公开(公告)号：US20180129267A1

公开(公告)日：2018-05-10

申请号：US15863155

申请日：2018-01-05

Applicant: QUALCOMM Incorporated

Inventor： Michael BRUNOLLI ,  Stephen THILENIUS ,  Patrick ISAKANIAN ,  Vaishnav Srinivas

IPC: G06F1/32 ,  H04L25/02 ,  G11C11/4074 ,  G11C7/10 ,  G06F13/42 ,  G06F13/40 ,  G06F13/16

CPC classification number: G06F1/3275 ,  G06F1/32 ,  G06F1/3209 ,  G06F1/3287 ,  G06F1/3296 ,  G06F13/16 ,  G06F13/4086 ,  G06F13/4243 ,  G11C7/1072 ,  G11C11/4074 ,  H04L25/0264 ,  H04L25/0278 ,  Y02D10/14 ,  Y02D10/172 ,  Y02D50/20

Abstract: A memory interface includes: a pull-up device and a pull-down device, wherein the pull-up device couples between a power rail and a data line, and wherein the pull-down device couples between the data line and ground; and a power supply configured to supply a first power supply voltage to the power rail during a terminated data transmission mode in which a receiving memory interface coupled to the data line has an active on-die termination, and wherein the power supply is further configured to supply a second power supply voltage to the power rail during an unterminated data transmission mode in which the on-die termination does not load the data line, the second power supply voltage being less than the first power supply voltage.