公开(公告)号：US11406007B2

公开(公告)日：2022-08-02

申请号：US16794487

申请日：2020-02-19

Applicant: Raytheon Company

Inventor： Christopher M. Laighton ,  Susan C. Trulli ,  Elicia K. Harper

IPC: H01L23/367 ,  H05K1/02

Abstract: A radio frequency (RF) energy transmission line transition for coupling RF energy between a pair of RF transmission line sections disposed on intersecting surfaces of a corresponding one of a pair of conductive members, a first one of the pair of conductive members having a wall with a jog therein for receiving an end portion of a second one of the pair of conductive members, the end portion of an electrically conductive strip of the first one of the pair of radio frequency transmission line sections being disposed on, and electrically connected to, an electrically conductive strip of a second one of the pair of radio frequency transmission line sections.

公开(公告)号：US20210006213A1

公开(公告)日：2021-01-07

申请号：US16458902

申请日：2019-07-01

Applicant: Raytheon Company

Inventor： Christopher M. Laighton ,  Susan C. Trulli ,  Elicia K. Harper

IPC: H03F3/21 ,  H03F1/32

Abstract: A power amplifier having: a plurality of N amplifier modules, where N is an integer greater than one; an M:N power splitter having M inputs, where M is an integer less than N, and N outputs, each one of the N outputs being coupled to an input of a corresponding one of the plurality of N power amplifiers; a plurality of M delay lines, each one the M delay lines having an output coupled to a corresponding one of the M inputs of the M:N power splitter, each one of the plurality of M delay lines being coupled to a common input of the power amplifier.

公开(公告)号：US10321555B1

公开(公告)日：2019-06-11

申请号：US16121007

申请日：2018-09-04

Applicant: Raytheon Company

Inventor： Susan C. Trulli ,  Christopher M. Laighton ,  Elicia K. Harper

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H01P3/08 ,  H05K1/11

Abstract: An RF circuit module having RF and DC contacts on a surface of a circuit board. An RF component having RF and DC contacts is disposed in a cavity of the circuit board. Electrical connectors bridge the cavity to connect the RF contacts on the circuit board to the RF contacts on the RE component and the DC, contacts on the circuit board to the DC contacts on the RF component. A plug member is disposed in the cavity which has a dielectric member with an outer portion disposed over the RF and DC contacts on the circuit board and an inner portion elevated above the RF and DC contacts the RF component. The plug member has one portion of electrical conductors disposed on an upper surface of the inner portion and another portion disposed under the outer portion on, and electrically connected to, the DC contacts on the circuit board.

公开(公告)号：US20170271281A1

公开(公告)日：2017-09-21

申请号：US15201905

申请日：2016-07-05

Applicant: Raytheon Company

Inventor： Istvan Rodriguez ,  Christopher M. Laighton ,  Alan J. Bielunis

IPC: H01L23/66 ,  H03F3/195 ,  H01L27/088 ,  H01L23/48 ,  H01L29/20

CPC classification number: H01L23/66 ,  G01S7/03 ,  G01S7/032 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5228 ,  H01L23/647 ,  H01L28/20 ,  H01L29/2003 ,  H01L29/4175 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6655 ,  H01L2223/6661 ,  H01L2223/6683 ,  H03F3/195 ,  H03F2200/105 ,  H03F2200/211 ,  H03F2200/294 ,  H03F2200/451

Abstract: A microwave amplifier having a field effect transistor formed on an upper surface of a substrate. A de-Q'ing section connected to the field effect transistor includes: a de-Q'ing resistive via that passes through the substrate; and a de-Q'ing capacitor having one plate thereof connected a ground plane conductor through the de-Q'ing resistive via.

公开(公告)号：US10709011B2

公开(公告)日：2020-07-07

申请号：US15884756

申请日：2018-01-31

Applicant: Raytheon Company

Inventor： Susan C. Trulli ,  Christopher M. Laighton ,  Elicia K. Harper

IPC: H05K1/02 ,  G06F1/18 ,  H05K9/00 ,  H01R13/719 ,  H01R13/6599 ,  H01R24/50 ,  H01R9/05 ,  H01P5/08 ,  H01R13/6584 ,  H01R24/44 ,  H01R12/72

Abstract: An electrically conductive shield for a microwave transmission line-electrical connector interconnect region wherein the microwave transmission line is connected to the electrical connector. An elastic, dielectric material is disposed between opposing surfaces of the dielectric structure and the housing. An electrically conductive material is disposed on an outer surface of the elastic, dielectric material to provide an electrically conductive shield. The electrically conductive shield is disposed over the opposing surfaces of the dielectric structure and the housing.

公开(公告)号：US10374280B2

公开(公告)日：2019-08-06

申请号：US15621150

申请日：2017-06-13

Applicant: Raytheon Company

Inventor： Christopher M. Laighton ,  Susan C. Trulli ,  Elicia K. Harper

IPC: H01P5/18 ,  H01P5/12

Abstract: A quadrature coupler having: a pair of overlying strip conductors separated by a first dielectric layer to provide a coupling region between the coupling region of overlying strip conductors; a pair of opposing ground pads, the coupling region being disposed between the pair of opposing ground pads; a second dielectric layer disposed over the coupling region and between the pair of opposing ground pads; and an electrically conductive shield layer disposed over the second dielectric layer, extending over opposing sides of the dielectric layer and onto the pair of opposing ground pads. Portions of coupler are formed by printing or additive manufacturing.

公开(公告)号：US10158156B2

公开(公告)日：2018-12-18

申请号：US15187219

申请日：2016-06-20

Applicant: Raytheon Company

Inventor： Christopher M. Laighton ,  Edward A. Watters ,  Keith R. Kessler

IPC: H01P3/00 ,  H01P11/00 ,  H05K1/02

Abstract: A microwave transmission line having a coplanar waveguide and a pair of conductive members, each one of the pair of conductive members having a proximal end disposed on a portion of a corresponding one of a pair of ground plane conductors of the coplanar waveguide and a distal end disposed over, and vertically spaced from, a region between a center conductor of the coplanar waveguide and a corresponding one of the pair of ground plane conductors of the coplanar waveguide. The distal ends are laterally separated from each other by a region disposed over the center conductor.

公开(公告)号：US20180358675A1

公开(公告)日：2018-12-13

申请号：US15615984

申请日：2017-06-07

Applicant: Raytheon Company

Inventor： Christopher M. Laighton ,  Susan C. Trulli ,  Elicia K. Harper

IPC: H01P3/00 ,  H01P3/02

CPC classification number: H01P3/006 ,  G02F1/2257 ,  H01P3/003 ,  H01P3/026 ,  H01P3/06

Abstract: A microwave transmission line structure having a pair of ground strip conductors on a surface of a dielectric substrate structure. A signal strip conductor is disposed on the surface of the dielectric substrate structure between the pair of ground strip conductors. A solid dielectric layer is disposed over: the signal strip conductor; the upper surface of the dielectric substrate structure between sides of each one of the ground strip conductors; and the signal strip conductor. An electrically conductive shield member is disposed on the solid dielectric layer and on, and in direct contact with, upper surfaces of the pair of ground strip conductors. The structure is used on each one of a plurality of proximate microwave transmission lines formed on the substrate structure to electrically isolate the transmission line.

公开(公告)号：US20170293017A1

公开(公告)日：2017-10-12

申请号：US15094439

申请日：2016-04-08

Applicant: Raytheon Company

Inventor： Steven C. Evangelista ,  Christopher M. Laighton ,  Anthony J. Silva

IPC: G01S7/03

CPC classification number: G01S7/034 ,  G01S7/032

Abstract: A transmit/receive module having a switch, a load and a controller for coupling radar energy fed to switch to the load during a time interval subsequent to the controller producing a transmit enable signal to the transmit/receive module and prior to the controller producing a receive enable signal to the transmit/receive module.

公开(公告)号：US20170162958A1

公开(公告)日：2017-06-08

申请号：US15201851

申请日：2016-07-05

Applicant: Raytheon Company

Inventor： Christopher M. Laighton ,  Istvan Rodriguez ,  Alan J. Bielunis

IPC: H01R12/70 ,  H01R24/50 ,  H01R43/02

CPC classification number: H01R24/50 ,  H01R13/6596 ,  H01R2103/00

Abstract: A high power RF connector receptacle having a solder able pin, an outer connector receptacle shell and a high breakdown voltage dielectric such as Silicon Carbide. The connector receptacle can be completed as a stepped process where the Silicon Carbide substrate can be mounted to the package, the pin can be dropped into place and soldered, and then the outer shell can be soldered onto the SiC substrate. Alternatively, the SiC, pin and outer shell can be assembled as a subassembly and then soldered to the package. The combination of SiC and solder gives a hermetic seal to the package. In addition, the SiC has an extraordinarily high dielectric breakdown voltage for high power connections,