least one feature and the second span of the at least one feature to determine whether a threshold span of the at least one feature has been reached.

    摘要翻译: 检查具有孔的模板的方法,物质沉积在电子基板上,包括通过模板沉积物质并沉积到基底上,在沉积物质之后捕获模板的第一图像并检测物质的变化 在第一图像中捕获物质,捕获在其表面上具有物质的电子基板的第二图像,并检测第二图像中的物质的质地变化,限定第一图像和第二图像中的感兴趣区域,以确定是否 在感兴趣的区域中存在至少一个特征,测量第一图像中的感兴趣区域中的至少一个特征的第一跨度,以及第二图像中感兴趣区域中的至少一个特征的第二跨度, 以及将所述至少一个特征的所述第一跨度与所述至少一个特征的所述第二跨度相关联以确定所述至少一个特征的阈值跨度是否为 东方功能已经达到。

    Systems and methods for detecting defects in printed solder paste
    5.
    发明授权
    Systems and methods for detecting defects in printed solder paste 有权
    用于检测印刷焊膏缺陷的系统和方法

    公开(公告)号:US07149344B2

    公开(公告)日:2006-12-12

    申请号:US11091986

    申请日:2005-03-29

    申请人: David P. Prince

    发明人: David P. Prince

    IPC分类号: G06K9/00

    摘要: A method of analyzing an image of a substance deposited onto a substrate, the image comprising a plurality of pixels, includes defining a region of interest in the image, associating the region of interest with first and second perpendicular axis, wherein a set of pixels in the image lie along the first axis, converting the pixels in the region of interest to a single dimensional array aligned with the first axis and projecting along the second axis, and applying at least one threshold to the single dimensional array, the threshold based at least in part on a predetermined limit.

    摘要翻译: 一种分析沉积在基底上的物质的图像的方法,所述图像包括多个像素,包括在图像中限定感兴趣区域,将感兴趣区域与第一和第二垂直轴相关联,其中,一组像素在 图像沿着第一轴线位于第一轴上,将感兴趣区域中的像素转换为与第一轴对齐并且沿着第二轴线突出的单维阵列,并且将至少一个阈值应用于单维阵列,该阈值至少基于 部分地在预定的限制上。

    Color-based linear three dimensional acquisition system and method
    6.
    发明授权
    Color-based linear three dimensional acquisition system and method 有权
    基于颜色的线性三维采集系统及方法

    公开(公告)号:US08939074B2

    公开(公告)日:2015-01-27

    申请号:US13796512

    申请日:2013-03-12

    申请人: David P. Prince

    发明人: David P. Prince

    摘要: A system and method for capturing three-dimensional image data for inspection, alignment and operations of a material applicator includes an imaging system configured to capture three-dimensional image data of an electronic substrate. The imaging system includes one or more illumination assembly configured to project a spectrum of light substantially along a first axis at an angle to the surface of the electronic substrate. The imaging system further includes an image sensor assembly configured to detect the spectrum of light reflected from an electronic substrate surface, with the image sensor assembly including a viewing plane. The material application includes a controller that is coupled to the imaging system. The controller is configured to control movement of the imaging system and to communicate with the image sensor assembly to produce a three-dimensional image of the topology of the electronic substrate.

    摘要翻译: 用于捕获三维图像数据以用于材料施加器的检查,对准和操作的系统和方法包括被配置为捕获电子基板的三维图像数据的成像系统。 该成像系统包括一个或多个照明组件,该照明组件配置成基本上沿着与电子衬底的表面成一定角度的第一轴线投影光谱。 成像系统还包括图像传感器组件,其被配置为检测从电子衬底表面反射的光的光谱,图像传感器组件包括观察平面。 材料应用包括耦合到成像系统的控制器。 控制器被配置为控制成像系统的移动并与图像传感器组件通信以产生电子基板的拓扑的三维图像。

    COLOR-BASED LINEAR THREE DIMENSIONAL ACQUISITION SYSTEM AND METHOD
    7.
    发明申请
    COLOR-BASED LINEAR THREE DIMENSIONAL ACQUISITION SYSTEM AND METHOD 有权
    基于颜色的线性三维采集系统和方法

    公开(公告)号:US20140272103A1

    公开(公告)日:2014-09-18

    申请号:US13796512

    申请日:2013-03-12

    申请人: David P. Prince

    发明人: David P. Prince

    IPC分类号: H05K3/22

    摘要: A system and method for capturing three-dimensional image data for inspection, alignment and operations of a material applicator includes an imaging system configured to capture three-dimensional image data of an electronic substrate. The imaging system includes one or more illumination assembly configured to project a spectrum of light substantially along a first axis at an angle to the surface of the electronic substrate. The imaging system further includes an image sensor assembly configured to detect the spectrum of light reflected from an electronic substrate surface, with the image sensor assembly including a viewing plane. The material application includes a controller that is coupled to the imaging system. The controller is configured to control movement of the imaging system and to communicate with the image sensor assembly to produce a three-dimensional image of the topology of the electronic substrate.

    摘要翻译: 用于捕获三维图像数据以用于材料施加器的检查,对准和操作的系统和方法包括被配置为捕获电子基板的三维图像数据的成像系统。 该成像系统包括一个或多个照明组件,该照明组件配置成基本上沿着与电子衬底的表面成一定角度的第一轴线投影光谱。 成像系统还包括图像传感器组件,其被配置为检测从电子衬底表面反射的光的光谱,图像传感器组件包括观察平面。 材料应用包括耦合到成像系统的控制器。 控制器被配置为控制成像系统的移动并与图像传感器组件通信以产生电子基板的拓扑的三维图像。

    Off-axis illumination assembly and method
    8.
    发明授权
    Off-axis illumination assembly and method 有权
    离轴照明组件及方法

    公开(公告)号:US07458318B2

    公开(公告)日:2008-12-02

    申请号:US11345432

    申请日:2006-02-01

    申请人: David P. Prince

    发明人: David P. Prince

    IPC分类号: B05C17/04

    摘要: A stencil printer is provided for depositing solder paste onto a surface of an electronic substrate. The stencil printer includes a frame and a stencil coupled to the frame. The stencil has a plurality of apertures formed therein. The stencil printer further includes a dispenser coupled to the frame. The stencil and the dispenser are adapted to deposit solder paste onto the electronic substrate. The stencil printer further includes an imaging system constructed and arranged to capture an image of the electronic substrate. The imaging system includes a camera assembly, an on-axis illumination assembly adapted to generate light substantially along a first axis generally perpendicular to the surface of the electronic substrate, and an off-axis illumination assembly adapted to generate rays of light substantially along a second axis extending at an angle with respect to the first axis. A controller is coupled to the imaging system to control movement of the imaging system to capture an image.

    摘要翻译: 提供了一种用于将焊膏沉积到电子基板的表面上的模版印刷机。 模板印刷机包括框架和联接到框架的模板。 模板具有形成在其中的多个孔。 模板印刷机还包括耦合到框架的分配器。 模板和分配器适于将焊膏沉积到电子基板上。 模板印刷机还包括构造和布置成捕获电子基板的图像的成像系统。 成像系统包括相机组件,适于基本上沿着大致垂直于电子基板的表面的第一轴产生光的轴上照明组件,以及适于基本上沿着第二部分产生光线的离轴照明组件 轴线相对于第一轴线成一定角度延伸。 控制器耦合到成像系统以控制成像系统的移动以捕获图像。

    Single and multi-spectral illumination system and method
    9.
    发明申请
    Single and multi-spectral illumination system and method 有权
    单光谱和多光谱照明系统及方法

    公开(公告)号:US20080197170A1

    公开(公告)日:2008-08-21

    申请号:US11707757

    申请日:2007-02-16

    申请人: David P. Prince

    发明人: David P. Prince

    IPC分类号: H01R43/00

    摘要: A stencil printer apparatus for depositing a solder paste onto the surface of the electronic substrate, comprising a frame, a stencil coupled to the frame, the stencil having a plurality of apertures, a dispenser coupled to the frame, the stencil and the dispenser being configured to deposit the solder paste onto the electronic substrate, an imaging system constructed and arranged to capture an image of the electronic substrate, and a controller coupled to the imaging system and configured to control movement of the imaging system to capture the image. The imaging system comprises a camera element configured to capture the image of at least the portion of the surface of the electronic substrate, and a first illumination element comprising a long-wavelength light source configured to illuminate at least the portion of the surface of the electronic substrate by generating long-wavelength light. Other embodiments and methods are disclosed.

    摘要翻译: 一种用于将焊膏沉积到电子基板的表面上的模版印刷装置,包括框架,耦合到框架的模板,具有多个孔的模板,耦合到框架的分配器,模板和分配器被配置 将所述焊膏沉积到所述电子基板上,所述成像系统被构造和布置成捕获所述电子基板的图像;以及控制器,耦合到所述成像系统并被配置为控制所述成像系统的拍摄以捕获图像。 成像系统包括被配置为捕获电子基板的表面的至少一部分的图像的相机元件,以及第一照明元件,其包括长波长光源,该长波长光源被配置为照亮电子基板的表面的至少一部分 底物通过产生长波长的光。 公开了其他实施例和方法。

    Method and apparatus for detecting solder paste deposits on substrates
    10.
    发明授权
    Method and apparatus for detecting solder paste deposits on substrates 有权
    用于检测基板上的焊膏沉积物的方法和装置

    公开(公告)号:US06738505B1

    公开(公告)日:2004-05-18

    申请号:US09304699

    申请日:1999-05-04

    申请人: David P. Prince

    发明人: David P. Prince

    IPC分类号: G06K900

    摘要: The invention relates to a method and apparatus for inspecting a substrate having a substance deposited thereon. The steps of the method include depositing the substance onto the substrate; capturing an image of the substrate; detecting variations in texture in the image to determine a location of the substance on the substrate; and comparing the location of the substance with a desired location. The apparatus includes a screen printer that dispenses a substance at a predetermined location on a substrate, and a machine vision inspection system that includes texture based recognition of the substance.

    摘要翻译: 本发明涉及一种用于检查其上沉积有物质的基板的方法和装置。 该方法的步骤包括将物质沉积到基底上; 拍摄基板的图像; 检测图像中纹理的变化以确定物质在基底上的位置; 并将物质的位置与期望的位置进行比较。 该装置包括:丝网印刷机,其在基板上的预定位置处分配物质;以及机器视觉检查系统,其包括基于物质的基于纹理的识别。