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公开(公告)号:US10943084B2
公开(公告)日:2021-03-09
申请号:US16502962
申请日:2019-07-03
Applicant: QUALCOMM Incorporated
IPC: G06K9/22 , G06K9/00 , H01L41/113 , H01L41/047 , G06F3/041
Abstract: Techniques described herein address these and other issues by providing an under-display sensor capable of providing fingerprint scanning over an entire display using optical and/or ultrasonic means. To do so, the sensor comprises an array of pixels, where each can pixel comprises a piezoelectric sensor element and a diode capable of being used as a photodetector during a light-sensing mode, and as a peak detector during a pressure-sensing mode. The sensor may further comprise a piezoelectric layer and one or more electrodes, which can generate a pressure wave during the pressure sensing mode.
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公开(公告)号:US10929636B2
公开(公告)日:2021-02-23
申请号:US16252408
申请日:2019-01-18
Applicant: QUALCOMM Incorporated
Inventor: Yipeng Lu , Hrishikesh Vijaykumar Panchawagh , Kostadin Dimitrov Djordjev , Chin-Jen Tseng , Nicholas Ian Buchan , Tsongming Kao , Jae Hyeong Seo
IPC: G06K9/00
Abstract: An ultrasonic fingerprint sensor system of the present disclosure may be provided with a thick electrically nonconductive acoustic layer and thin electrode layer coupled to a piezoelectric layer of an ultrasonic transmitter or transceiver. The thick electrically nonconductive acoustic layer may have a high density or high acoustic impedance value, and may be adjacent to the piezoelectric layer. The thin electrode layer may be divided into electrode segments. The ultrasonic fingerprint sensor system may use flexible or rigid substrates, and may use an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.
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公开(公告)号:US20180198055A1
公开(公告)日:2018-07-12
申请号:US15837922
申请日:2017-12-11
Applicant: QUALCOMM Incorporated
Inventor: Fan Zhong , Jack Conway Kitchens, II , Leonard Eugene Fennell , Nicholas Ian Buchan
IPC: H01L41/257 , H01L41/053 , H01L41/18
CPC classification number: H01L41/257 , H01L41/053 , H01L41/18 , H01L41/1871 , H01L41/1873 , H01L41/1876 , H01L41/1878 , H01L41/193
Abstract: Disclosed are methods, devices, apparatuses, and systems for poling a piezoelectric film. A poling system can be a corona poling system including a corona source with one or more corona wires configured to transfer a corona discharge onto a major surface of the piezoelectric film. The poling system can further include a grid electrode interposed between the corona source and the piezoelectric film. A substrate including the piezoelectric film may be supported on a substrate support, where the substrate and the corona source are configured to move relative to each other during poling.
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公开(公告)号:US20170323130A1
公开(公告)日:2017-11-09
申请号:US15149043
申请日:2016-05-06
Applicant: QUALCOMM Incorporated
Inventor: Timothy Alan Dickinson , Nicholas Ian Buchan , David William Burns , John Keith Schneider , Muhammed Ibrahim Sezan
CPC classification number: G06K9/0002 , A61B8/02 , A61B8/145 , A61B8/4227 , A61B8/4236 , A61B8/5207 , A61B8/54 , A61B8/56 , G01S7/52036 , G01S7/52079 , G01S7/52084 , G01S7/52085 , G01S15/8913 , G01S15/8915 , G06F21/32 , G06K9/00026 , G06K9/0012 , G06K9/00885 , G06K2009/00932 , H04L63/0861 , H04W12/06 , H04W88/02
Abstract: An apparatus may include an ultrasonic receiver array, an ultrasonic transmitter and a control system capable of controlling the ultrasonic transmitter to transmit first ultrasonic waves in a first direction and to simultaneously transmit second ultrasonic waves in a second direction that is opposite the first direction. The control system may be capable of distinguishing first reflected waves from second reflected waves, the first reflected waves corresponding to reflections of the first ultrasonic waves that are received by the ultrasonic receiver array and the second reflected waves corresponding to reflections of the second ultrasonic waves that are received by the ultrasonic receiver array. The control system may be capable of determining first image data corresponding to the first reflected waves and of determining second image data corresponding to the second reflected waves.
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公开(公告)号:US11275923B2
公开(公告)日:2022-03-15
申请号:US16751849
申请日:2020-01-24
Applicant: QUALCOMM Incorporated
Inventor: Nicholas Ian Buchan , Sandeep Louis D'Souza , Jessica Liu Strohmann , Hrishikesh Vijaykumar Panchawagh
IPC: G06K9/28 , G06K9/00 , G06F21/32 , G06K9/46 , G06K9/38 , G01N29/24 , G06F3/01 , G06F3/043 , H01L41/08
Abstract: An apparatus may include an ultrasonic sensor system, a low-frequency vibration source and a control system. The ultrasonic sensor system may include an ultrasonic receiver and an ultrasonic transmitter configured for transmitting ultrasonic waves in a first frequency range (e.g., 1 MHz to 30 MHz). The low-frequency vibration source may be configured for generating low-frequency vibrations in a second frequency range (e.g., the range of 5 Hz to 2000 Hz). The control system may be configured for synchronizing the generation of the first low-frequency vibrations and the transmission of the first ultrasonic waves.
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公开(公告)号:US20220004728A1
公开(公告)日:2022-01-06
申请号:US16946717
申请日:2020-07-01
Applicant: QUALCOMM Incorporated
Inventor: Jessica Liu Strohmann , Hrishikesh Vijaykumar Panchawagh , Nicholas Ian Buchan , Yipeng Lu , Kostadin Dimitrov Djordjev
Abstract: An ultrasonic sensor system may include an ultrasonic transceiver layer, a thin-film transistor (TFT) layer proximate a first side of the ultrasonic transceiver layer, a frequency-splitting layer proximate a second side of the ultrasonic transceiver layer and a high-impedance layer proximate the frequency-splitting layer. The frequency-splitting layer may reside between the ultrasonic transceiver layer and the high-impedance layer. The high-impedance layer may have a higher acoustic impedance than the frequency-splitting layer.
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公开(公告)号:US11087108B2
公开(公告)日:2021-08-10
申请号:US16691416
申请日:2019-11-21
Applicant: QUALCOMM Incorporated
Inventor: Jack Conway Kitchens , John Keith Schneider , Stephen Michael Gojevic , Evan Michael Breloff , James Anthony Miranto , Emily Kathryn Brooks , Fitzgerald John Archibald , Alexei Stoianov , Raj Kumar , Sai Praneeth Sreeram , Nirma Lnu , Sandeep Louis D'Souza , Nicholas Ian Buchan , Yipeng Lu , Chin-Jen Tseng , Hrishikesh Vijaykumar Panchawagh
Abstract: An apparatus may include a cover layer, a layer of first metamaterial proximate (or in) the cover layer, a light source system configured for providing light to the layer of first metamaterial and a receiver system. The first metamaterial may include nanoparticles configured to create ultrasonic waves when illuminated by light. The receiver system may include an ultrasonic receiver system configured to receive ultrasonic waves reflected from a target object in contact with, or proximate, a surface of the cover layer. The control system may be configured to receive ultrasonic receiver signals from the ultrasonic receiver system corresponding to the ultrasonic waves reflected from the target object and to perform an authentication process and/or an imaging process that is based, at least in part, on the ultrasonic receiver signals.
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公开(公告)号:US20200234021A1
公开(公告)日:2020-07-23
申请号:US16252408
申请日:2019-01-18
Applicant: QUALCOMM Incorporated
Inventor: Yipeng Lu , Hrishikesh Vijaykumar Panchawagh , Kostadin Dimitrov Djordjev , Chin-Jen Tseng , Nicholas Ian Buchan , Tsongming Kao , Jae Hyeong Seo
IPC: G06K9/00
Abstract: An ultrasonic fingerprint sensor system of the present disclosure may be provided with a thick electrically nonconductive acoustic layer and thin electrode layer coupled to a piezoelectric layer of an ultrasonic transmitter or transceiver. The thick electrically nonconductive acoustic layer may have a high density or high acoustic impedance value, and may be adjacent to the piezoelectric layer. The thin electrode layer may be divided into electrode segments. The ultrasonic fingerprint sensor system may use flexible or rigid substrates, and may use an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.
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公开(公告)号:US20170364726A1
公开(公告)日:2017-12-21
申请号:US15430389
申请日:2017-02-10
Applicant: QUALCOMM Incorporated
Inventor: Nicholas Ian Buchan , Mario Francisco Velez , Chin-Jen Tseng , Hrishikesh Vijaykumar Panchawagh , Firas Sammoura , Jessica Liu Strohmann , Kostadin Dimitrov Djordjev , David Williams Burns , Leonard Eugene Fennell , Jon Gregory Aday
IPC: G06K9/00 , H01L41/107 , H01L41/047 , G02F1/1333 , H01L27/32
CPC classification number: G06K9/0002 , G01N29/22 , G01N29/2437 , G02F1/13338 , H01L27/323 , H01L41/047 , H01L41/107
Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.
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公开(公告)号:US11281881B2
公开(公告)日:2022-03-22
申请号:US16867482
申请日:2020-05-05
Applicant: QUALCOMM Incorporated
IPC: G06K9/00
Abstract: An apparatus may include an ultrasonic sensor system, a Coulomb force apparatus and a control system. The control system may be configured for controlling the Coulomb force apparatus for application of a Coulomb force to a digit in contact with an outer surface of the apparatus in a fingerprint sensor area and for controlling the ultrasonic fingerprint sensor for transmission of first ultrasonic waves towards the digit. The control system may be configured for synchronizing the application of the Coulomb force and the transmission of the first ultrasonic waves. The control system may be configured for receiving ultrasonic receiver signals from the ultrasonic fingerprint sensor and for performing an authentication process based, at least in part, on the ultrasonic receiver signals. The ultrasonic receiver signals may, in some instances, include signals corresponding to reflections of the first ultrasonic waves from the digit.
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